JPH03110874U - - Google Patents

Info

Publication number
JPH03110874U
JPH03110874U JP1965990U JP1965990U JPH03110874U JP H03110874 U JPH03110874 U JP H03110874U JP 1965990 U JP1965990 U JP 1965990U JP 1965990 U JP1965990 U JP 1965990U JP H03110874 U JPH03110874 U JP H03110874U
Authority
JP
Japan
Prior art keywords
sealed container
integrated circuit
hybrid integrated
board
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1965990U
Other languages
English (en)
Other versions
JPH0715149Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990019659U priority Critical patent/JPH0715149Y2/ja
Publication of JPH03110874U publication Critical patent/JPH03110874U/ja
Application granted granted Critical
Publication of JPH0715149Y2 publication Critical patent/JPH0715149Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【図面の簡単な説明】
第１図は本考案の実施例を示す要部拡大図、お
よび第２図は従来例を示す要部拡大図である。 １……第１の基板、２……第２の基板、３……
封止容器、４……回路素子、５……ネジ止め用穴
、５ａ……接着剤だめ部。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) ネジ止め穴を有し複数の回路素子が搭載さ
    れた第１の基板と前記第１の基板より大きく形成
    されその両端部に前記ネジ止め穴と対応する孔を
    備え且つ前記第１の基板と接着剤によつて接着さ
    れた第２の基板とを収納し固着一体化する混成集
    積回路の封止容器において、 前記封止容器のネジ止め穴の周辺を拡張し前記
    接着剤だめ部を設けたことを特徴とする混成集積
    回路の封止容器。 (2) 前記接着剤はシリコン樹脂を用いたことを
    特徴とする請求項１記載の混成集積回路の封止容
    器。 (3) 前記第１および第２の基板は絶縁処理され
    た金属基板を用いたことを特徴とする請求項１記
    載の混成集積回路の封止容器。
JP1990019659U 1990-02-28 1990-02-28 混成集積回路装置 Expired - Lifetime JPH0715149Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990019659U JPH0715149Y2 (ja) 1990-02-28 1990-02-28 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990019659U JPH0715149Y2 (ja) 1990-02-28 1990-02-28 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPH03110874U true JPH03110874U (ja) 1991-11-13
JPH0715149Y2 JPH0715149Y2 (ja) 1995-04-10

Family

ID=31522765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990019659U Expired - Lifetime JPH0715149Y2 (ja) 1990-02-28 1990-02-28 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPH0715149Y2 (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58147250U (ja) * 1982-03-26 1983-10-03 三菱電機株式会社 パツケ−ジ
JPS63204794A (ja) * 1987-02-20 1988-08-24 松下電器産業株式会社 キヤビネツト
JPS63253695A (ja) * 1987-04-10 1988-10-20 日本電気株式会社 電気機器用筐体の封止方法
JPS6461996A (en) * 1987-09-01 1989-03-08 Fujitsu Ltd Fixing method of printed board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58147250U (ja) * 1982-03-26 1983-10-03 三菱電機株式会社 パツケ−ジ
JPS63204794A (ja) * 1987-02-20 1988-08-24 松下電器産業株式会社 キヤビネツト
JPS63253695A (ja) * 1987-04-10 1988-10-20 日本電気株式会社 電気機器用筐体の封止方法
JPS6461996A (en) * 1987-09-01 1989-03-08 Fujitsu Ltd Fixing method of printed board

Also Published As

Publication number Publication date
JPH0715149Y2 (ja) 1995-04-10

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