JPH03110774U - - Google Patents

Info

Publication number
JPH03110774U
JPH03110774U JP1965890U JP1965890U JPH03110774U JP H03110774 U JPH03110774 U JP H03110774U JP 1965890 U JP1965890 U JP 1965890U JP 1965890 U JP1965890 U JP 1965890U JP H03110774 U JPH03110774 U JP H03110774U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
substrate
case material
circuit according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1965890U
Other languages
Japanese (ja)
Other versions
JP2526482Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1965890U priority Critical patent/JP2526482Y2/en
Publication of JPH03110774U publication Critical patent/JPH03110774U/ja
Application granted granted Critical
Publication of JP2526482Y2 publication Critical patent/JP2526482Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の混成集積回路をケース材側か
らみた平面図、第2図は第1図の−断面図、
第3図は第2図の要部拡大図、第4図および第5
図は従来例を示す断面図である。 1……基板、2……回路素子、3,4……外部
リード、5……ケース材、5a……突出領域、8
……凸部、7……コネクター。
Figure 1 is a plan view of the hybrid integrated circuit of the present invention viewed from the case material side, Figure 2 is a cross-sectional view of Figure 1;
Figure 3 is an enlarged view of the main parts of Figure 2, Figures 4 and 5.
The figure is a sectional view showing a conventional example. DESCRIPTION OF SYMBOLS 1... Board, 2... Circuit element, 3, 4... External lead, 5... Case material, 5a... Projection area, 8
...Protrusion, 7...Connector.

Claims (1)

【実用新案登録請求の範囲】 (1) 基板上に複数の回路素子が搭載され、前記
基板の側辺周端部から複数の外部リード端子が導
出された集積回路基板に前記回路素子を密封封止
するケース材が固着一体化されてなる混成集積回
路において、 前記ケース材の一側辺周端部は前記基板の周端
辺より水平方向に導出された突出領域を有し、前
記ケース材の突出領域の先端部に凸部を設けたこ
とを特徴とする混成集積回路。 (2) 前記外部リード端子は水平方向でない方向
に導出されていることを特徴とする請求項1項記
載の混成集積回路。 (3) 前記ケース材の突出領域は複数に分割され
ていることを特徴とする請求項1項記載の混成集
積回路。 (4) 前記回路素子は複数のパワー素子を有する
ことを特徴とする請求項1項記載の混成集積回路
[Claims for Utility Model Registration] (1) A plurality of circuit elements are mounted on a substrate, and the circuit elements are hermetically sealed in an integrated circuit board having a plurality of external lead terminals led out from the side peripheral edges of the substrate. In a hybrid integrated circuit in which a case material for stopping is fixed and integrated, a peripheral edge of one side of the case material has a protruding area horizontally extended from a peripheral edge of the substrate, A hybrid integrated circuit characterized in that a convex portion is provided at the tip of a protruding region. (2) The hybrid integrated circuit according to claim 1, wherein the external lead terminal is led out in a direction other than the horizontal direction. (3) The hybrid integrated circuit according to claim 1, wherein the protruding area of the case material is divided into a plurality of parts. (4) The hybrid integrated circuit according to claim 1, wherein the circuit element has a plurality of power elements.
JP1965890U 1990-02-28 1990-02-28 Hybrid integrated circuit Expired - Lifetime JP2526482Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1965890U JP2526482Y2 (en) 1990-02-28 1990-02-28 Hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1965890U JP2526482Y2 (en) 1990-02-28 1990-02-28 Hybrid integrated circuit

Publications (2)

Publication Number Publication Date
JPH03110774U true JPH03110774U (en) 1991-11-13
JP2526482Y2 JP2526482Y2 (en) 1997-02-19

Family

ID=31522764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1965890U Expired - Lifetime JP2526482Y2 (en) 1990-02-28 1990-02-28 Hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JP2526482Y2 (en)

Also Published As

Publication number Publication date
JP2526482Y2 (en) 1997-02-19

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term