JPS5275127A - Light source for information reading unit - Google Patents

Light source for information reading unit

Info

Publication number
JPS5275127A
JPS5275127A JP15146675A JP15146675A JPS5275127A JP S5275127 A JPS5275127 A JP S5275127A JP 15146675 A JP15146675 A JP 15146675A JP 15146675 A JP15146675 A JP 15146675A JP S5275127 A JPS5275127 A JP S5275127A
Authority
JP
Japan
Prior art keywords
light source
reading unit
information reading
section
circumference section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15146675A
Other languages
Japanese (ja)
Inventor
Mikio Murozono
Shohei Fujiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP15146675A priority Critical patent/JPS5275127A/en
Publication of JPS5275127A publication Critical patent/JPS5275127A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

PURPOSE: To increase stability of various characteristics as well as dependability by raising utmost outer circumference section of substrate higher than the lead connected to luminescent element or element electrode section and further by forming the circumference section into a trapezoid which contains slant surface in its internal side in order to secure condensing of emitted light in forward direction.
COPYRIGHT: (C)1977,JPO&Japio
JP15146675A 1975-12-18 1975-12-18 Light source for information reading unit Pending JPS5275127A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15146675A JPS5275127A (en) 1975-12-18 1975-12-18 Light source for information reading unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15146675A JPS5275127A (en) 1975-12-18 1975-12-18 Light source for information reading unit

Publications (1)

Publication Number Publication Date
JPS5275127A true JPS5275127A (en) 1977-06-23

Family

ID=15519137

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15146675A Pending JPS5275127A (en) 1975-12-18 1975-12-18 Light source for information reading unit

Country Status (1)

Country Link
JP (1) JPS5275127A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS648761U (en) * 1987-07-03 1989-01-18
JPH0247069U (en) * 1988-09-28 1990-03-30
JPH07199829A (en) * 1993-12-28 1995-08-04 Harrison Denki Kk Light emitting unit and display device and illumination device
JP2009260233A (en) * 2008-04-17 2009-11-05 Samsung Electro Mech Co Ltd Sub-mount, light-emitting diode package, and manufacturing method of the package

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4944168B1 (en) * 1969-11-04 1974-11-27

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4944168B1 (en) * 1969-11-04 1974-11-27

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS648761U (en) * 1987-07-03 1989-01-18
JPH0247069U (en) * 1988-09-28 1990-03-30
JPH07199829A (en) * 1993-12-28 1995-08-04 Harrison Denki Kk Light emitting unit and display device and illumination device
JP2009260233A (en) * 2008-04-17 2009-11-05 Samsung Electro Mech Co Ltd Sub-mount, light-emitting diode package, and manufacturing method of the package
JP2012182482A (en) * 2008-04-17 2012-09-20 Samsung Led Co Ltd Sub-mount, light-emitting diode package, and manufacturing method of the same

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