CN116344401A - Chip bonding device and chip bonding position deviation detection method - Google Patents
Chip bonding device and chip bonding position deviation detection method Download PDFInfo
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- CN116344401A CN116344401A CN202310330922.8A CN202310330922A CN116344401A CN 116344401 A CN116344401 A CN 116344401A CN 202310330922 A CN202310330922 A CN 202310330922A CN 116344401 A CN116344401 A CN 116344401A
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- 238000001514 detection method Methods 0.000 title abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 64
- 238000001931 thermography Methods 0.000 claims description 33
- 238000010438 heat treatment Methods 0.000 claims description 29
- 230000007246 mechanism Effects 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 5
- 230000000007 visual effect Effects 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 230000009471 action Effects 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 claims description 3
- 239000012774 insulation material Substances 0.000 claims description 2
- 238000005485 electric heating Methods 0.000 claims 1
- 238000012545 processing Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Die Bonding (AREA)
Abstract
The invention discloses a chip bonding device and a chip bonding position deviation detection method, which belong to the technical field of electronic product processing. The chip bonding device and the chip bonding position deviation detection method can accurately and rapidly confirm whether the substrate and the chip are placed in place.
Description
Technical Field
The invention relates to the technical field of electronic product processing, in particular to a chip bonding device and a chip bonding position deviation detection method.
Background
In semiconductor processing, "bonding" refers to securing a wafer die to a substrate. Bonding processes can be classified into conventional methods and advanced methods. While the conventional method employs Die Bonding (or Die Attach) and Wire Bonding (Wire Bonding), the advanced method employs flip chip Bonding (Flip Chip Bonding) technology developed by IBM later in the 60 s. Flip chip bonding technology combines chip bonding with wire bonding and connects the chip and the substrate by forming bumps (bumps) on the chip pads.
Just as an engine is used to power a car, die bonding technology achieves electrical connection between the die and the outside by attaching the semiconductor die to a Lead Frame or printed circuit board (PCB, printed Circuit Board). After the die bonding is completed, it should be ensured that the die can withstand the physical pressure generated after packaging and dissipate the heat generated during operation of the die. If necessary, it is necessary to maintain constant conductivity or to achieve a high level of insulation. Thus, as chip sizes become smaller, bonding techniques become more and more important.
The bonding machine is core equipment of bonding procedure, when bonding operation is carried out, the chip is required to be placed at the corresponding position on the substrate, then the bonding pad of the chip is connected with the pin of the lead frame on the substrate, so that bonding operation is realized, in the bonding machine today, the bonding head assembly directly participating in bonding is often set with a fixed advancing program, after the chip and the substrate are placed on the bonding station below the bonding head assembly, the bonding head assembly bonds the chip and the substrate according to a fixed path, therefore, the placement positions of the chip and the substrate are always fixed, but the substrate is mostly rectangular, and even if the substrate is turned by 180 degrees or 90 degrees due to working errors, the bonding station is still likely to be placed smoothly, and the errors are difficult to perceive, so that the substrate can be placed in place smoothly, but the chip on the substrate cannot be guaranteed to be placed in place, and once the chip position is wrong, the bonding failure is caused, and raw material waste is caused.
Disclosure of Invention
Aiming at the problems in the prior art, the invention aims to provide a chip bonding device and a chip bonding position deviation detection method, which can accurately and rapidly confirm whether a substrate and a chip are placed in place.
The technical aim of the invention is realized by the following technical scheme: the utility model provides a chip bonding device, includes the workstation, be equipped with the slide rail on the workstation, the slide is provided with the balladeur train on the slide rail, the slide is provided with the bonding head assembly on the balladeur train, the balladeur train can be followed the slide rail is in the top lateral shifting of workstation, the bonding head assembly can be followed the balladeur train is in the top longitudinal shifting of workstation, be equipped with the bonding platform that is the rectangle on the workstation, the bonding platform is bonding operation station, be located on the workstation all be equipped with the locating part in the four corners department of bonding platform, the bottom of bonding platform is equipped with the refrigerator, still be equipped with the thermal imaging camera on the workstation, the thermal imaging camera can acquire the image of bonding platform place region turns into the thermal imaging picture, this kind of chip bonding device still includes conveying mechanism, conveying mechanism is used for the transmission and is equipped with the chip but does not still carries out the base plate of bonding process, be equipped with the case that heats up on conveying mechanism's the transmission path, the case heats up through heating mechanism.
In some embodiments, the bonding stage is a copper plate.
In some embodiments, the stop member is L-shaped in cross section, which encloses four right angles of the bonding station.
In some embodiments, the stop is removably mounted to the table.
In some embodiments, two thermal imaging cameras are provided, and the two thermal imaging cameras can both acquire images of the area where the bonding stage is located and convert the images into thermal imaging pictures.
In some embodiments, the exterior surface of the warming box is affixed with a thermal insulation material.
In some embodiments, the heating mechanism supplies heat through a heating wire.
A chip bonding position deviation detection method comprises the following steps:
s1, respectively attaching heat conduction patches with different heat conduction coefficients to four corners of a substrate provided with chips but not subjected to a bonding process;
s2, starting the refrigerator, cooling the bonding table, ensuring that the temperature of the bonding table is kept constant between 0 ℃ and 10 ℃, and monitoring the visual temperature of the area where the bonding table is located by means of the thermal imaging camera;
s3, starting the heating mechanism to heat the interior of the heating box, and ensuring that the temperature in the heating box is kept constant at 30-40 ℃;
s4, taking a substrate stuck with heat-conducting patches in the step S1, starting the conveying mechanism, enabling the substrate to pass through the heating box under the transmission action of the conveying mechanism, placing the heated substrate on the bonding table, observing and recording the temperature-reducing thermal imaging changes of the heat-conducting patches at four corners of the substrate by means of the thermal imaging camera during the period, generating a map, obtaining a reference map, and storing data into a computer;
s5, repeating the operation of the step S4 on all the rest substrates, comparing the corresponding patterns of each substrate with the reference patterns, if the patterns are consistent, indicating that the bonding placement positions of the substrates are not deviated, and if the patterns are inconsistent, indicating that the bonding placement positions of the substrates are deviated.
In summary, the invention has the following beneficial effects:
according to the chip bonding device and the chip bonding position deviation detection method, the temperature difference is arranged on the substrate placement station and the substrate, so that after the substrate is placed on the station, a remarkable heat exchange effect can be generated, the whole heat exchange process can be monitored through the thermal imaging camera, a visual map is obtained, the four corners of each substrate are respectively stuck with heat conduction patches with different heat conduction coefficients, so that the heat exchange speeds of the four corners of the substrate are different, the heat exchange speeds of the four corners are different and are directly reflected from the map, and from the thermal imaging image, the four corners of the substrate have remarkable differences, so that the foolproof placement of the substrate can be realized under the condition that the substrate is not damaged and the station shape is not changed, the deviation exists in the bonding placement positions of the substrate and the chip, and accordingly whether the substrate and the chip are placed in place can be accurately and quickly confirmed.
Drawings
FIG. 1 is an overall block diagram of a bonding apparatus of the present invention;
FIG. 2 is an overall block diagram of a bonding stage of the present invention (view I);
fig. 3 is an overall structure diagram (view two) of the bonding stage of the present invention.
In the figure: 1. a work table; 2. a slide rail; 3. a carriage; 4. a bond head assembly; 5. a bonding stage; 6. a limiting piece; 7. a thermal imaging camera; 8. a refrigerator; 9. a conveying mechanism; 10. a heating box; 11. a heating mechanism.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention.
In the description of the present invention, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
As shown in fig. 1-3, a chip bonding device includes a workbench 1, a slide rail 2 is disposed on the workbench 1, a carriage 3 is slidably disposed on the slide rail 2, a bonding head assembly 4 is slidably disposed on the carriage 3, the carriage 3 can move laterally above the workbench 1 along the slide rail 2, and the bonding head assembly 4 can move longitudinally above the workbench 1 along the carriage 3, so that the bonding head assembly 4 can slide along the X-axis direction and the Y-axis direction, and the mechanisms can adopt a numerical control automatic driving mode, which is a conventional technical means, and will not be described in detail in this embodiment.
Be equipped with on workstation 1 and be rectangular bonding platform 5, bonding platform 5 can be the copper, bonding platform 5 is bonding operation station, be used for placing base plate and the chip of waiting to bond, be located the four corners department of bonding platform 5 on workstation 1 and all be equipped with locating part 6, be used for spacing the base plate, and is preferred, the transversal L type of personally submitting of locating part 6, it surrounds four right angles of bonding platform 5, locating part 6 demountable installation is on workstation 1, so that the maintenance is changed, the bottom of bonding platform 5 is equipped with refrigerator 8, refrigerator 8 adopts conventional equipment can, still be equipped with thermal imaging camera 7 on workstation 1, in order to reduce the error, thermal imaging camera 7 can set up two, thermal imaging camera 7 adopts conventional equipment can, two thermal imaging camera 7 homoenergetic acquire the image in bonding platform 5 place and turn into thermal imaging picture, can be with thermal imaging camera 7 external computer for edit and storage data, this kind of chip bonding device still includes conveying mechanism 9, conveying mechanism 9 adopts conventional conveyer belt can be equipped with thermal imaging camera 9 and is used for carrying out heating element 10 and is equipped with heating element 10 on the heating element, heating element 10 can not carry out heating element through heating element 11, heating element 10 and heating element is lost the heat-proof. In operation, the conveying mechanism 9 conveys the substrate provided with the chip but not subjected to the bonding process to be close to the workbench 1, then the substrate is placed on the bonding table 5 by means of a manual or mechanical arm, and after the substrate and the chip are placed in place, the bonding head assembly 4 is used for bonding the substrate and the chip.
Based on the technical scheme, the method for detecting the deviation of the bonding position of the chip comprises the following steps:
s1, respectively attaching heat conduction patches with different heat conduction coefficients to four corners of a substrate provided with chips but not subjected to a bonding process;
s2, starting a refrigerator 8, cooling the bonding table 5, ensuring that the temperature of the bonding table 5 is kept constant between 0 ℃ and 10 ℃, and monitoring the visual temperature of the area where the bonding table 5 is located by means of a thermal imaging camera 7;
s3, starting a heating mechanism 11 to heat the interior of the heating box 10, and ensuring that the temperature in the heating box 10 is kept constant between 30 ℃ and 40 ℃;
s4, taking a substrate stuck with heat-conducting patches in the step S1, starting a conveying mechanism 9, enabling the substrate to pass through a heating box 10 under the transmission action of the conveying mechanism 9, placing the heated substrate on a bonding table 5, observing and recording the temperature-reducing thermal imaging changes of the heat-conducting patches at four corners of the substrate by means of a thermal imaging camera 7 during the period, generating a map, obtaining a reference map, and storing data into a computer;
s5, repeating the operation of the step S4 on all the rest substrates, comparing the corresponding patterns of each substrate with the reference patterns, if the patterns are consistent, indicating that the bonding placement positions of the substrates are not deviated, and if the patterns are inconsistent, indicating that the bonding placement positions of the substrates are deviated.
According to the chip bonding device and the chip bonding position deviation detection method, the temperature difference is arranged on the substrate placement station and the substrate, so that after the substrate is placed on the station, a remarkable heat exchange effect can be generated, the whole heat exchange process can be monitored through the thermal imaging camera 7, a visual map is obtained, the four corners of each substrate are respectively stuck with heat conduction patches with different heat conduction coefficients, so that the heat exchange speeds of the four corners of the substrate are different, the heat exchange speeds of the four corners are different and are directly reflected from the map, and from the thermal imaging image, the four corners of the substrate have remarkable differences, so that the foolproof placement of the substrate can be realized under the condition that the substrate is not damaged and the station shape is not changed, the deviation exists in the bonding placement positions of the substrate and the chip, and therefore, whether the substrate and the chip are placed in place can be accurately and quickly confirmed.
The present embodiment is only for explanation of the present invention and is not to be construed as limiting the present invention, and modifications to the present embodiment, which may not creatively contribute to the present invention as required by those skilled in the art after reading the present specification, are all protected by patent laws within the scope of claims of the present invention.
Claims (8)
1. A die bonding apparatus, characterized in that: comprises a workbench (1), a slide rail (2) is arranged on the workbench (1), a sliding frame (3) is arranged on the slide rail (2) in a sliding manner, a bonding head assembly (4) is arranged on the sliding frame (3) in a sliding manner, the sliding frame (3) can move transversely above the workbench (1) along the slide rail (2), the bonding head assembly (4) can move longitudinally above the workbench (1) along the sliding frame (3), a rectangular bonding table (5) is arranged on the workbench (1), the bonding table (5) is a bonding operation station, limit parts (6) are arranged at four corners of the bonding table (5) on the workbench (1), a refrigerator (8) is arranged at the bottom of the bonding table (5), a thermal imaging camera (7) is further arranged on the workbench (1), the thermal imaging camera (7) can acquire images of areas where the bonding table (5) are located, the thermal imaging camera (9) is arranged on a conveying path (9) of a chip, and the chip is not provided with a heating mechanism (9), the temperature-raising box (10) is heated by a heating mechanism (11).
2. The die bonding apparatus of claim 1, wherein: the bonding table (5) is a copper plate.
3. The die bonding apparatus of claim 1, wherein: the cross section of the limiting piece (6) is L-shaped, and the limiting piece surrounds four right angles of the bonding table (5).
4. The die bonding apparatus of claim 1, wherein: the limiting piece (6) is detachably arranged on the workbench (1).
5. The die bonding apparatus of claim 1, wherein: the two thermal imaging cameras (7) are arranged, and the two thermal imaging cameras (7) can acquire images of the area where the bonding table (5) is located and convert the images into thermal imaging pictures.
6. The die bonding apparatus of claim 1, wherein: the outer surface of the heating box (10) is stuck with a heat insulation material.
7. The die bonding apparatus of claim 1, wherein: the heating mechanism (11) supplies heat through an electric heating wire.
8. A die bonding position deviation detecting method based on the die bonding apparatus according to any one of claims 1 to 7, comprising the steps of:
s1, respectively attaching heat conduction patches with different heat conduction coefficients to four corners of a substrate provided with chips but not subjected to a bonding process;
s2, starting the refrigerator (8), cooling the bonding table (5), ensuring that the temperature of the bonding table (5) is between 0 ℃ and 10 ℃ and kept constant, and carrying out visual temperature monitoring on the area where the bonding table (5) is located by means of the thermal imaging camera (7);
s3, starting the heating mechanism (11) to heat the interior of the heating box (10) so as to ensure that the temperature in the heating box (10) is kept constant and between 30 ℃ and 40 ℃;
s4, taking a substrate stuck with heat-conducting patches in the step S1, starting the conveying mechanism (9), enabling the substrate to pass through the heating box (10) under the transmission action of the conveying mechanism (9), placing the heated substrate on the bonding table (5), observing and recording the temperature-reducing thermal imaging changes of the heat-conducting patches at four corners of the substrate by means of the thermal imaging camera (7) during the period, generating a map, obtaining a reference map, and storing data into a computer;
s5, repeating the operation of the step S4 on all the rest substrates, comparing the corresponding patterns of each substrate with the reference patterns, if the patterns are consistent, indicating that the bonding placement positions of the substrates are not deviated, and if the patterns are inconsistent, indicating that the bonding placement positions of the substrates are deviated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310330922.8A CN116344401A (en) | 2023-03-30 | 2023-03-30 | Chip bonding device and chip bonding position deviation detection method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310330922.8A CN116344401A (en) | 2023-03-30 | 2023-03-30 | Chip bonding device and chip bonding position deviation detection method |
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| Publication Number | Publication Date |
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| CN116344401A true CN116344401A (en) | 2023-06-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310330922.8A Pending CN116344401A (en) | 2023-03-30 | 2023-03-30 | Chip bonding device and chip bonding position deviation detection method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116913855A (en) * | 2023-09-08 | 2023-10-20 | 广州市艾佛光通科技有限公司 | Chip bonding device and fixing assembly thereof |
| CN117655622A (en) * | 2024-01-31 | 2024-03-08 | 宁波尚进自动化科技有限公司 | Welding table |
-
2023
- 2023-03-30 CN CN202310330922.8A patent/CN116344401A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116913855A (en) * | 2023-09-08 | 2023-10-20 | 广州市艾佛光通科技有限公司 | Chip bonding device and fixing assembly thereof |
| CN116913855B (en) * | 2023-09-08 | 2023-12-19 | 广州市艾佛光通科技有限公司 | Chip bonding device and fixing assembly thereof |
| CN117655622A (en) * | 2024-01-31 | 2024-03-08 | 宁波尚进自动化科技有限公司 | Welding table |
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