JPH03117845U - - Google Patents
Info
- Publication number
- JPH03117845U JPH03117845U JP2697490U JP2697490U JPH03117845U JP H03117845 U JPH03117845 U JP H03117845U JP 2697490 U JP2697490 U JP 2697490U JP 2697490 U JP2697490 U JP 2697490U JP H03117845 U JPH03117845 U JP H03117845U
- Authority
- JP
- Japan
- Prior art keywords
- outer frame
- tab
- lead frame
- terminals
- internal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000008188 pellet Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ，ｂは本考案の第１の実施例の正面図
及びＡ−Ａ′線断面図、第２図は本考案の第１の
実施例を用いた半導体装置の側面図、第３図ａ，
ｂは第２の実施例の正面図及びＢ−Ｂ′線断面図
、第４図ａ，ｂは従来のリードフレームの正面図
及びＣ−Ｃ′線断面図、第５図は従来のリードフ
レームを使用した半導体装置の側面図、第６図ａ
，ｂは従来の外部端子分離型リードフレームの正
面図及びＤ−Ｄ′線断面図である。
１……タブ、２Ａ……内部端子、２……外部端
子、３……タイバー、４……外枠、５……半導体
容器、６……端子間領域、７……切断部。
1A and 1B are a front view and a sectional view taken along line A-A' of the first embodiment of the present invention, FIG. 2 is a side view of a semiconductor device using the first embodiment of the present invention, and FIG. Figure a,
b is a front view and a cross-sectional view taken along the line B-B' of the second embodiment; FIGS. 4a and b are a front view and a cross-sectional view taken along the line C-C' of the conventional lead frame; and FIG. 5 is a conventional lead frame. Side view of a semiconductor device using
, b are a front view and a sectional view taken along the line D-D' of a conventional external terminal separated lead frame. DESCRIPTION OF SYMBOLS 1... Tab, 2A... Internal terminal, 2... External terminal, 3... Tie bar, 4... Outer frame, 5... Semiconductor container, 6... Area between terminals, 7... Cutting portion.
Claims (1)
辺部に形成された複数の内部端子と、この内部端
子と一体的に形成され外枠と接続するタイバーに
より連結された外部端子とを有するリードフレー
ムにおいて、前記外部端子の先端は前記外枠と分
離され、かつ外部端子間の前記タイバーは外枠と
接続されていることを特徴とするリードフレーム
。 A lead frame having a tab for mounting a semiconductor pellet, a plurality of internal terminals formed around the tab, and an external terminal formed integrally with the internal terminal and connected by a tie bar connected to an outer frame. . A lead frame, wherein the tips of the external terminals are separated from the outer frame, and the tie bars between the external terminals are connected to the outer frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2697490U JPH03117845U (en) | 1990-03-16 | 1990-03-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2697490U JPH03117845U (en) | 1990-03-16 | 1990-03-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03117845U true JPH03117845U (en) | 1991-12-05 |
Family
ID=31529849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2697490U Pending JPH03117845U (en) | 1990-03-16 | 1990-03-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03117845U (en) |
-
1990
- 1990-03-16 JP JP2697490U patent/JPH03117845U/ja active Pending