JP2005135952A - Device and method for mounting electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily detect mounting abnormality of an electronic component at each mounting operation of the electronic component on a circuit board. <P>SOLUTION: An electronic component mounting device 1 is provided with a board holder 2 holding the circuit board 9, and a mounting mechanism 4 mounting the electronic component on the circuit board 9. The mounting mechanism 4 is provided with a suction nozzle heating the electronic component, while it is kept. The electronic component mounting device 1 is provided with an infrared thermographic equipment 51 measuring temperature distribution on the circuit board 9 on which the heated electronic component is mounted, a memory 61 for storing various pieces of information, and a detection circuit 62 for detecting mounting abnormality of the electronic component on the circuit board 9. In the electronic component mounting device 1, a detection circuit 62 detects the difference between temperature distribution of the circuit board 9 which is acquired by the infrared thermography 51, and the standard temperature distribution which has previously been stored in the memory 61. Accordingly, mounting abnormality of the electronic component can be detected. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a technique for mounting an electronic component on a circuit board.

  2. Description of the Related Art Conventionally, in many mounting systems for mounting electronic components on a circuit board such as a printed circuit board, a mounting device that holds the electronic component by a nozzle or the like and mounts the solder paste applied on the circuit board is used. . In such a mounting device, the mounting state of the electronic component is usually inspected by a dedicated inspection device after all the electronic components are mounted on one circuit board or after the reflow process is completed. It has been broken.

  On the other hand, a technique for inspecting the mounting state every time an electronic component is mounted on a circuit board has been proposed. For example, in Patent Document 1, each time a circuit component is mounted on a circuit board, slit light from a slit light emitting device is proposed. A technique for inspecting the mounting state of a circuit component by radiating the circuit component and imaging the reflected light is disclosed.

In addition, in an electronic component mounting apparatus, in order to mount an electronic component at a predetermined position in a predetermined direction, it is generally performed to inspect and adjust the position and orientation of the electronic component held immediately before mounting. ing. For example, Patent Document 2 discloses a technique for inspecting the position and orientation of an electronic component by imaging the temperature distribution of the heated electronic component.
Japanese Patent Laid-Open No. 10-2224099 JP-A-6-209200

  By the way, in a mounting apparatus that mounts an electronic component on a circuit board, the electronic component may be mounted at a position shifted from a predetermined position on the circuit board due to a slight operational abnormality. In addition, the electronic component is bounced off from the circuit board due to the impact at the time of contact with the circuit board, the contact with the solder paste is weak and it is held on the mounting nozzle without being mounted on the circuit board, etc. In some cases, electronic components are not properly mounted on the circuit board.

  If the mounting state of the electronic component is inspected after all the mounting of the electronic component to the circuit board is completed as in the past, even if it is found that the electronic component is not mounted normally, It was difficult to grasp the details of the mounting abnormality, such as whether an abnormality occurred in a different situation. In addition, in the inspection method using the circuit component mounting system disclosed in Patent Document 1, it is necessary to perform advanced image processing for analyzing reflected light of a plurality of slit lights in order to detect a shift in the mounting position of the circuit component. The configuration and arithmetic processing of the inspection apparatus and the calibration work become complicated.

  The present invention has been made in view of the above problems, and an object thereof is to easily detect an abnormal mounting of an electronic component for each mounting operation of the electronic component on a circuit board.

  The invention according to claim 1 is an electronic component mounting apparatus for mounting an electronic component on a circuit board, wherein the board holding unit for holding the circuit board, the heating unit for heating the electronic component, and the heated electronic component A mounting mechanism for mounting on the circuit board held by the board holding part, and a temperature distribution measuring part for measuring the temperature distribution of at least a part of the area on the circuit board held by the board holding part.

  The invention according to claim 2 is the electronic component mounting apparatus according to claim 1, wherein the temperature distribution measuring unit is an infrared thermography.

  A third aspect of the present invention is the electronic component mounting apparatus according to the second aspect, wherein the temperature distribution measuring unit is the main component on the side on which the electronic component of the circuit board held by the substrate holding unit is mounted. Located above the surface.

  The invention according to claim 4 is the electronic component mounting apparatus according to claim 2 or 3, wherein the entire circuit board held by the board holding part is included in the imaging range of the temperature distribution measuring part. .

  A fifth aspect of the present invention is the electronic component mounting apparatus according to any one of the first to fourth aspects, wherein the storage unit stores a standard temperature distribution in the region when the electronic component is normally mounted in advance. And a detection unit that detects a mounting abnormality by comparing the temperature distribution of the region acquired by the temperature distribution measurement unit with the standard temperature distribution.

  The invention according to claim 6 is an electronic component mounting apparatus for mounting an electronic component on a circuit board, and includes a substrate holding portion for holding the circuit substrate, a heating portion for heating the electronic component, and the heated electronic component. A mounting mechanism that mounts on the circuit board held by the substrate holding unit; and a temperature measurement unit that measures a temperature at a position where the electronic component is held in the mounting mechanism after the electronic component is mounted.

  The invention according to claim 7 is the electronic component mounting apparatus according to claim 6, wherein the temperature measured by the temperature measuring unit is compared with a preset threshold value, and the temperature is A detection unit is further provided for detecting a mounting abnormality when the threshold is higher than the threshold value.

  The invention according to claim 8 is the electronic component mounting apparatus according to any one of claims 1 to 7, wherein the heating unit heats the electronic component by bringing the heating portion into contact with the electronic component.

  A ninth aspect of the present invention is the electronic component mounting apparatus according to the eighth aspect, wherein the heating unit is a component holding unit that holds an electronic component by the mounting mechanism.

  A tenth aspect of the present invention is the electronic component mounting apparatus according to any one of the first to seventh aspects, wherein the mounting mechanism includes a component holding portion for holding an electronic component, and the component holding portion as a circuit board. The heating unit heats the electronic component when the component holding unit holding the electronic component moves.

  The invention according to claim 11 is an electronic component mounting method for mounting an electronic component on a circuit board, wherein a) a step of holding the circuit board in a predetermined position, b) a step of heating the electronic component, and c) Mounting the heated electronic component on the circuit board; and d) measuring a temperature distribution in at least a partial region on the circuit board.

  The invention according to claim 12 is an electronic component mounting method for mounting an electronic component on a circuit board, wherein a) a step of holding the circuit board in a predetermined position, b) a step of heating the electronic component, and c) B) a step in which a mounting mechanism holds the electronic component before or after the step; d) a step in which the mounting mechanism mounts the electronic component on the circuit board; and e) a step in which the electronic component is held in the mounting mechanism. And a step of measuring the temperature of the position that has been performed.

  In the present invention, it is possible to easily detect an abnormal mounting of an electronic component for each mounting operation of the electronic component on the circuit board.

  In the first and eleventh aspects of the present invention, it is possible to inspect the mounting state of the electronic component on the circuit board.

  In the invention of claim 2, the temperature distribution of the circuit board can be easily measured.

  In the invention of claim 3, the mounting state of the electronic component can be more reliably inspected.

  In the invention of claim 4, the configuration relating to the measurement of the temperature distribution of the circuit board can be simplified.

  In the invention of claim 5, the mounting state of the electronic component can be automatically inspected.

  In the inventions of claims 6 and 12, it is possible to easily inspect whether or not the electronic component is held in the mounting mechanism after the electronic component is mounted.

  In the invention of claim 7, it is possible to automatically inspect whether or not the electronic component is held in the mounting mechanism after the electronic component is mounted.

  In the invention of claim 8, the electronic component can be efficiently heated.

  In the invention of claim 9, the structure of the electronic component mounting apparatus can be simplified.

  In the invention of claim 10, the time required from heating to mounting of the electronic component can be shortened.

  FIG. 1 is a perspective view showing a configuration of an electronic component mounting apparatus 1 according to the first embodiment of the present invention. The electronic component mounting apparatus 1 is a device for mounting fine electronic components on a solder paste applied on a circuit board 9 such as a printed circuit board.

  The electronic component mounting apparatus 1 holds a circuit board 9 and transports it in the (+ X) direction in FIG. 1, and two mountings for mounting electronic components on the circuit board 9 held by the board holding unit 2 A mechanism 4, a component supply unit 3 that supplies electronic components to the mounting mechanism 4, and a control unit 8 that controls these components are provided.

  The board holding unit 2 includes a pair of guide rails 21 extending in the X direction on the base 20, and the circuit board 9 held by the guide rails 21 is (+ X) direction by a belt provided in the guide rails 21. To be transported. The substrate holding unit 2 includes a conveyance driving unit 22 to which the guide rail 21 is connected. The conveyance driving unit 22 changes the distance between the pair of guide rails 21 and drives the belt in the guide rail 21. Do. A printing device (not shown) for printing solder paste on the circuit board 9 is disposed on the (−X) side of the guide rail 21, and the circuit board 9 is passed from the printing device to the guide rail 21.

  The two mounting mechanisms 4 are arranged above the guide rail 21 so as to be aligned in the X direction in FIG. 1 (that is, the direction along the moving direction of the circuit board 9). A head moving mechanism 42 is provided that moves 41 within the XY plane (that is, along the main surface of the circuit board 9). The head portion moving mechanism 42 includes an X direction moving mechanism 421 that moves the head portion 41 in the X direction, and a Y direction moving mechanism 422 that moves the X direction moving mechanism 421 in the Y direction. The Y-direction moving mechanism 422 uses a linear motor (not shown) as a drive source. In FIG. 1, the frame that supports the mounting mechanism 4 and the like is not shown.

  The component supply unit 3 includes a plurality of component cassettes 31 arranged in the X direction. Each component cassette 31 is disposed on the (+ Y) side of the head portion 41, and has a reel 32 around which a tape member for arranging and holding a plurality of electronic components is wound. An infrared thermography 51 is disposed on the (−Y) side of each mounting mechanism 4, and the infrared thermography 51 is fixed to a frame (not shown).

  FIG. 2 is a bottom view of the two mounting mechanisms 4 and the infrared thermography 51 as viewed from below ((−Z) side). The head portion 41 of the mounting mechanism 4 includes ten suction nozzles 45 that are component holding portions that receive and hold electronic components from the component cassette 31 by suction. As shown in FIG. 2, in the head portion 41, five suction nozzles 45 are arranged in one row along the X direction, and another row (five) suction nozzles 45 are parallel to the suction nozzle 45. Be placed. In the mounting mechanism 4, the head portion moving mechanism 42 (X direction moving mechanism 421 and Y direction moving mechanism 422) moves the head portion 41 along the main surface of the circuit board 9 (see FIG. 1), whereby the suction nozzle 45. Moves relative to the circuit board 9.

  FIG. 3 is a right side view of the mounting mechanism 4 as viewed from the (−X) side, and also shows an infrared thermography 51 as in FIG. 2. The suction nozzles 45 of the head unit 41 can move independently in the vertical direction (Z direction) and can rotate about an axis facing the Z direction. As a result, the electronic component sucked by the suction nozzle 45 can be mounted on the circuit board 9 in various directions.

  4 and 5 are enlarged views showing the vicinity of one suction nozzle 45. FIG. 4 is a view seen from the (−X) side, and FIG. 5 is a view seen from the (−Y) side. 4 and 5, for convenience of illustration, a part of the nozzle chuck 410 to which the suction nozzle 45 is attached (part indicated by parallel oblique lines) is shown in cross section.

  As shown in FIGS. 4 and 5, an opening (hereinafter referred to as “suction port”) 450 for sucking electronic components by vacuum suction is formed at the lower end (tip on the (−Z) side) of the suction nozzle 45. In addition, a suction path 451 for vacuum suction extending substantially along the Z direction is provided at the center of the suction nozzle 45. Further, the suction nozzle 45 can be replaced in accordance with the type of electronic component to be sucked, and is fixed to the nozzle chuck 410 by a locking portion 411 shown in FIG.

  The nozzle chuck 410 shown in FIGS. 4 and 5 is formed with two through holes 412 that penetrate the nozzle chuck 410 in the Y direction. Each through hole 412 has a resistance heating wire such as a nichrome wire inside. The arranged heater 413 is inserted. In the electronic component mounting apparatus 1, the suction nozzle 45 is heated by the heater 413, whereby the electronic component sucked and held by the suction nozzle 45 is heated. In other words, the suction nozzle 45 that is a component holding unit that holds an electronic component by the mounting mechanism 4 (see FIG. 1) is also a heating unit that heats the held electronic component.

  The infrared thermography 51 shown in FIGS. 1 to 3 functions as a temperature distribution measuring unit that measures the temperature distribution on the circuit board 9 held by the board holding unit 2. The infrared thermography 51 moves the head portion above the main surface on the side ((+ Z) side) on which the electronic component of the circuit board 9 held by the substrate holding portion 2 is mounted so as not to interfere with the movement of the head portion 41. Two infrared thermographs 51 are arranged on the (−Y) side of the mechanism 42, and the temperature distribution is measured by imaging the circuit board 9 on which the electronic component heated by the mounting mechanism 4 is mounted. The infrared thermography 51 is arranged so that the entire circuit board 9 held by the board holding unit 2 is included in the imaging range, and the circuit board 9 is obliquely upward (from the (−Y) side and from the (+ Z) side). Take an image.

  Moreover, the electronic component mounting apparatus 1 shown in FIG. 1 further includes an arithmetic unit 60. A board in the arithmetic unit 60 has a memory 61 for storing various information, information stored in the memory 61, and infrared rays. Based on the output from the thermography 51, a detection circuit 62 for detecting an abnormal mounting of the electronic component on the circuit board 9 is provided.

  FIG. 6 is a diagram showing an operation flow of the electronic component mounting apparatus 1 when mounting electronic components on the circuit board 9. Hereinafter, the operation of the electronic component mounting apparatus 1 will be described with reference to FIG. 6 and other drawings. In the electronic component mounting apparatus 1, electronic components are normally mounted on two circuit boards 9 in parallel by two mounting mechanisms 4. However, for convenience of explanation, one circuit board 9 is mounted by one mounting mechanism 4. The manner in which electronic components are mounted will be described. Further, steps S21 to S28 in FIG. 6 are repeated, but the flow of the repetitive operation is not shown.

  When the electronic component is mounted on the circuit board 9 by the electronic component mounting apparatus 1, the circuit board 9 to which the solder paste is applied at a plurality of positions on the upper surface is positioned on the (−X) side of the electronic component mounting apparatus 1. It is received by the guide rail 21 from the printing apparatus, and is conveyed and held almost below the mounting mechanism 4 by the belt (step S11). Subsequently, the component supply unit 3 is controlled by the control unit 8, and the tape member is fed from the reel 32 to the tip of the component cassette 31 on the (−Y) side (guide rail 21 side), whereby the electronic component is guided to the guide rail. It is supplied to the 21 side. The head unit 41 is moved in advance to the component supply unit 3 side by the head unit moving mechanism 42 controlled by the control unit 8, and is positioned above the supplied electronic component.

  Next, the suction nozzle 45 is lowered toward the component cassette 31, and the electronic component disposed on the tape member of the component cassette 31 is held at the tip of the suction nozzle 45 by vacuum suction (step S21). The suction nozzle 45 is preheated by the heater 413, and the electronic component sucked and held by the suction nozzle 45 is heated by contacting the tip of the suction nozzle 45, which is a heating part (step S22). In the head unit 41, the electronic components may be held by all of the ten suction nozzles 45, or may be held only by some of the suction nozzles 45.

  After sucking and holding the electronic component, the head portion 41 is moved to a predetermined position by the head portion moving mechanism 42 and held by a camera (not shown) (the posture of the sucked and held electronic component and the position at the tip of the suction nozzle 45). Is confirmed, and the suction nozzle 45 is rotated around an axis facing the Z direction to correct the posture of the electronic component (step S23). Thereafter, the head portion 41 moves above the circuit board 9 held by the board holding portion 2, and the suction nozzle 45 and the held electronic component are located at positions facing the mounting position to which the solder paste is applied. (Step S24). Then, under the control of the control unit 8, the suction nozzle 45 is lowered toward the circuit board 9, the vacuum suction is released, and the electronic component held at the tip of the suction nozzle 45 is mounted on the solder paste on the circuit board 9. (Step S25), the suction nozzle 45 rises and returns to the original position.

  The electronic component held by the suction nozzle 45 is corrected during the operation of mounting the electronic component on the circuit board 9 after correcting the posture of the electronic component (steps S23 to S25), that is, when the suction nozzle 45 is moved. Also, the temperature of the electronic component immediately after being mounted on the circuit board 9 is equal to or higher than the temperature at which the electronic component can be identified by the infrared thermography 51 and the solder paste is heated. The temperature is set to be equal to or lower than the temperature at which it does not melt (in this embodiment, the temperature is about 100 ° C.).

  When all the electronic components held by the plurality of suction nozzles 45 of the head portion 41 are mounted on the circuit board 9, the head portion 41 is moved by the head portion moving mechanism 42 and returned to the component supply portion 3 side (step). S26), the circuit board 9 on which the heated electronic component is mounted is imaged by the infrared thermography 51, and the temperature distribution of the circuit board 9 is measured (step S27).

  FIG. 7 is a diagram showing the temperature distribution (hereinafter referred to as “measured temperature distribution”) of the circuit board 9 acquired by the infrared thermography 51 (see FIG. 1). After the electronic component 91 heated by the suction nozzle 45 (see FIG. 3) is mounted on the circuit board 9, it dissipates heat with the passage of time, and finally reaches substantially the same temperature as the circuit board 9. Electronic components 91a and 91b shown with parallel oblique lines in FIG. 7 are electronic components immediately after mounting whose temperature is sufficiently higher than the circuit board 9, and other electronic components 91 without parallel oblique lines are electronic components 91a. , 91b is an electronic component that is mounted one cycle or more before and naturally cooled to substantially the same temperature as the circuit board 9. In FIG. 7, since the electronic component 91b mounted after the electronic component 91a has a higher temperature than the electronic component 91a, it is indicated by a thick diagonal line. Further, although it is actually difficult to identify the outline of the electronic component 91 whose temperature has dropped to almost the same temperature as the circuit board 9 by the infrared thermography 51, the outline is shown in FIG. 7 for convenience of illustration. .

  In the electronic component mounting apparatus 1 shown in FIG. 1, the measured temperature distribution is transmitted from the infrared thermography 51 to the detection circuit 62 each time an image is captured by the infrared thermography 51, and the standard temperature distribution stored in the memory 61 in advance in the detection circuit 62. (That is, the temperature distribution in the circuit board 9 when the electronic component 91 is normally mounted) and the mounting state of the electronic component 91 on the circuit board 9 (that is, the presence or absence of the electronic component 91 at a predetermined mounting position) In addition, the actual mounting position and orientation when mounted) are inspected. If an abnormality occurs in the mounting of the electronic component 91 on the circuit board 9, the detection circuit 62 detects the difference between the measured temperature distribution and the standard temperature distribution, and detects the mounting abnormality of the electronic component 91 (step S28). .

  The abnormal mounting of the electronic component 91 can be broadly divided into a mounting omission in which the electronic component 91 is not mounted at a predetermined mounting position on the circuit board 9 (illustrated by reference numeral 92c in FIG. 7), and on the circuit board 9. There is a positional shift in which the mounting position of the electronic component 91 deviates from the planned mounting position. The cause of the mounting leakage is that the electronic component 91 is brought back to the original position while being held by the suction nozzle 45 due to defective application of the solder paste applied on the circuit board 9 during mounting (hereinafter, “ There is a method in which the electronic component 91 is sandwiched between the suction nozzle 45 and the circuit board 9 and then flipped (hereinafter referred to as “electronic component jump”).

  In the detection circuit 62, based on the measured temperature distribution and the standard temperature distribution in the entire region on the circuit board 9, the difference obtained by subtracting the corresponding pixel value of the image showing the standard temperature distribution from each pixel value of the image showing the measured temperature distribution. An image is required. In the difference image, when a region where the absolute value of the pixel value is large overlaps with the planned mounting position, the detection circuit 62 determines that there is a mounting omission in which the electronic component 91 that should be present does not exist. Then, the number of the suction nozzle 45 corresponding to the planned mounting position is specified.

  Here, if there is a region where the absolute value of the pixel value is large at a place unrelated to the mounting position in the difference image, it is determined that the electronic component 91 scheduled to be mounted exists in this region, and the cause of mounting omission is the electronic component. It is further determined that this is a jump.

  On the other hand, in the difference image, when the region where the absolute value of the pixel value is large does not cover the entire mounting position, the detection circuit 62 determines that the position and orientation of the electronic component 91 that should be present deviate from the mounting position. . Then, the number of the suction nozzle 45 corresponding to the planned mounting position is specified.

  In addition to the generation of the difference image, the detection circuit 62 may obtain the histogram and the center of gravity position of the measured temperature distribution image and the standard temperature distribution image, and compare the measured temperature distribution with the standard temperature distribution. For example, when the histograms are the same but the positions of the center of gravity are slightly different, it is determined that the electronic component is misaligned, and when the positions of the center of gravity are greatly different, it may be determined that the electronic component is jumping. Furthermore, when the histograms are different, it may be determined that the electronic component is not installed. As described above, various methods can be adopted for comparison between the measured temperature distribution and the standard temperature distribution.

  In the electronic component mounting apparatus 1, when the above-described mounting abnormality is detected, the mounting operation of the electronic component 91 is stopped, and the operator is notified of the number of the suction nozzle 45 in which the mounting abnormality has occurred. When the cause of the mounting abnormality is investigated, maintenance of the apparatus is performed if necessary. If no mounting abnormality is detected, it is checked whether or not all the electronic components 91 have been mounted on the circuit board 9. If not, new electronic components 91 are sucked by the suction nozzle 45. Holding and heating, the mounting of the electronic component 91 on the circuit board 9, the imaging of the circuit board 9 by the infrared thermography 51, and the inspection of the mounting state are repeated (steps S21 to S28).

  When all the mounting of the electronic component 91 by the mounting mechanism 4 is completed on one circuit board 9, the circuit board 9 is conveyed downstream by the guide rail 21. That is, the circuit board 9 on which the mounting of the electronic component 91 by the mounting mechanism 4 on the (−X) side in FIG. 1 is completed is transported below the mounting mechanism 4 on the (+ X) side to mount and mount the electronic component 91. The state inspection is repeatedly performed, and the circuit board 9 on which the mounting of the electronic component 91 by the mounting mechanism 4 on the (+ X) side is completed is carried out from the guide rail 21 to another device (for example, a reflow device) downstream.

  As described above, in the electronic component mounting apparatus 1, the electronic component 91 is mounted once on the circuit board 9 (when the head unit 41 holds a plurality of electronic components 91, a plurality of electronic components 91 are mounted. Is mounted), the temperature distribution of the circuit board 9 is measured and compared with the standard temperature distribution to inspect the mounting state of the electronic component 91 on the circuit board 9 and the electronic component 91 on the circuit board 9 is inspected. An abnormal mounting of the electronic component 91 can be easily detected for each mounting operation (ie, an operation in which the electronic component 91 is sucked and held by the suction nozzle 45 and heated and mounted on the circuit board 9). As a result, it is possible to prevent the circuit board 9 in which the mounting abnormality has occurred from being sent to the next process. Further, it is possible to identify the suction nozzle 45 in which the mounting abnormality has occurred and the specific mode of mounting abnormality (such as mounting omission or mounting displacement of the electronic component 91), and the electronic component mounting apparatus 1 can be quickly maintained. Thus, the recurrence of the same mounting abnormality can be efficiently prevented.

  In the electronic component mounting apparatus 1, the temperature distribution of the circuit board 9 can be easily measured by using the infrared thermography 51. Furthermore, when various types of electronic components of various colors and shapes are mounted on the circuit board 9, the electronic components are compared with the case of inspecting the mounting state of the electronic components based on image information from a normal camera. Since visual information (color arrangement, shape, etc.) for identifying the components is not necessary, the mounting state of the electronic component 91 can be easily inspected.

  In the electronic component mounting apparatus 1, the circuit board 9 and the mounted electronic component 91 are directly captured (an obstacle between the electronic component 91 and the infrared thermography 51) by imaging the circuit board 9 obliquely from above with the infrared thermography 51. Therefore, the mounting state of the electronic component 91 can be more reliably inspected. Note that when the electronic component 91 is bounced off by the circuit board 9 and dropped onto the circuit board 9 at the time of mounting, the dropping position of the electronic component 91 can be specified.

  Further, by imaging the entire circuit board 9 with one infrared thermography 51, the infrared thermography 51 can be moved even when the electronic component 91 is mounted at various locations on the circuit board 9. Therefore, it is possible to simplify the configuration related to the measurement of the temperature distribution of the circuit board 9.

  Furthermore, since the detection temperature 62 compares the measured temperature distribution of the circuit board 9 with the standard temperature distribution, the mounting state of the electronic component 91 on the circuit board 9 can be easily and automatically inspected. When abnormalities such as mounting omissions and mounting deviations occur, these mounting abnormalities can be automatically detected.

  In the electronic component mounting apparatus 1, since the nozzle tip 452 of the suction nozzle 45 heated by the heater 413 is brought into contact with the electronic component 91 and heated, the electronic component 91 can be efficiently heated. Further, the suction nozzle 45 realizes both functions of a heating unit that heats the electronic component 91 and a component holding unit that holds the electronic component 91 by the mounting mechanism 4 that mounts the electronic component 91 on the circuit board 9. Therefore, the structure of the electronic component mounting apparatus 1 can be simplified. Furthermore, since the electronic component 91 is continuously heated by the suction nozzle 45 until the electronic component 91 is picked up from the component cassette 31 and mounted on the circuit board 9, compared with a case where a step for heating the electronic component 91 is provided separately. The time required from heating to mounting of the electronic component 91 can be shortened.

  FIG. 8 is a perspective view showing a configuration of an electronic component mounting apparatus 1a according to the second embodiment. The electronic component mounting apparatus 1a has only two corresponding to the four radiation thermometers 51a ((-X) side mounting mechanism 4) instead of the two infrared thermography 51 of the electronic component mounting apparatus 1 shown in FIG. Is shown). Other basic configurations are the same as those in FIG. 1, and the same reference numerals are given in the following description. FIG. 9 is a right side view showing the mounting mechanism 4 and the radiation thermometer 51a of the electronic component mounting apparatus 1a.

  The radiation thermometer 51a shown in FIGS. 8 and 9 is near the tip of the suction nozzle 45 (see FIG. 9) of the mounting mechanism 4 (more precisely, at a position where the electronic component is suction-held by the suction nozzle 45 in the mounting mechanism 4). Yes, hereinafter referred to as “component holding position”), and a temperature measuring unit that measures the temperature of the circuit board 9 held by the board holding unit 2 (see FIG. 8) for each of the two mounting mechanisms 4. Approximately two are provided on the side. Each radiation thermometer 51a is attached to a frame not shown. For one mounting mechanism 4, as shown in FIG. 9, one radiation thermometer 51 a is arranged on the (−X) side and (−Y) side of the head portion 41 located above the circuit board 9. The other radiation thermometer 51a is arranged on the (−X) side and the (+ Y) side of the head portion 41. Similarly, two radiation thermometers 51a are arranged on the (+ X) side of the mounting mechanism 4 on the (+ X) side in FIG.

  Since the measurement area of the radiation thermometer 51a is very small, so-called spot measurement is performed, the temperature of each component holding position is measured while moving the head unit 41 in the X direction. Specifically, while the head unit 41 is moved, the temperature measurement of the component holding positions of the five suction nozzles 45 on the (−Y) side of the head unit 41 is sequentially performed by the radiation thermometer 51a on the (−Y) side, In parallel with this, the (+ Y) side radiation thermometer 51a sequentially measures the temperatures of the component holding positions of the five (+ Y) side suction nozzles 45.

  FIG. 10 is a diagram illustrating an operation flow of the electronic component mounting apparatus 1a when mounting electronic components on the circuit board 9. Hereinafter, the operation of the electronic component mounting apparatus 1a will be described with reference to FIG. 10 and other drawings. An operation common to the operation of the electronic component mounting apparatus 1 shown in FIG. 6 will be briefly described.

  When the electronic component is mounted on the circuit board 9 by the electronic component mounting apparatus 1a shown in FIG. 8, the circuit board 9 to which the solder paste is applied is first held by the guide rail 21 and positioned approximately below the mounting mechanism 4. Then, the electronic component supplied by the component supply unit 3 is sucked and held by the suction nozzle 45 (see FIG. 9) of the mounting mechanism 4 (step S41), and the suction nozzle 45 heated in advance is used. The electronic component is continuously heated (step S42). Next, after the posture of the electronic component is corrected by the rotation of the suction nozzle 45 (step S43), the head unit 41 moves above the circuit board 9 (step S44), and the suction nozzle is controlled by the control unit 8. 45 is lowered toward the circuit board 9, the vacuum suction is released, and the electronic component held at the tip of the suction nozzle 45 is mounted on the solder paste on the circuit board 9 (step S45).

  When all of the electronic components held by the plurality of suction nozzles 45 of the head portion 41 are mounted on the circuit board 9, the temperature of each component holding position of the suction nozzle 45 that has risen and returned to the original position is a radiation thermometer. Measurement is sequentially performed by 51a (step S46). Thereafter, the head unit 41 is moved by the head unit moving mechanism 42 and returned to the component supply unit 3 side (step S47), and the measurement result by the radiation thermometer 51a is transmitted to the detection circuit 62.

  In the detection circuit 62, the temperature measured by the radiation thermometer 51a (hereinafter referred to as “measured temperature”) and a threshold value set in advance and stored in the memory 61 (preset in the detection circuit 62). May be compared). The threshold value is approximately halfway between the temperature of the component holding position when the electronic component is not held at the tip of the high-temperature suction nozzle 45 that is the heating unit and the temperature of the component holding position when the electronic component is held. It is a value indicating the temperature. Accordingly, if the electronic component is separated from the tip of the suction nozzle 45 in step S45 for mounting the electronic component on the circuit board 9, the measured temperature becomes lower than the threshold value, and if the electronic component is taken home, 11, the high-temperature electronic component 91 exists at the component holding position 45 a of the suction nozzle 45, so that the measured temperature becomes higher than the threshold value. As described above, the detection circuit 62 shown in FIG. 8 compares the measured temperature with the threshold value to detect the take-out of the electronic component 91 when the measured temperature is higher than the threshold value (step S48). A mounting abnormality such as mounting leakage of the electronic component 91 on the circuit board 9 and the number of the corresponding suction nozzle 45 are detected.

  In the electronic component mounting apparatus 1a, when the mounting abnormality as described above is detected, the mounting operation of the electronic component 91 is stopped, and the operator is notified of the number of the suction nozzle 45 in which the mounting abnormality has occurred. When the cause of the mounting abnormality is investigated, maintenance of the apparatus is performed if necessary. If no mounting abnormality is detected, it is checked whether or not all the electronic components 91 have been mounted on the circuit board 9. If not, new electronic components 91 are sucked by the suction nozzle 45. Holding and heating, the mounting of the electronic component 91 on the circuit board 9, the temperature measurement of the component holding position, and the detection of the take-back of the electronic component 91 are repeated (steps S 41 to S 48).

  When all the mounting of the electronic component 91 by the mounting mechanism 4 is completed on one circuit board 9, the circuit board 9 is connected to the upstream mounting mechanism 4 by the guide rail 21 as in the case of the electronic component mounting apparatus 1 of FIG. To the downstream mounting mechanism 4 or from the downstream mounting mechanism 4 to the downstream reflow device.

  As described above, in the electronic component mounting apparatus 1a, each time mounting of the electronic component 91 on the circuit board 9 is completed, the temperature of the component holding position of the suction nozzle 45 is measured and compared with the threshold value. Thus, it is inspected whether the electronic component 91 is held in the mounting mechanism 4 after the electronic component 91 is mounted (that is, whether the electronic component 91 has been taken home), and the electronic component 91 with respect to the circuit board 9 is checked. The mounting abnormality of the electronic component 91 can be easily detected for each mounting operation. As a result, it is possible to prevent the circuit board 9 in which the mounting abnormality has occurred from being sent to the next process, and to reduce the burden of inspection of the mounting state on the circuit board 9. Furthermore, the suction nozzle 45 in which the electronic component 91 has been taken home can be quickly grasped, and maintenance and countermeasures of the electronic component mounting apparatus 1a can be performed quickly and efficiently.

  Moreover, since the detection circuit 62 compares the measured temperature of the circuit board 9 with the threshold value, it is easily and automatically inspected whether or not the electronic component 91 is held in the mounting mechanism 4 after the electronic component 91 is mounted. It is possible to automatically detect mounting abnormality (mounting omission) of the electronic component 91.

  In the electronic component mounting apparatus 1a, similarly to the electronic component mounting apparatus 1, since the nozzle tip 452 is brought into contact with the electronic component 91 and heated, the electronic component 91 can be efficiently heated. Further, since the electronic component 91 can be heated while being held by the suction nozzle 45, the structure of the electronic component mounting apparatus 1a can be simplified. Furthermore, since the electronic component 91 is continuously heated until it is mounted on the circuit board 9, the time required from heating to mounting of the electronic component 91 compared to a case where a separate process for heating the electronic component 91 is provided. Can be shortened.

  As mentioned above, although embodiment of this invention has been described, this invention is not limited to the said embodiment, A various change is possible. For example, the electronic component 91 may be held by another component holding unit such as a mechanical chuck.

  In the electronic component mounting apparatus, from the viewpoint of simplifying the structure of the apparatus, the electronic component 91 is preferably heated by the suction nozzle 45 that holds the electronic component 91. If it is difficult, the electronic component 91 may be heated by another configuration (for example, a heating stage on which the electronic component 91 is temporarily placed).

  In addition, the electronic component 91 does not necessarily have to be heated by contact with a heating part (in the above embodiment, the nozzle tip 452), and is heated in a non-contact manner by a heating unit provided at a position away from the electronic component 91. May be. For example, it may be heated by radiant heat from a heat source that moves with the suction nozzle 45, and the irradiation position of light from a light source fixed at a predetermined location of the head portion 41 moves with the electronic component 91 and is heated by light irradiation. May be.

  Further, the electronic component 91 may be preheated before being held by the suction nozzle 45 in the component cassette 31 or the like of the component supply unit 3 (or a component tray when a component tray is provided instead of the component cassette 31). Well, in the case of a device in which the electronic component 91 is placed on the mounting table before mounting on the circuit board 9 like a device for mounting various kinds of large-sized electronic components, it is heated while being mounted on the mounting table. Also good.

  In the electronic component mounting apparatus 1, when the circuit board 9 is an infrared transmissive semiconductor chip and the semiconductor chip is mounted on the semiconductor chip by the mounting mechanism 4 (that is, when the object is a semiconductor chip module), Since the circuit board 9 transmits infrared rays, the high-temperature electronic component 91 mounted on the circuit board 9 can be imaged from the side opposite to the mounted side. Therefore, the infrared thermography 51 can be arranged below the circuit board 9 (on the (−Z) side in FIG. 1), and the circuit board 9 can be imaged from below. In the electronic component mounting apparatus 1, the temperature distribution of the circuit board 9 may be measured by a measuring device other than the infrared thermography 51.

  In the electronic component mounting apparatus 1, the temperature distribution of the entire circuit board 9 does not necessarily have to be measured. From the viewpoint of inspecting the mounting state of the electronic component 91 immediately after being mounted, at least the electronic immediately after the mounting is performed. It is only necessary to measure the temperature distribution in a part of the area on the circuit board 9 in the vicinity of the component 91. Alternatively, the entire area of the circuit board 9 may be always measured, and only the data of the area to be inspected may be extracted by the detection circuit 62 and inspected. A mounting device in which the circuit board 9 moves and the mounting position does not move (for example, a plurality of suction nozzles are mounted on the circumference of the rotary head, and the rotary head is rotated to sequentially position the plurality of suction nozzles at a predetermined mounting position. In addition, in the case of a so-called rotary type mounting device in which electronic components are mounted by moving the circuit board relative to the mounting position, the measurement location does not need to be moved. Only the temperature distribution (or temperature) may be measured.

  In the electronic component mounting apparatus 1a, an array of radiation thermometers that simultaneously measure the temperatures of the component holding positions of the plurality of suction nozzles 45 may be provided, and the temperature (or temperature distribution) is measured by another measuring device such as infrared thermography. May be measured.

The perspective view which shows the structure of the electronic component mounting apparatus which concerns on 1st Embodiment. Bottom view showing the mounting mechanism Right side view showing the mounting mechanism Figure showing enlarged suction nozzle Figure showing enlarged suction nozzle The figure which shows the flow of operation of an electronic component mounting device Diagram showing temperature distribution of circuit board The figure which shows the mounting mechanism and radiation thermometer of the electronic component mounting apparatus which concern on 2nd Embodiment. Right side view showing mounting mechanism and radiation thermometer The figure which shows the flow of operation of an electronic component mounting device Figure showing how electronic parts are taken home

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,1a Electronic component mounting apparatus 2 Board | substrate holding part 4 Mounting mechanism 9 Circuit board 42 Head part moving mechanism 45 Adsorption nozzle 45a Component holding position 51 Infrared thermography 51a Radiation thermometer 61 Memory 62 Detection circuit 91, 91a, 91b Electronic component S11, Steps S21 to S28, S31, S41 to S48

Claims (12)

An electronic component mounting apparatus for mounting electronic components on a circuit board,
A board holding unit for holding a circuit board;
A heating unit for heating the electronic components;
A mounting mechanism for mounting the heated electronic component on the circuit board held by the board holding unit;
A temperature distribution measuring unit that measures the temperature distribution of at least a part of the region on the circuit board held by the substrate holding unit;
An electronic component mounting apparatus comprising: The electronic component mounting apparatus according to claim 1,
The electronic component mounting apparatus, wherein the temperature distribution measuring unit is an infrared thermography. The electronic component mounting apparatus according to claim 2,
The electronic component mounting apparatus, wherein the temperature distribution measuring unit is disposed above a main surface of the circuit board held on the board holding unit on the side where the electronic component is mounted. It is an electronic component mounting apparatus of Claim 2 or 3,
The electronic component mounting apparatus, wherein the entire circuit board held by the board holding unit is included in an imaging range of the temperature distribution measuring unit. An electronic component mounting apparatus according to any one of claims 1 to 4,
A storage unit for storing a standard temperature distribution in the region when electronic components are normally mounted in advance;
A detection unit for detecting a mounting abnormality by comparing the temperature distribution of the region acquired by the temperature distribution measurement unit with the standard temperature distribution;
An electronic component mounting apparatus, further comprising: An electronic component mounting apparatus for mounting electronic components on a circuit board,
A board holding unit for holding a circuit board;
A heating unit for heating the electronic components;
A mounting mechanism for mounting the heated electronic component on the circuit board held by the board holding unit;
A temperature measuring unit that measures the temperature of the position where the electronic component is held in the mounting mechanism after mounting the electronic component;
An electronic component mounting apparatus comprising: It is an electronic component mounting apparatus of Claim 6, Comprising:
It further comprises a detection unit that compares the temperature measured by the temperature measurement unit with a preset threshold value and detects a mounting abnormality when the temperature is higher than the threshold value. Electronic component mounting device. The electronic component mounting apparatus according to any one of claims 1 to 7,
The electronic component mounting apparatus, wherein the heating unit heats the electronic component by bringing a heating portion into contact with the electronic component. It is an electronic component mounting apparatus of Claim 8, Comprising:
The electronic component mounting apparatus, wherein the heating unit is a component holding unit that holds an electronic component by the mounting mechanism. The electronic component mounting apparatus according to any one of claims 1 to 7,
The mounting mechanism is
A component holding unit for holding electronic components;
A moving mechanism for moving the component holder relative to the circuit board;
With
The electronic component mounting apparatus, wherein the heating unit heats the electronic component when the component holding unit holding the electronic component is moved. An electronic component mounting method for mounting an electronic component on a circuit board,
a) holding the circuit board in place;
b) heating the electronic component;
c) attaching the heated electronic component to the circuit board;
d) measuring a temperature distribution of at least a partial region on the circuit board;
An electronic component mounting method comprising the steps of: An electronic component mounting method for mounting an electronic component on a circuit board,
a) holding the circuit board in place;
b) heating the electronic component;
c) a step in which a mounting mechanism holds the electronic component before or after the step b);
d) the mounting mechanism mounting the electronic component on the circuit board;
e) measuring the temperature of the position where the electronic component is held in the mounting mechanism;
An electronic component mounting method comprising the steps of:

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