JPH0381634U - - Google Patents
Info
- Publication number
- JPH0381634U JPH0381634U JP14319289U JP14319289U JPH0381634U JP H0381634 U JPH0381634 U JP H0381634U JP 14319289 U JP14319289 U JP 14319289U JP 14319289 U JP14319289 U JP 14319289U JP H0381634 U JPH0381634 U JP H0381634U
- Authority
- JP
- Japan
- Prior art keywords
- slit
- thermocompression bonding
- bonding head
- terminal array
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920002379 silicone rubber Polymers 0.000 claims description 4
- 239000004945 silicone rubber Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims 1
- 230000003068 static effect Effects 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Description
第１図はこの考案の一実施例による熱圧着ヘツ
ドを示す斜視図、第２図は第１図の導電性シリコ
ーンゴムの形成方法の一例を示す断面構成図、第
３図は従来の熱圧着ヘツドを示す斜視図である。
図において、１……金属製熱圧着ヘツド、２ａ
……非導電性シリコーンゴム、２ｂ……導電性シ
リコーンゴム、３……耐熱性接着材、５……スリ
ツト、６……樹脂流出防止板である。なお、図中
、同一符号は同一または相当部分を示す。
Fig. 1 is a perspective view showing a thermocompression bonding head according to an embodiment of the invention, Fig. 2 is a sectional view showing an example of the method of forming the conductive silicone rubber of Fig. 1, and Fig. 3 is a conventional thermocompression bonding head. FIG. 3 is a perspective view showing the head. In the figure, 1...metal thermocompression bonding head, 2a
...Non-conductive silicone rubber, 2b...Conductive silicone rubber, 3...Heat-resistant adhesive, 5...Slit, 6...Resin outflow prevention plate. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
回路基板の端子列と、可とう性を有する接合部材
に形成された端子列とを接続する金属製熱圧着ヘ
ツドにおいて、上記金属製熱圧着ヘツドの圧着部
分に凹型形状のスリツトを設け、このスリツトに
適合する凸型形状に成形加工された導電性シリコ
ーンゴムを、上記スリツトにはめ込んで固定する
事を特徴とする熱圧着ヘツド。 In a metal thermocompression bonding head that connects a terminal array of a circuit board containing electronic components that are susceptible to damage by static electricity and a terminal array formed on a flexible bonding member, the crimp portion of the metal thermocompression bonding head described above A thermocompression bonding head characterized in that a concave slit is provided in the head, and conductive silicone rubber molded into a convex shape that fits the slit is fitted and fixed into the slit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14319289U JPH0381634U (en) | 1989-12-12 | 1989-12-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14319289U JPH0381634U (en) | 1989-12-12 | 1989-12-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0381634U true JPH0381634U (en) | 1991-08-21 |
Family
ID=31689987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14319289U Pending JPH0381634U (en) | 1989-12-12 | 1989-12-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0381634U (en) |
-
1989
- 1989-12-12 JP JP14319289U patent/JPH0381634U/ja active Pending