JPH044786U - - Google Patents

Description

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a perspective view showing a conductive sheet, and FIGS. 3, 4, and 5 are sectional views showing a conventional example. 1 is an integrated circuit board, 2 is a conductive path, 3 is a circuit element, 4 is a case material, 5 is a hole, 6 is a conductive sheet, 7
is a semiconductor element.

Claims (1)

[Claims for Utility Model Registration] (1) An integrated circuit board, a conductive path of a desired shape formed on the substrate, and a plurality of circuit elements and resin-sealed semiconductor elements connected to the conductive path on the substrate. a case material that is integrated with the substrate, a hole is provided at a desired position in the case material, the semiconductor element is mounted on the substrate exposed through the hole via a conductive sheet, and the semiconductor element is mounted on the substrate exposed through the hole; A hybrid integrated circuit characterized in that one end of a lid for sealing a hole is fitted into one peripheral edge, and the other end is fixed to a case material with screws. (2) The hybrid integrated circuit according to claim 1, wherein the circuit element is sealed in a sealed space formed by the substrate and the case material. (3) The hybrid integrated circuit according to claim 1, wherein a plurality of conductive paths extend on the substrate on which the conductive sheet is disposed. (4) The hybrid integrated circuit according to claim 1, wherein the conductive sheet is formed of an insulating sheet, and a large number of linear conductors protrude from both surfaces of the conductive sheet.