JPS61174759U - - Google Patents

Info

Publication number
JPS61174759U
JPS61174759U JP5917985U JP5917985U JPS61174759U JP S61174759 U JPS61174759 U JP S61174759U JP 5917985 U JP5917985 U JP 5917985U JP 5917985 U JP5917985 U JP 5917985U JP S61174759 U JPS61174759 U JP S61174759U
Authority
JP
Japan
Prior art keywords
lead
base
emitting diode
constant current
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5917985U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5917985U priority Critical patent/JPS61174759U/ja
Publication of JPS61174759U publication Critical patent/JPS61174759U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の実施例に係る発光ダイオー
ドランプの概略断面図で、第２図は従来の発光ダ
イオードランプを説明するための概略断面図であ
る。 Ａ，Ｂ：リード基板、Ａ１，Ｂ１：基台、Ａ２
，Ａ２：リード片、Ｃ：発光ダイオード素子、Ｅ
：透光性樹脂、Ｊ：定電流ＩＣ、Ｋ：口金、Ｋ１
：接触子、Ｋ２：口金部、Ｓ：セラミツク基板、
Ｓ１：定電流ＩＣ入力端部、Ｓ２：定電流ＩＣ出
力端部、Ｓ３：定電流ＩＣ接地ライン端部、Ｔ：
エポキシ樹脂。 FIG. 1 is a schematic sectional view of a light emitting diode lamp according to an embodiment of the invention, and FIG. 2 is a schematic sectional view for explaining a conventional light emitting diode lamp. A, B: Lead board, A1, B1: Base, A2
, A2: Lead piece, C: Light emitting diode element, E
: Transparent resin, J: Constant current IC, K: Cap, K1
: Contact, K2: Base part, S: Ceramic substrate,
S1: Constant current IC input end, S2: Constant current IC output end, S3: Constant current IC ground line end, T:
Epoxy resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リード基板間に発光ダイオード素子を配設し、
前記リード基板のリード片の端部を外部に露呈し
て透光性樹脂にて一体成形するとともに、前記透
光性樹脂から露呈させたリード片の一方を電球口
金に接続し、さらにリード片の他方を前記口金下
端に口金と絶縁して設けた接触子に接続するよう
にしてなる発光ダイオードランプにおいて、前記
口金内に定電流ＩＣを搭載したセラミツク基板を
挿設し、前記セラミツク基板上の定電流ＩＣ出力
端部を前記リード基板のリード片に接続するとと
もに定電流ＩＣ入力端部を前記接触子に接続する
ようになし、かつ前記口金内を熱伝導性の良好な
樹脂材にて充填して構成したことを特徴とする発
光ダイオードランプ。 A light emitting diode element is arranged between the lead boards,
The ends of the lead pieces of the lead board are exposed to the outside and integrally molded with a translucent resin, one of the lead pieces exposed from the translucent resin is connected to a light bulb base, and the lead pieces are In a light emitting diode lamp, the other end is connected to a contact provided at the lower end of the base insulated from the base, and a ceramic substrate on which a constant current IC is mounted is inserted into the base, and the The output end of the current IC is connected to the lead piece of the lead board, and the input end of the constant current IC is connected to the contact, and the inside of the base is filled with a resin material having good thermal conductivity. A light-emitting diode lamp characterized in that it is configured with:
JP5917985U 1985-04-20 1985-04-20 Pending JPS61174759U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5917985U JPS61174759U (en) 1985-04-20 1985-04-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5917985U JPS61174759U (en) 1985-04-20 1985-04-20

Publications (1)

Publication Number Publication Date
JPS61174759U true JPS61174759U (en) 1986-10-30

Family

ID=30585364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5917985U Pending JPS61174759U (en) 1985-04-20 1985-04-20

Country Status (1)

Country Link
JP (1) JPS61174759U (en)

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