JPH03103373A - Sliding base for hot-pressing device - Google Patents

Abstract

PURPOSE:To enable maintenance of a glass disc at a constant temperature even in carrying out hot-pressing of an electronic circuit board, etc., on the glass disc by using a cold air producer for cooling the disc and a temperature controller for controlling flow of the cold air on a sliding base assembling the glass disc. CONSTITUTION:A sliding base assembling a glass disc 6 therein is used to hot-press a flexible wiring board 2 to a glass substrate 4, etc., with an anisotropic electrically conductive film 3 using a heating head 1. In the process, when the glass substrate 4 conducts heat to increase the temperature of the glass disc 6, temperature is sensed with a thermocouple 5. If the temperature is higher than the set temperature, compressed air 12 enters a cold air producer 9 by action of a temperature controller 11 and produced cold air then enters at a hole part (7a) of a pressing member 7 to cool the glass disc 6. When the temperature of the glass disc 6 is decreased, the production of the cold air is stopped. Thereby, the temperature of the glass disc 6 can be kept nearly constant during operation of the hot-pressing device.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a slide base mainly used in a thermocompression bonding device for electronic circuit boards.

[Conventional technology]

Conventionally, electronic circuit boards are connected to each other on a glass surface plate built into a slide base in a thermocompression bonding device. More specifically, for example, a flexible wiring board and a glass substrate are stacked on top of each other on a glass surface plate with an anisotropic conductive film interposed therebetween, and a heating head is pressed from above to bond them by thermocompression.

[Problem to be solved by the invention] In the case of the above thermocompression bonding, the stiffness of the glass surface plate increases too much, so the operation of the thermocompression bonding device is stopped for a certain period of time in order to lower the temperature by natural heat radiation, or In order to always start work at a constant temperature, it was necessary to dry run or warm up before work. Therefore, not only is it impossible to operate the device continuously, which reduces work efficiency, but also the reliability after connection is reduced because the connection conditions change.

An object of the present invention is to provide a slide base for a thermocompression bonding device that does not have the above-mentioned drawbacks.

[Means to solve the problem]

The structure of the present invention for achieving the above object will be explained using FIGS. 1 to 3 corresponding to the embodiments.
Slide base (8) incorporating glass surface plate (6),
Glass surface plate (6) Cold air generator for cooling (9) and glass surface plate! A temperature control needle (1L) that automatically controls the flow of cold air (L3) by detecting the temperature in (6) is installed to prevent the temperature of the glass surface plate (6) from rising due to heating during thermocompression bonding, and to maintain a constant temperature. This is a slide base for thermocompression bonding equipment that can be held in place. [Example] [Operation] Fig. 1 is a diagram showing the structure of a slide base for a thermocompression bonding device showing an embodiment of the present invention, Fig. 2 is a plan view of the slide base in Fig. 1, and Fig. 2 is a left side view of FIG. 2. FIG.

In the figure, 8 is a slide base, and a glass surface plate 6 (20x20x320 m) is built into the upper part. Reference numeral 7 denotes a presser member made of synthetic resin that presses the side surface of the glass surface plate 6, and the presser member 7 has a hole 7a on the side surface and a width 1 along one side of the glass surface plate 6 from the hole portion 7a.
A groove 7b with a length of 4 m and a depth of 2III is provided. Reference numeral 9 denotes a cold air generator connected to the hole 7a of the holding member 7 and the solenoid valve IO, and a Nocolder (180-75SV) manufactured by Kosutsuku Co., Ltd. was used. 10 is a solenoid valve, 11 is a thermocouple (alumel chromel thermocouple) 5 reaching the surface of the glass surface plate 6, and a temperature controller (using Omron ESCS manufactured by Tateishi Electric) electrically connected to the solenoid valve 10.

12 is a pressure 49.03325X10' P introduced from an air source (not shown) into the cold air generator 9 via the solenoid valve IO.
a (5kg/ej) compressed air, l3 is cold air generation 11
This is cold air with a temperature of -20°C generated from 9.

Next, the action of the slide base with the above structure will be explained based on FIG.
0° C.), heat passes through the glass substrate 4 and the temperature of the glass surface plate 6 rises. The temperature at this time is detected by the temperature controller U via the thermocouple 5 and compared with the set temperature. When the temperature of the glass surface plate 6 is higher than the set temperature, a contact point (not shown) in the temperature controller 11 closes and the solenoid valve 10 closes.
compressed air l2 enters the cold air generator 9 to open the cold air 1
3 is generated, and this is passed from the hole 7a of the holding member 7 to the groove 7.
b to cool the glass surface plate 6. Therefore, the glass surface plate 6
When the temperature drops below the set temperature, the solenoid valve 10 closes and the generation of cold air stops. In this way, the temperature of the glass surface plate 6 can be kept almost constant even while the thermocompression bonding device is in operation. As a result of the test according to the embodiment of the present invention, the temperature of the heating head 2
50"C, heat and pressure bonding time 20 seconds, ■ cycle 60 seconds, when the temperature controller is set at 30 degrees Celsius, the temperature of the glass surface plate becomes constant at 34 degrees Celsius, and on the other hand, without generating cold air. When the experiment was conducted under the same conditions, the temperature of the glass surface plate reached 75°C, which shows that the effect of the present invention is large.In the case of this example, the cold air was flowed along the side of the glass surface plate. However, the present invention is not limited to this, and may be sprayed along the lower surface, or may be sprayed on the upper surface depending on the case. [Effects of the Invention] Since the present invention has the above structure, Even when electronic circuit boards, etc. are thermocompressed on the glass surface plate of the base, the temperature of the glass surface plate does not rise due to this heat and is maintained at a constant temperature, so it is necessary to stop the thermocompression bonding equipment for heat dissipation. It is possible to operate continuously without any problems, which not only improves work efficiency, but also improves reliability after bonding.

[Brief explanation of drawings]

FIG. 1 is a configuration diagram of a slide base for a thermocompression bonding apparatus showing an embodiment of the present invention, FIG. 2 is a plan view of the slide base in FIG. 1, and FIG. 3 is a left side view of FIG. 2. Explanation of symbols

Claims (1)

[Claims] 1. A cold air generator for cooling the glass surface plate and a temperature controller that automatically controls the flow of cold air by detecting the temperature of the glass surface plate are attached to the slide base that incorporates the glass surface plate. A slide base for a thermocompression bonding device, characterized in that it prevents the temperature of a glass surface plate from rising and maintains it at a constant temperature.