JPH03106750U - - Google Patents
Info
- Publication number
- JPH03106750U JPH03106750U JP1990015998U JP1599890U JPH03106750U JP H03106750 U JPH03106750 U JP H03106750U JP 1990015998 U JP1990015998 U JP 1990015998U JP 1599890 U JP1599890 U JP 1599890U JP H03106750 U JPH03106750 U JP H03106750U
- Authority
- JP
- Japan
- Prior art keywords
- sealant
- substrate
- electronic component
- hole
- leakage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000565 sealant Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims 2
- 230000002265 prevention Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は、本考案の実施例を示す図であり、第
２図は、本考案の実施例において封止剤を塗布し
た図であり、第３図は、従来の構造を示す図であ
る。
図において、１……基板、２……電子部品、３
……ワイヤ、４……パツド、５……穴、６……封
止剤、をそれぞれ示す。
Fig. 1 is a diagram showing an embodiment of the present invention, Fig. 2 is a diagram showing a sealant applied in an embodiment of the present invention, and Fig. 3 is a diagram showing a conventional structure. . In the figure, 1...board, 2...electronic components, 3
... wire, 4 ... pad, 5 ... hole, 6 ... sealant are shown, respectively.
Claims (1)
止剤の流出防止構造に於いて、 前記基板１の該電子部品２の周囲に、前記封止
剤６における余分な量の封止剤が流れ込む穴５を
形成したことを特徴とする封止剤の流出防止構造
。[Claims for Utility Model Registration] In the structure for preventing the leakage of the sealant applied to the electronic component 2 mounted on the substrate 1, the sealant 6 is applied around the electronic component 2 of the substrate 1. A sealant outflow prevention structure characterized in that a hole 5 is formed into which an excess amount of sealant flows.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990015998U JPH03106750U (en) | 1990-02-20 | 1990-02-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990015998U JPH03106750U (en) | 1990-02-20 | 1990-02-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03106750U true JPH03106750U (en) | 1991-11-05 |
Family
ID=31519285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990015998U Pending JPH03106750U (en) | 1990-02-20 | 1990-02-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03106750U (en) |
-
1990
- 1990-02-20 JP JP1990015998U patent/JPH03106750U/ja active Pending