JPS61111164U - - Google Patents
Info
- Publication number
- JPS61111164U JPS61111164U JP1984189885U JP18988584U JPS61111164U JP S61111164 U JPS61111164 U JP S61111164U JP 1984189885 U JP1984189885 U JP 1984189885U JP 18988584 U JP18988584 U JP 18988584U JP S61111164 U JPS61111164 U JP S61111164U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- heat sink
- light source
- illumination light
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 238000005286 illumination Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims 1
- 229920006015 heat resistant resin Polymers 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 238000000034 method Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Description
第１図は本考案に係る照明光源の一実施例を示
す断面図、第２図は同実施例における発光ダイオ
ードの基板への実装状態を示す斜視図、第３図ａ
〜ｃは同実施例の基板とヒートシンクの一体化過
程を説明する断面図、第４図は従来例を示す斜視
図である。
１１……基板、１２……発光ダイオード、１３
……ヒートシンク、２１……ポツテイング型、２
２……ヒートシンク材料としての樹脂。
Fig. 1 is a sectional view showing an embodiment of the illumination light source according to the present invention, Fig. 2 is a perspective view showing a state in which a light emitting diode is mounted on a substrate in the same embodiment, and Fig. 3a.
-c are cross-sectional views illustrating the process of integrating the substrate and heat sink of the same embodiment, and FIG. 4 is a perspective view showing a conventional example. 11...Substrate, 12...Light emitting diode, 13
... Heat sink, 21 ... Potting type, 2
2...Resin as a heat sink material.
Claims (1)
た基板にヒートシンクを取付けた照明光源におい
て、ヒートシンクをＳｉＣなど、熱伝導性の良好
な物質を混合したエポキシ樹脂などの耐熱性の高
い樹脂によりモールド成形し、その成形時に前記
基板を一体化したことを特徴とする照明光源。 In an illumination light source in which a heat sink is attached to a substrate on which a large number of light emitting diodes are arranged in predetermined positions, the heat sink is molded with a highly heat-resistant resin such as epoxy resin mixed with a material with good thermal conductivity such as SiC. , An illumination light source characterized in that the substrate is integrated at the time of molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984189885U JPS61111164U (en) | 1984-12-14 | 1984-12-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984189885U JPS61111164U (en) | 1984-12-14 | 1984-12-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61111164U true JPS61111164U (en) | 1986-07-14 |
Family
ID=30747333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984189885U Pending JPS61111164U (en) | 1984-12-14 | 1984-12-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61111164U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009289934A (en) * | 2008-05-29 | 2009-12-10 | Apic Yamada Corp | Semiconductor mounting substrate, and method of manufacturing the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5740963B2 (en) * | 1977-09-03 | 1982-08-31 |
-
1984
- 1984-12-14 JP JP1984189885U patent/JPS61111164U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5740963B2 (en) * | 1977-09-03 | 1982-08-31 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009289934A (en) * | 2008-05-29 | 2009-12-10 | Apic Yamada Corp | Semiconductor mounting substrate, and method of manufacturing the same |