JP2737302B2 - Slide base for thermocompression bonding equipment - Google Patents
Slide base for thermocompression bonding equipmentInfo
- Publication number
- JP2737302B2 JP2737302B2 JP1241465A JP24146589A JP2737302B2 JP 2737302 B2 JP2737302 B2 JP 2737302B2 JP 1241465 A JP1241465 A JP 1241465A JP 24146589 A JP24146589 A JP 24146589A JP 2737302 B2 JP2737302 B2 JP 2737302B2
- Authority
- JP
- Japan
- Prior art keywords
- slide base
- temperature
- thermocompression bonding
- glass
- surface plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、主として電子回路板の熱圧着装置に用いら
れるスライドベースに関するものである。Description: TECHNICAL FIELD The present invention relates to a slide base mainly used for a thermocompression bonding apparatus for an electronic circuit board.
従来、電子回路板相互の接続は熱圧着装置におけるス
ライドベースに組込まれたガラス定盤上で行われる。さ
らに詳しく説明すると、例えばフレキシブル配線板とガ
ラス基板とをガラス定盤上に異方導電フィルムを介して
重ね合わせ、上方から加熱ヘッドを押し付け熱圧着す
る。Conventionally, connection between electronic circuit boards is performed on a glass platen incorporated in a slide base in a thermocompression bonding apparatus. More specifically, for example, a flexible wiring board and a glass substrate are overlaid on a glass surface plate via an anisotropic conductive film, and a heating head is pressed from above to perform thermocompression bonding.
上記の熱圧着の場合にガラス定盤の温度が上昇しすぎ
るので自然放熱により温度を下げるために、ある時間熱
圧着装置の稼動を停止しておいたり、又は、常に一定の
温度で作業が開始できるように作業前に空打ち又はウォ
ーミングアップする必要があった。In the case of the above thermocompression bonding, the temperature of the glass platen rises too much, so the operation of the thermocompression bonding machine is stopped for a certain time or the work always starts at a constant temperature in order to lower the temperature by natural heat radiation. It was necessary to perform blanking or warming up before the work to be able to do so.
従って、装置の連続稼動が不可能で作業能率が低下す
るばかりでなく、接続の条件が変化するため接続後の信
頼性が低下するという欠点があった。Therefore, there is a drawback that not only the continuous operation of the apparatus is not possible and the work efficiency is lowered, but also the reliability after connection is reduced due to the change of connection conditions.
本発明の目的は、上記のような欠点のない熱圧着装置
用スライドベースを提供することにある。An object of the present invention is to provide a slide base for a thermocompression bonding apparatus that does not have the above-mentioned disadvantages.
上記の目的を達成するための本発明の構成を実施例に
対応する第１図〜第３図を用いて説明すると、本発明
は、スライドベース（８）に組込まれたガラス定盤
（６）上に異方導電フィルム（３）を介し二枚の回路板
（２），（４）を重ね合わせ熱圧着して接続する熱圧着
装置用スライドベースにおいて、前記スライドベース
（８）に、ガラス定盤（６）冷却用の冷風発生機（９）
及びガラス定盤（６）の温度検知により冷風（13）の流
通を自動的に制御する温調計（11）を取付けて、熱圧着
時の加熱によるガラス定盤の昇温を防ぎ且つ一定温度に
保持しうるようにした熱圧着装置用スライドベースであ
る。The configuration of the present invention for achieving the above object will be described with reference to FIGS. 1 to 3 corresponding to the embodiment. The present invention provides a glass surface plate (6) incorporated in a slide base (8). In a slide base for a thermocompression bonding apparatus in which two circuit boards (2) and (4) are overlapped and connected by thermocompression bonding via an anisotropic conductive film (3), a glass plate is attached to the slide base (8). Panel (6) Cold air generator for cooling (9)
And a temperature controller (11) that automatically controls the flow of cold air (13) by detecting the temperature of the glass surface plate (6) to prevent the temperature of the glass surface plate from rising due to heating during thermocompression bonding and maintain a constant temperature. This is a slide base for a thermocompression bonding apparatus that can be held at a predetermined temperature.
〔実施例〕〔作用〕 第１図は、本発明の一実施例を示す熱圧着装置用スラ
イドベースの構成図、第２図は第１図におけるスライド
ベースの平面図、第３図は第２図の左側面図である。FIG. 1 is a structural view of a slide base for a thermocompression bonding apparatus showing one embodiment of the present invention, FIG. 2 is a plan view of the slide base in FIG. 1, and FIG. It is a left view of a figure.
図において、８はスライドベースであり、上部にガラ
ス定盤６（20×20×320mm）が組込まれている。７はガ
ラス定盤６の側面を押さえる合成樹脂製の押さえ部材で
あり、該押さえ部材７には側面に孔部7a、さらに該孔部
7aからガラス定盤６の片側面に沿った幅14mm、深さ2mm
の溝部7bが設けられている。In the figure, reference numeral 8 denotes a slide base, on which a glass platen 6 (20 × 20 × 320 mm) is incorporated. Reference numeral 7 denotes a synthetic resin pressing member for pressing the side surface of the glass platen 6, and the pressing member 7 has a hole 7a on the side surface and a hole 7a.
7mm to 14mm width and 2mm depth along one side of glass platen 6
Groove portion 7b is provided.
９は、押さえ部材７の孔部7a及び電磁弁10に配管接続
される冷風発生機であり、コルダー（180−75SV）（コ
スミック（株）製、商品名）を使用した。10は電磁弁、
11は、ガラス定盤６の表面に到る熱電対５（アルメルク
ロメル熱電対）及び電磁弁10に電気的に接続する温調計
（立石電機（株）製、商品名、オムロンE5CS使用）であ
る。Reference numeral 9 denotes a cool air generator connected to the hole 7a of the holding member 7 and the solenoid valve 10 by piping, and a corder (180-75 SV) (trade name, manufactured by Cosmic Corporation) was used. 10 is a solenoid valve,
Numeral 11 denotes a thermocouple 5 (almer chromel thermocouple) reaching the surface of the glass platen 6 and a temperature controller (trade name, manufactured by Tateishi Electric Co., using OMRON E5CS) electrically connected to the solenoid valve 10. is there.
12は図示しない空気源から電磁弁10を介して冷風発生
機９に導入される圧力49.03325×104Pa（5kg/cm2）の圧
縮エア、13は冷風発生機９から発生する温度−20℃の冷
風である。12 is compressed air having a pressure of 49.03325 × 10 4 Pa (5 kg / cm 2 ) introduced into the cool air generator 9 from an air source (not shown) through the solenoid valve 10, and 13 is a temperature of −20 ° C. generated from the cool air generator 9 It is cold wind.
次に上記構成によるスライドベースの作用を第１図に
基づき説明すると、異方導電フィルム３を用いフレキシ
ブル配線板２とガラス基板４とを加熱ヘッド（温度約25
0℃）により熱圧着する場合、熱がガラス基板４を通し
てガラス定盤６に伝わり温度が上昇する。この時の温度
は熱電対５を介して温調計11により検知され設定温度と
比較される。そして、ガラス定盤６の温度が設定温度よ
り高い場合には温調計11内の接点（図示せず）が閉じ電
磁弁10が開くために圧縮エア12が冷風発生機９に入り冷
風13が発生して、これが押さえ部材７の孔部7aから溝部
7bに入ってガラス定盤６を冷却する。従って、ガラス定
盤６の温度が下がり設定温度以下になると電磁弁10が閉
じて冷風の発生が止まる。このようにして熱圧着装置の
稼動中においてもガラス定盤６の温度をほぼ一定に保つ
ことができる。Next, the operation of the slide base according to the above configuration will be described with reference to FIG. 1. The flexible wiring board 2 and the glass substrate 4 are heated by a heating head (temperature of about 25
(0 ° C.), heat is transmitted to the glass surface plate 6 through the glass substrate 4 and the temperature rises. The temperature at this time is detected by the temperature controller 11 via the thermocouple 5 and is compared with the set temperature. When the temperature of the glass platen 6 is higher than the set temperature, the contact (not shown) in the temperature controller 11 is closed and the solenoid valve 10 is opened, so that the compressed air 12 enters the cold air generator 9 and the cold air 13 flows. This occurs, and this occurs from the hole 7a of the holding member 7
The glass platen 6 is cooled by entering 7b. Therefore, when the temperature of the glass platen 6 falls and becomes equal to or lower than the set temperature, the electromagnetic valve 10 closes and the generation of cold air stops. In this way, the temperature of the glass platen 6 can be kept substantially constant even during the operation of the thermocompression bonding apparatus.
本発明の実施例による試験の結果、加熱ヘッドの温度
250℃、加熱圧着時間20秒で、１サイクル60秒のとき、
温調計の設定温度を30℃にすると、ガラス定盤の温度は
34℃で一定となり、これに対し冷風を発生させないで同
条件で実験した場合にはガラス定盤の温度は75℃にもな
り、本発明による効果が大きいことが分かる。As a result of the test according to the embodiment of the present invention, the temperature of the heating head was
At 250 ° C, heat and pressure bonding time 20 seconds, 1 cycle 60 seconds,
When the set temperature of the temperature controller is set to 30 ° C, the temperature of the glass
When the temperature was constant at 34 ° C. and the experiment was carried out under the same conditions without generating cold air, the temperature of the glass platen was as high as 75 ° C., which indicates that the effect of the present invention is great.
なお、本実施例の場合には冷風をガラス定盤の側面に
沿って流すようにしたが、これに限ることなく、冷え
ば、下綿に沿って流したり、場合によっては上面に吹き
付けるようにしても良い。In addition, in the case of the present embodiment, the cool air was caused to flow along the side surface of the glass platen.However, the present invention is not limited to this. May be.
本発明は上記構成よりなるので、熱圧着装置のスライ
ドベースにおけるガラス定盤上で電子回路板等の熱圧着
を行ってもこの熱によりガラス定盤の温度が上昇するこ
となく一定温度に保持されるので、従来のように熱圧着
装置を放熱のために停止する必要がなく、連続稼動が可
能で作業効率が向上するのみならず、接続後の信頼性が
向上する効果がある。Since the present invention has the above-described configuration, even when thermocompression bonding of an electronic circuit board or the like is performed on the glass platen in the slide base of the thermocompression bonding apparatus, the temperature of the glass platen is maintained at a constant temperature without increasing due to this heat. Therefore, there is no need to stop the thermocompression bonding apparatus for heat radiation unlike the related art, and there is an effect that not only the continuous operation is possible and the working efficiency is improved but also the reliability after connection is improved.
第１図は本発明の一実施例を示す熱圧着装置用スライド
ベースの構成図、第２図は第１図におけるスライドベー
スの平面図、第３図は第２図の左側面図である。 符号の説明 １……加熱ヘッド、２……フレキシブル配線板 ３……異方導電フィルム、４……ガラス基板 ５……熱電対、６……ガラス定盤 ７……押さえ部材、7a……孔部 7b……溝部、８……スライドベース ９……冷風発生機、10……電磁弁 11……温調計、12……圧縮エア 13……冷風FIG. 1 is a structural view of a slide base for a thermocompression bonding apparatus showing one embodiment of the present invention, FIG. 2 is a plan view of the slide base in FIG. 1, and FIG. 3 is a left side view of FIG. DESCRIPTION OF SYMBOLS 1 ... Heating head 2 ... Flexible wiring board 3 ... Anisotropic conductive film 4 ... Glass substrate 5 ... Thermocouple 6 ... Glass surface plate 7 ... Holding member 7a ... Hole Part 7b: Groove, 8: Slide base 9: Cold air generator, 10: Solenoid valve 11: Temperature controller, 12: Compressed air 13: Cold air
Claims (1)
に異方導電フィルムを介し二枚の回路板を重ね合わせ熱
圧着して節沿する熱圧着装置用スライドベースにおい
て、前記スライドベースに、ガラス定盤冷却用の冷風発
生機及びガラス定盤の温度検知により冷風の流通を自動
的に制御する温調計を取付けて、熱圧着時の加熱による
ガラス定盤の昇温を防ぎ且つ一定温度に保持しうるよう
にしたことを特徴とする熱圧着装置用スライドベース。1. A slide base for a thermocompression bonding apparatus in which two circuit boards are superimposed and thermocompression-bonded via an anisotropic conductive film on a glass platen incorporated in the slide base, and the slide base includes: A cold air generator for cooling the glass surface plate and a temperature controller that automatically controls the flow of cold air by detecting the temperature of the glass surface plate are installed to prevent the temperature of the glass surface plate from rising due to heating during thermocompression bonding and maintain a constant temperature. A slide base for a thermocompression bonding device, characterized in that the slide base can be held at a fixed position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1241465A JP2737302B2 (en) | 1989-09-18 | 1989-09-18 | Slide base for thermocompression bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1241465A JP2737302B2 (en) | 1989-09-18 | 1989-09-18 | Slide base for thermocompression bonding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03103373A JPH03103373A (en) | 1991-04-30 |
| JP2737302B2 true JP2737302B2 (en) | 1998-04-08 |
Family
ID=17074721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1241465A Expired - Lifetime JP2737302B2 (en) | 1989-09-18 | 1989-09-18 | Slide base for thermocompression bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2737302B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111683468B (en) * | 2020-07-09 | 2022-07-19 | 湖南人文科技学院 | Electronic components hot pressing kludge |
| CN115942645B (en) * | 2023-03-15 | 2023-05-16 | 中电科风华信息装备股份有限公司 | Movable large-size PCB pressing table mechanism |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59158362U (en) * | 1983-04-08 | 1984-10-24 | 株式会社日立製作所 | thermocompression bonding equipment |
-
1989
- 1989-09-18 JP JP1241465A patent/JP2737302B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03103373A (en) | 1991-04-30 |
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