JP2008066624A - Electronic component mounting device and electronic component packaging method - Google Patents

Electronic component mounting device and electronic component packaging method Download PDF

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Publication number
JP2008066624A
JP2008066624A JP2006245227A JP2006245227A JP2008066624A JP 2008066624 A JP2008066624 A JP 2008066624A JP 2006245227 A JP2006245227 A JP 2006245227A JP 2006245227 A JP2006245227 A JP 2006245227A JP 2008066624 A JP2008066624 A JP 2008066624A
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Prior art keywords
electronic component
mounting
solder
component
unit
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JP4797894B2 (en
Inventor
Kazuo Okamoto
一男 岡本
Shoichi Nishi
昭一 西
Takeshi Morita
健 森田
Masayoshi Hiyoshi
正宜 日吉
Kazuhiko Tomoyasu
和彦 友保
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Priority to JP2006245227A priority Critical patent/JP4797894B2/en
Priority claimed from DE112007002115T external-priority patent/DE112007002115T5/en
Publication of JP2008066624A publication Critical patent/JP2008066624A/en
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/35Mechanical effects
    • H01L2924/351Thermal stress
    • H01L2924/3511Warping

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting device and an electronic component packaging method in which poor joint can be prevented when an easy-to-warp electronic component is packaged by solder joint. <P>SOLUTION: When an electronic component 16 having a plurality of solder bumps 16a formed on the lower surface is packaged on a substrate, the electronic component mounting device forms a coating 7a having a film thickness distribution for transferring a desired amount of solder paste to each of a plurality of solder bumps depending on the state of warpage on a paste transfer unit 24 based on the component warpage information indicative of the state of warpage of the electronic component in the reflow process. Consequently, poor joint can be prevented when an easy-to-warp electronic component is packaged by solder joint by supplying a proper quantity of solder additionally to each solder bump 16a. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、半田バンプが形成された電子部品を基板に移送搭載して半田接合により実装するための電子部品搭載装置および電子部品実装方法に関するものである。   The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for transferring and mounting an electronic component on which a solder bump is formed on a substrate and mounting the electronic component by solder bonding.

半導体素子などの電子部品を回路基板に実装する形態として、半導体素子を樹脂基板に実装した半導体パッケージを半田バンプを介して回路基板に半田接合により実装する方法が用いられるようになっている。半田バンプを介して電子部品を基板に接合する半田接合においては、フラックスや半田ペーストなどの半田接合補助剤を半田バンプに供給した状態で半田バンプを基板の電極に着地させることが行われている。このため、電子部品搭載装置にはフラックスや半田ペーストを転写するための装置が配置される(例えば特許文献1参照)。
特開2005−305806号公報
As a form of mounting an electronic component such as a semiconductor element on a circuit board, a method of mounting a semiconductor package in which a semiconductor element is mounted on a resin board to a circuit board via solder bumps is used. In solder bonding in which an electronic component is bonded to a substrate via a solder bump, the solder bump is landed on the electrode of the substrate in a state where a solder bonding auxiliary agent such as flux or solder paste is supplied to the solder bump. . For this reason, a device for transferring flux and solder paste is disposed in the electronic component mounting device (see, for example, Patent Document 1).
JP-A-2005-305806

近年電子機器の小型化・高機能化の進展に伴い、電子機器に組み込まれる電子部品は、高実装密度が求められて小型化・薄化が進行している。このため回路基板やこの回路基板に実装される半導体パッケージも剛性が低下し加熱による反り変形を生じやすいものとなっている。このため、下面に半田バンプが形成された半導体パッケージを基板に搭載した後のリフロー過程において、反り変形を生じた部分の半田バンプが浮き上がって、基板の電極との間に隙間を生じる傾向にある。   In recent years, with the progress of miniaturization and high functionality of electronic devices, electronic components incorporated in the electronic devices are required to have a high mounting density and are miniaturized and thinned. For this reason, the circuit board and the semiconductor package mounted on the circuit board also have low rigidity and are likely to be warped by heating. For this reason, in the reflow process after mounting the semiconductor package having the solder bump formed on the lower surface on the substrate, the solder bump of the portion where the warp deformation has occurred tends to float and create a gap between the electrode of the substrate. .

このような半田バンプの浮き上がりに対しては半田ペーストの追加が有効であるが、上述の特許文献例のペースト膜形成装置では全ての半田バンプに対して均一厚さの塗膜によって半田ペーストを供給するようにしているため、反り変形による浮き上がりの程度によっては、ペーストの転写によってもなお半田バンプと電極との間の隙間をカバーすることができない。この結果、半田バンプが基板の接続用電極に正常に半田接合されず、導通不良や接合強度不足などの接合不良が生じやすい。   Although the addition of solder paste is effective for such solder bump lifting, the above-mentioned patent film example paste film forming apparatus supplies solder paste to all solder bumps with a uniform thickness coating film. Therefore, depending on the degree of lifting due to warpage deformation, the gap between the solder bump and the electrode cannot be covered even by transfer of the paste. As a result, the solder bumps are not properly soldered to the connection electrodes of the substrate, and bonding defects such as poor conduction and insufficient bonding strength are likely to occur.

そこで本発明は、反り変形を生じやすい電子部品を半田接合によって実装する場合における接合不良を防止することができる電子部品搭載装置および電子部品実装方法を提供することを目的とする。   Therefore, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of preventing a bonding failure when mounting an electronic component that is likely to be warped and deformed by solder bonding.

本発明の電子部品搭載装置は、下面に複数の半田バンプが形成された電子部品を基板に移送搭載する電子部品搭載装置であって、前記電子部品を供給する部品供給部と、前記基板を保持して位置決めする基板保持部と、前記部品供給部から電子部品を取り出して前記基板保持部に保持された基板に移送搭載する搭載ヘッドと、前記搭載ヘッドを前記部品供給部と基板保持部との間で移動させるヘッド移動手段と、前記電子部品のリフロー過程における反り変形の状態を示す部品反り情報を記憶する部品反り情報記憶部と、前記搭載ヘッドの移動経路に配設され、前記半田バンプに転写される半田ペーストの塗膜を塗膜形成面に形成し、前記搭載ヘッドに保持された電子部品を前記塗膜形成面に対して下降させることにより前記複数の半田バンプに半田ペーストを転写するためのペースト転写ユニットと、前記ペースト転写ユニットを制御する制御部とを備え、前記ペースト転写ユニットは、スキージ駆動部によって駆動されて前記塗膜形成面上で水平移動および垂直移動を組み合わせた成膜動作を行うスキージを有し、前記制御部が前記スキージ駆動部を前記部品反
り情報に基づいて制御することにより、前記複数の半田バンプのそれぞれに当該電子部品の前記反り変形の状態に応じた所望転写量の半田ペーストを転写するための膜厚分布の塗膜を形成する。
An electronic component mounting apparatus according to the present invention is an electronic component mounting apparatus that transports and mounts an electronic component having a plurality of solder bumps formed on its lower surface on a substrate, and holds the substrate with a component supply unit that supplies the electronic component A substrate holding unit for positioning, a mounting head for taking out an electronic component from the component supply unit and transferring and mounting it on the substrate held by the substrate holding unit, and the mounting head between the component supply unit and the substrate holding unit A head moving means that moves between the components, a component warp information storage unit that stores component warp information indicating a state of warp deformation in the reflow process of the electronic component, and a movement path of the mounting head. A coating film of the solder paste to be transferred is formed on the coating film forming surface, and the electronic parts held by the mounting head are lowered with respect to the coating film forming surface, thereby the plurality of solder bunches. A paste transfer unit for transferring the solder paste to the surface, and a control unit for controlling the paste transfer unit. The paste transfer unit is driven by a squeegee driving unit to move horizontally and vertically on the coating film forming surface. A squeegee that performs a film forming operation combined with movement, and the control unit controls the squeegee driving unit based on the component warp information, whereby the warp deformation of the electronic component is applied to each of the plurality of solder bumps. A coating film having a film thickness distribution for transferring a desired amount of solder paste according to the state is formed.

本発明の電子部品実装方法は、電子部品を供給する部品供給部と、前記基板を保持して位置決めする基板保持部と、前記部品供給部から電子部品を取り出して前記基板保持部に保持された基板に移送搭載する搭載ヘッドと、前記搭載ヘッドを前記部品供給部と基板保持部との間で移動させるヘッド移動手段と、前記電子部品のリフロー過程における反り変形状態を示す部品反り情報を記憶する部品反り情報記憶部と、前記搭載ヘッドの移動経路に配設され、前記塗膜形成面上で水平移動および垂直移動を組み合わせた成膜動作を行うスキージにより前記半田バンプに転写される半田ペーストの塗膜を塗膜形成面に形成するペースト転写ユニットと、前記ペースト転写ユニットを制御する制御部とを備えた電子部品搭載装置によって、下面に複数の半田バンプが形成された電子部品を基板に移送搭載して実装する電子部品実装方法であって、前記部品供給部から搭載ヘッドによって電子部品を取り出す工程と、前記ペースト転写ユニットの前記塗膜形成面に対して前記搭載ヘッドに保持された電子部品を下降させることにより、前記半田バンプに半田ペーストを転写するペースト転写工程と、前記電子部品を前記基板に搭載して前記半田バンプを前記基板の電極に前記半田ペーストを介して着地させる部品搭載工程とを含み、前記ペースト転写工程に先だって実行される前記成膜動作において、前記スキージを駆動するスキージ駆動部を前記制御部が前記部品反り情報に基づいて制御することにより、前記複数の半田バンプのそれぞれに当該電子部品の前記反り変形の状態に応じた所望転写量の半田ペーストを転写するための膜厚分布の塗膜を形成する。   The electronic component mounting method of the present invention includes a component supply unit that supplies an electronic component, a substrate holding unit that holds and positions the substrate, and an electronic component that is taken out from the component supply unit and held by the substrate holding unit. A mounting head to be transferred and mounted on the substrate, a head moving means for moving the mounting head between the component supply unit and the substrate holding unit, and component warpage information indicating a warp deformation state in a reflow process of the electronic component are stored. Solder paste transferred to the solder bumps by a squeegee that is disposed in a movement path of the component warpage information storage unit and the mounting head and performs a film forming operation combining horizontal movement and vertical movement on the coating film forming surface. The electronic component mounting apparatus including a paste transfer unit that forms a coating film on the coating film forming surface and a control unit that controls the paste transfer unit is used to copy An electronic component mounting method for mounting and mounting an electronic component on which a solder bump is formed on a substrate, the step of taking out the electronic component by a mounting head from the component supply unit, and the coating film formation of the paste transfer unit A step of transferring a solder paste onto the solder bump by lowering an electronic component held by the mounting head with respect to a surface; and mounting the electronic component on the substrate and attaching the solder bump to the substrate A component mounting step of landing on the electrode via the solder paste, and in the film forming operation performed prior to the paste transfer step, the control unit converts the squeegee driving unit that drives the squeegee into the component warpage information. Control based on the warp deformation state of the electronic component on each of the plurality of solder bumps. To form a coating film of film thickness distribution for transferring the transfer of solder paste.

本発明によれば、半田バンプに半田ペーストを供給するペースト転写工程に先だって実行される成膜動作において、複数の半田バンプのそれぞれに当該電子部品のリフロー過程における反り変形の状態に応じた所望転写量の半田ペーストを転写するための膜厚分布の塗膜を形成することにより、反り変形を生じやすい電子部品を半田接合によって実装する場合における接合不良を防止することができる。   According to the present invention, in a film forming operation performed prior to a paste transfer process for supplying a solder paste to a solder bump, a desired transfer corresponding to the state of warp deformation in the reflow process of the electronic component is applied to each of the plurality of solder bumps. By forming a coating film having a film thickness distribution for transferring an amount of solder paste, it is possible to prevent a bonding failure when an electronic component that is likely to be warped is mounted by solder bonding.

次に本発明の実施の形態を図面を参照して説明する。図1は本発明の一実施の形態の電子部品実装システムの構成を示すブロック図、図2は本発明の一実施の形態の電子部品実装システムにおける半田印刷の説明図、図3は本発明の一実施の形態の電子部品搭載装置の平面図、図4は本発明の一実施の形態の電子部品搭載装置におけるペースト転写ユニットの構造説明図、図5は本発明の一実施の形態の電子部品搭載装置におけるペースト転写ユニットの動作説明図、図6は本発明の一実施の形態の電子部品搭載装置の制御系の構成を示すブロック図、図7は本発明の一実施の形態の電子部品実装方法における部品反り情報およびスキージ移動データの説明図、図8は本発明の一実施の形態の電子部品実装方法を示すフロー図、図9、図10は本発明の一実施の形態の電子部品実装方法の工程説明図、図11は本発明の一実施の形態の電子部品実装方法における半田ペーストの転写量と半田接合不良との関係を示す説明図である。   Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a block diagram showing a configuration of an electronic component mounting system according to an embodiment of the present invention, FIG. 2 is an explanatory diagram of solder printing in the electronic component mounting system according to an embodiment of the present invention, and FIG. Fig. 4 is a plan view of an electronic component mounting apparatus according to an embodiment, Fig. 4 is a structural explanatory diagram of a paste transfer unit in the electronic component mounting apparatus according to an embodiment of the present invention, and Fig. 5 is an electronic component according to an embodiment of the present invention. FIG. 6 is a block diagram showing the configuration of the control system of the electronic component mounting apparatus according to the embodiment of the present invention, and FIG. 7 is the electronic component mounting according to the embodiment of the present invention. FIG. 8 is a flowchart showing an electronic component mounting method according to an embodiment of the present invention, and FIGS. 9 and 10 are electronic component mounting according to an embodiment of the present invention. Process theory of the method FIG, 11 is an explanatory diagram showing the relationship between the transfer amount of the solder paste and solder joint failure in the electronic component mounting method of an embodiment of the present invention.

まず図1を参照して電子部品実装システムについて説明する。図1において電子部品実装システムは、いずれも電子部品実装用装置である印刷装置M1、印刷検査装置M2、電子部品搭載装置M3、リフロー装置M4の各装置を連結して構成される電子部品実装ライン1を通信ネットワーク2によって接続し、全体を管理コンピュータ3によって制御する構成となっている。本実施の形態においては、これらの複数の電子部品実装用装置により、下面に外部接続用の複数の半田バンプが形成された電子部品を基板に半田接合によって実装して実装基板を製造する。なお管理コンピュータ3を使用せずに、各電子部品実装用
装置を通信ネットワーク2によって接続する構成でもよい。
First, an electronic component mounting system will be described with reference to FIG. In FIG. 1, the electronic component mounting system is an electronic component mounting line configured by connecting the printing device M1, the printing inspection device M2, the electronic component mounting device M3, and the reflow device M4, all of which are devices for mounting electronic components. 1 is connected by a communication network 2 and the whole is controlled by a management computer 3. In the present embodiment, an electronic component having a plurality of external connection solder bumps formed on the lower surface is mounted on the substrate by solder bonding using the plurality of electronic component mounting apparatuses to manufacture a mounting substrate. A configuration in which the electronic component mounting apparatuses are connected by the communication network 2 without using the management computer 3 may be employed.

印刷装置M1は、実装対象の基板に電子部品の半田バンプの配列に対応して形成された電極に、電子部品接合用の半田ペーストをスクリーン印刷する。印刷検査装置M2は、半田印刷後の基板を撮像して印刷された半田ペーストの平面位置を認識することにより印刷状態を検査する。電子部品搭載装置M3は、半田ペーストが印刷された基板に搭載ヘッドによって電子部品を搭載する。リフロー装置M4は、電子部品が搭載された基板を加熱することにより、半田バンプおよび半田ペーストを加熱溶融させて、電子部品を基板に半田接合する。   The printing apparatus M1 screen-prints a solder paste for joining an electronic component on an electrode formed on the substrate to be mounted corresponding to the arrangement of the solder bumps of the electronic component. The print inspection apparatus M2 inspects the print state by recognizing the planar position of the printed solder paste by imaging the board after solder printing. The electronic component mounting apparatus M3 mounts electronic components on a substrate on which a solder paste is printed by using a mounting head. The reflow device M4 heats and melts the solder bumps and the solder paste by heating the substrate on which the electronic component is mounted, and solder-bonds the electronic component to the substrate.

図2は、印刷装置M1にて行われる半田印刷を示している。印刷装置M1はスクリーンマスク6およびスキージ機構8を備えており、スクリーンマスク6の下方には、基板保持部(図示省略)によって電子部品が実装される基板5が位置決めされて保持される。基板5の上面には実装対象の電子部品が接続される電極5a、5bが設けられている。スクリーンマスク6の上方には、2つの印刷スキージ9を昇降機構10によって昇降自在とした構成のスキージ機構8が配設されており、スキージ機構8は水平移動機構(図示省略)によって水平移動自在となっている。基板5をスクリーンマスク6の下面に当接させ、さらにスクリーンマスク6の上面に半田ペースト7を供給した状態で、印刷スキージ9をスクリーンマスク6の上面に摺接させながらスキージ機構8を水平移動させることにより、スクリーンマスク6に形成されたパターン孔(図示省略)を介して半田ペースト7が電極5a、5bに印刷される。   FIG. 2 shows solder printing performed in the printing apparatus M1. The printing apparatus M1 includes a screen mask 6 and a squeegee mechanism 8. Under the screen mask 6, a substrate 5 on which electronic components are mounted is positioned and held by a substrate holding unit (not shown). On the upper surface of the substrate 5, electrodes 5a and 5b to which electronic components to be mounted are connected are provided. Above the screen mask 6, a squeegee mechanism 8 having a configuration in which two printing squeegees 9 can be moved up and down by a lifting mechanism 10 is disposed. The squeegee mechanism 8 can be horizontally moved by a horizontal movement mechanism (not shown). It has become. While the substrate 5 is in contact with the lower surface of the screen mask 6 and the solder paste 7 is supplied to the upper surface of the screen mask 6, the squeegee mechanism 8 is moved horizontally while sliding the printing squeegee 9 against the upper surface of the screen mask 6. As a result, the solder paste 7 is printed on the electrodes 5 a and 5 b through the pattern holes (not shown) formed in the screen mask 6.

次に、図3を参照して電子部品搭載装置M3の構造を説明する。図3において、基台11の中央部には搬送路12がX方向(基板搬送方向)に配列されている。搬送路12は、電子部品が実装される基板5を搬送し、電子部品実装位置に基板5を保持して位置決めする。したがって、搬送路12は基板5を保持して位置決めする基板保持部となっている。搬送路12の両側には、電子部品を供給する第1の部品供給部13Aおよび第2の部品供給部13Bが配設されている。   Next, the structure of the electronic component mounting apparatus M3 will be described with reference to FIG. In FIG. 3, a transport path 12 is arranged in the X direction (substrate transport direction) at the center of the base 11. The conveyance path 12 conveys the board | substrate 5 in which an electronic component is mounted, and hold | maintains and positions the board | substrate 5 in an electronic component mounting position. Therefore, the transport path 12 is a substrate holding portion that holds and positions the substrate 5. On both sides of the conveyance path 12, a first component supply unit 13A and a second component supply unit 13B that supply electronic components are disposed.

第1の部品供給部13Aには、複数のテープフィーダ14が並設されている。テープフィーダ14は、端子型のチップ部品などの電子部品を保持したテープをピッチ送りして、以下に説明する搭載ヘッドのピックアップ位置にこれらの電子部品を供給する。第2の部品供給部13Bには、2つのトレイフィーダ15が並列に配設されており、2つのトレイフィーダ15はそれぞれ種類の異なる電子部品16を格子配列で搭載ヘッドのピックアップ位置に供給する。電子部品16には、BGAなど薄型の樹脂基板に半導体素子を実装した構成の半導体パッケージや、小型のバンプ付き部品などが含まれる。本実施の形態においては、電子部品16として上述の半導体パッケージなど、下面に形成された複数の半田バンプによって基板と接続されるものを対象としている。   A plurality of tape feeders 14 are arranged in parallel in the first component supply unit 13A. The tape feeder 14 pitches a tape holding electronic components such as terminal-type chip components, and supplies these electronic components to a pickup position of a mounting head described below. Two tray feeders 15 are arranged in parallel in the second component supply unit 13B, and the two tray feeders 15 supply different types of electronic components 16 to the pickup position of the mounting head in a grid arrangement. The electronic component 16 includes a semiconductor package in which a semiconductor element is mounted on a thin resin substrate such as a BGA, a small bumped component, and the like. In the present embodiment, the electronic component 16 is intended to be connected to a substrate by a plurality of solder bumps formed on the lower surface, such as the above-described semiconductor package.

基台11のX方向の両端部には、Y軸テーブル17AおよびY軸ガイド17Bが配設されており、Y軸テーブル17A,Y軸ガイド17BにはX軸テーブル18が架設されている。さらにX軸テーブル18には搭載ヘッド19が装着されている。搭載ヘッド19は複数の単位搭載ヘッド20を備えた多連型の搭載ヘッドであり、基板認識カメラ21と一体的に移動する。   A Y-axis table 17A and a Y-axis guide 17B are disposed at both ends of the base 11 in the X direction, and an X-axis table 18 is installed on the Y-axis table 17A and the Y-axis guide 17B. Further, a mounting head 19 is mounted on the X-axis table 18. The mounting head 19 is a multiple mounting head having a plurality of unit mounting heads 20 and moves integrally with the substrate recognition camera 21.

X軸テーブル18、Y軸テーブル17Aを駆動することにより搭載ヘッド19はXY方向に移動し、第1の部品供給部13Aおよび第2の部品供給部13Bから電子部品を単位搭載ヘッド20の吸着ノズル20a(図9参照)によって取り出して、搬送路12上に位置決め保持された基板5に移送搭載する。X軸テーブル18、Y軸テーブル17Aは、搭載ヘッド19を第1の部品供給部13Aおよび第2の部品供給部13Bと搬送路12との
間で移動させるヘッド移動手段を構成する。
By driving the X-axis table 18 and the Y-axis table 17A, the mounting head 19 moves in the XY direction, and electronic components are picked up from the first component supply unit 13A and the second component supply unit 13B by the suction nozzle of the unit mounting head 20. It is taken out by 20a (see FIG. 9) and transferred and mounted on the substrate 5 positioned and held on the transport path 12. The X-axis table 18 and the Y-axis table 17A constitute a head moving unit that moves the mounting head 19 between the first component supply unit 13A and the second component supply unit 13B and the conveyance path 12.

搬送路12と第2の部品供給部13Bとの間の搭載ヘッド19の移動経路には、ラインカメラ23,ノズルストッカ22,ペースト転写ユニット24が配設されている。それぞれの部品供給部から電子部品をピックアップした搭載ヘッド19が基板5へ移動する途中で、搭載ヘッド19がラインカメラ23の上方を通過することにより、搭載ヘッド19に保持された状態の電子部品を認識する。   A line camera 23, a nozzle stocker 22, and a paste transfer unit 24 are disposed on the movement path of the mounting head 19 between the conveyance path 12 and the second component supply unit 13 </ b> B. While the mounting head 19 picking up an electronic component from each component supply unit moves to the substrate 5, the mounting head 19 passes over the line camera 23, so that the electronic component held by the mounting head 19 is removed. recognize.

ノズルストッカ22は、基板5に搭載される電子部品の種類に応じた吸着ノズルを複数種類収納しており、搭載ヘッド19がノズルストッカ22にアクセスすることにより、搭載対象の電子部品に応じた吸着ノズルを選択して装着することができるようになっている。ペースト転写ユニット24は、半田成分をフラックスに混入して粘性体とした半田ペーストを薄膜状態にして塗膜形成面に形成する機能を有している。搭載ヘッド19に保持された電子部品をペースト転写ユニット24の塗膜形成面に対して下降させることにより、電子部品の下面に形成された複数の半田バンプには、半田ペーストが転写により供給される。この半田ペーストの転写による供給は、半田バンプを基板5の電極と半田接合する際の半田量を追加することによって、半田接合の信頼性を向上させることを目的として行われるものである。   The nozzle stocker 22 stores a plurality of types of suction nozzles corresponding to the types of electronic components mounted on the substrate 5, and when the mounting head 19 accesses the nozzle stocker 22, the suction corresponding to the electronic components to be mounted is stored. A nozzle can be selected and mounted. The paste transfer unit 24 has a function of forming a solder paste in which a solder component is mixed with the flux into a viscous material into a thin film state on the coating surface. By lowering the electronic component held by the mounting head 19 with respect to the coating film forming surface of the paste transfer unit 24, solder paste is supplied to the plurality of solder bumps formed on the lower surface of the electronic component by transfer. . The supply of the solder paste by transfer is performed for the purpose of improving the reliability of the solder joint by adding the amount of solder when the solder bump is soldered to the electrode of the substrate 5.

次に図4を参照して、電子部品搭載装置M3に備えられたペースト転写ユニット24の構成について説明する。図4において、ベース部25の上面には平滑な塗膜形成面25aが設けられており、塗膜形成面25aには電子部品16に形成された半田バンプ16aに転写により供給するための半田ペースト7の塗膜7aが、スキージ28により半田ペースト7を延展する成膜動作によって形成される。   Next, the configuration of the paste transfer unit 24 provided in the electronic component mounting apparatus M3 will be described with reference to FIG. In FIG. 4, a smooth coating film forming surface 25a is provided on the upper surface of the base portion 25, and a solder paste for supplying the solder bumps 16a formed on the electronic component 16 by transfer onto the coating film forming surface 25a. 7 is formed by a film forming operation in which the solder paste 7 is extended by the squeegee 28.

ベース部25には、スキージ28に成膜動作を行わせる垂直移動機構26、水平移動機構27が設けられており、スキージ28は水平移動機構27に装着されている。垂直移動機構26,水平移動機構27、スキージ28は、スキージ駆動部35(図6参照)によって駆動される。すなわち、水平移動機構27を駆動することによりスキージ28は水平移動し、さらに垂直移動機構26を駆動することによりスキージ28は水平移動機構27と一体的に昇降する。したがって、スキージ28はスキージ駆動部35によって駆動されて、塗膜形成面25a上で水平移動および垂直移動を組み合わせた成膜動作を行う。これにより、塗膜形成面25aには半田ペースト7の塗膜が形成される。   The base unit 25 is provided with a vertical movement mechanism 26 and a horizontal movement mechanism 27 that cause the squeegee 28 to perform a film forming operation, and the squeegee 28 is attached to the horizontal movement mechanism 27. The vertical movement mechanism 26, the horizontal movement mechanism 27, and the squeegee 28 are driven by a squeegee driving unit 35 (see FIG. 6). That is, by driving the horizontal movement mechanism 27, the squeegee 28 moves horizontally, and by driving the vertical movement mechanism 26, the squeegee 28 moves up and down integrally with the horizontal movement mechanism 27. Accordingly, the squeegee 28 is driven by the squeegee driving unit 35 to perform a film forming operation combining horizontal movement and vertical movement on the coating film forming surface 25a. Thereby, the coating film of the solder paste 7 is formed on the coating film forming surface 25a.

図5はスキージ28による成膜動作の1パターン例を示している。図5(a)はスキージ28によって塗膜形成面25a上面に半田ペースト7を初期膜厚t1で延展して均一な膜厚の塗膜7aを形成した状態を示している。この後、所望の膜厚分布を得るための成膜動作が開始される。すなわち図5(b)、図5(c)に示すように、スキージ28に垂直移動機構26、水平移動機構27によって水平移動および垂直移動を所定パターンで組み合わせた成膜動作を行わせることにより、塗膜7aの所定範囲に半田ペースト7が所望の断面形状でえぐり取られた形状の膜厚変更部7bを形成する。この膜厚変更部7bは、図5(d)に示す例では中央部の膜厚がt2、周辺部の膜厚がt1であるような膜厚分布となっており、スキージ28の成膜動作のパターンを変更することにより、ペースト転写ユニット24において任意の膜厚分布で塗膜7aを形成することができるようになっている。   FIG. 5 shows one pattern example of the film forming operation by the squeegee 28. FIG. 5A shows a state in which the solder paste 7 is extended with an initial film thickness t1 on the upper surface of the coating film forming surface 25a by the squeegee 28 to form a coating film 7a having a uniform film thickness. Thereafter, a film forming operation for obtaining a desired film thickness distribution is started. That is, as shown in FIGS. 5B and 5C, by causing the squeegee 28 to perform a film forming operation in which the horizontal movement and the vertical movement are combined in a predetermined pattern by the vertical movement mechanism 26 and the horizontal movement mechanism 27, A film thickness changing portion 7b having a shape in which the solder paste 7 is removed in a desired cross-sectional shape is formed in a predetermined range of the coating film 7a. In the example shown in FIG. 5D, the film thickness changing portion 7b has a film thickness distribution in which the film thickness in the central portion is t2 and the film thickness in the peripheral portion is t1, and the film forming operation of the squeegee 28 is performed. By changing the pattern, the paste transfer unit 24 can form the coating film 7a with an arbitrary film thickness distribution.

次に図6を参照して、制御系の構成について説明する。制御部30はCPUを備えた全体制御部であり、以下に説明する各部の動作や処理を制御する。搭載データ記憶部31は、実装データなど、搭載ヘッド19による搭載動作を制御するために必要とされるデータを記憶する。部品反り情報記憶部32は、対象とする電子部品のリフロー過程における反
り変形状態に関するデータを記憶する。スキージ移動データ記憶部33は、スキージ28を移動させることにより行われる成膜動作のパターン、すなわちスキージ28の水平・垂直移動を組み合わせた動作パターンを、部品反り情報に対応して記憶する。ヘッド駆動部34は、搭載ヘッド19を移動させるための搭載ヘッド駆動モータ19Mを駆動する。スキージ駆動部35は、垂直移動機構26、水平移動機構27の駆動源である垂直方向駆動モータ26M、水平方向駆動モータ27Mを駆動する。
Next, the configuration of the control system will be described with reference to FIG. The control unit 30 is an overall control unit including a CPU, and controls the operation and processing of each unit described below. The mounting data storage unit 31 stores data necessary for controlling the mounting operation by the mounting head 19 such as mounting data. The component warpage information storage unit 32 stores data related to a warp deformation state in a reflow process of a target electronic component. The squeegee movement data storage unit 33 stores a pattern of a film forming operation performed by moving the squeegee 28, that is, an operation pattern in which horizontal and vertical movements of the squeegee 28 are combined, corresponding to the component warp information. The head driving unit 34 drives a mounting head driving motor 19M for moving the mounting head 19. The squeegee drive unit 35 drives a vertical direction drive motor 26M and a horizontal direction drive motor 27M which are drive sources of the vertical movement mechanism 26 and the horizontal movement mechanism 27.

ここで前述の部品反り情報およびスキージ移動データについて、図7を参照して説明する。本実施の形態に示す電子部品16のように、BGAなど薄型の樹脂基板を主体とする半導体パッケージは変形しやすく、特にリフロー時の加熱によって反り変形を生じやすいという特性がある。すなわち、常温の状態においては、図7(a)の(イ)に示す電子部品16のように全体がほぼフラットな状態であるが、加熱により両端部が上反り変形を示す場合がある。このとき、電子部品16の平面サイズ、厚み寸法、基板構成、すなわち樹脂材料や内部配線状態など、種々の要素によって、図7(a)の(ロ)、(ハ)、(ニ)に例示するように、異なった変形挙動を示す。   Here, the aforementioned part warpage information and squeegee movement data will be described with reference to FIG. Like the electronic component 16 shown in this embodiment, a semiconductor package mainly composed of a thin resin substrate such as a BGA is easily deformed, and particularly has a characteristic that warp deformation is easily caused by heating during reflow. That is, in the normal temperature state, the whole is almost flat like the electronic component 16 shown in FIG. 7A, but both ends may be warped due to heating. At this time, (b), (c), and (d) in FIG. 7A are exemplified by various elements such as the planar size, thickness dimension, and substrate configuration of the electronic component 16, that is, the resin material and the internal wiring state. As such, it exhibits different deformation behavior.

(ロ)に示す電子部品16Aは、反り変形が比較的小さく両端部が小さい変位量d1だけ上方に変位するような変形特性を有しており、(ハ)に示す電子部品16Bは、反り変形が大きく、両端部がd1よりも大きい変位量d2だけ上方に変位するような変形特性を有している。また(ニ)に示す電子部品16Cは、中央部分の変形が少なく両端部のみが局部的に変位量d3だけ持ち上げられるような変形特性を有する例である。   The electronic component 16A shown in (b) has a deformation characteristic such that warpage deformation is relatively small and both end portions are displaced upward by a small displacement d1, and the electronic component 16B shown in (c) is warped. And has a deformation characteristic such that both end portions are displaced upward by a displacement amount d2 larger than d1. Further, the electronic component 16C shown in (d) is an example having deformation characteristics such that there is little deformation in the central portion and only both end portions are locally lifted by the displacement amount d3.

前述のようにこの反り変形は部品種類によって多様に異なっており、図7(a)の例示と反り方向が反対の場合もある。すなわち、電子部品の中央部が両端部に対して相対的に持ち上げられ、全体として上に凸となるような変形挙動を示す場合も存在する。これらの部品反り情報は、対象となる電子部品をその都度リフロー過程と同じ加熱条件で加熱して変形量を実測することにより求められ、部品反り情報記憶部32にこれらの情報が書き込まれる。なおこれらの情報が既に得られて既知データとなっている場合には、管理コンピュータ3によって通信ネットワーク2を介して部品反り情報記憶部32に書き込まれる。   As described above, this warpage deformation varies in various ways depending on the part type, and the warping direction may be opposite to that illustrated in FIG. That is, there is a case in which the central part of the electronic component is lifted relatively with respect to both end parts and exhibits a deformation behavior such that the whole is convex upward. The component warpage information is obtained by heating the target electronic component under the same heating conditions as in the reflow process and measuring the deformation amount, and the information is written in the component warpage information storage unit 32. If these pieces of information have already been obtained and become known data, the management computer 3 writes the information into the component warpage information storage unit 32 via the communication network 2.

このように、電子部品がリフロー過程において反り変形挙動を示す場合には、下面に形成された半田バンプが基板の電極と離れる方向に変位することから、リーフロー過程の半田溶融時において、基板の電極上に印刷された半田ペーストが溶融した溶融半田と半田バンプが溶融した溶融半田とが一体化せず、いわゆる「半田オープン」となって正常な半田接合が阻害される場合がある。   As described above, when the electronic component exhibits a warp deformation behavior in the reflow process, the solder bump formed on the lower surface is displaced in a direction away from the substrate electrode. In some cases, the molten solder in which the solder paste printed thereon is melted and the molten solder in which the solder bumps are fused are not integrated, so that a so-called “solder open” is formed and normal solder bonding is hindered.

このような接合不良を防止するため、本実施の形態においては、リフロー過程における加熱によって部品反り変形の程度、すなわち半田バンプ16aが電極5aから離れる方向に変位する程度に応じて、半田バンプ16aに半田ペースト7を転写により追加供給し、「半田オープン」の発生を防止するようにしている。この半田ペースト7の追加供給は、ペースト転写ユニット24によって形成された塗膜7aに、単位搭載ヘッド20を保持された電子部品16を下降させて半田バンプ16aを塗膜7aに接触させることにより行われる。   In order to prevent such a bonding failure, in the present embodiment, the solder bump 16a is applied to the solder bump 16a according to the degree of component warpage deformation by heating in the reflow process, that is, the degree to which the solder bump 16a is displaced away from the electrode 5a. Solder paste 7 is additionally supplied by transfer to prevent the occurrence of “solder open”. The additional supply of the solder paste 7 is performed by lowering the electronic component 16 holding the unit mounting head 20 onto the coating film 7a formed by the paste transfer unit 24 and bringing the solder bumps 16a into contact with the coating film 7a. Is called.

このときそれぞれの半田バンプ16aには、上述の「半田オープン」を防止するために必要とされる適正量の半田ペースト7が転写により供給される。すなわち図7(b)に示すように、反り変形により変位した半田バンプ16a*の、平均的な半田バンプ16に対する高さ差Δhに応じて、塗膜形成面25aに形成される塗膜7aの膜厚分布をスキージ28の成膜動作によって設定するようにしている。スキージ移動データは、このような膜厚分布を有する塗膜7aを形成するためのスキージ28による成膜動作のパターンを示す
ものであり、部品反り情報が部品反り情報記憶部32に書き込まれると、これにリンクしてスキージ移動データ記憶部33に書き込まれる。
At this time, an appropriate amount of solder paste 7 necessary for preventing the above-described “solder open” is supplied to each solder bump 16a by transfer. That is, as shown in FIG. 7B, the coating film 7a formed on the coating film forming surface 25a according to the height difference Δh of the solder bump 16a * displaced by warping deformation with respect to the average solder bump 16 is shown. The film thickness distribution is set by the film forming operation of the squeegee 28. The squeegee movement data indicates a pattern of the film forming operation by the squeegee 28 for forming the coating film 7a having such a film thickness distribution. When the part warp information is written in the part warp information storage unit 32, The squeegee movement data storage unit 33 is written in a linked manner.

例えば、図7(a)の(イ)に示す電子部品16のように反り変形がほとんどない電子部品16については、それぞれの半田バンプ16aに均一な所望供給量の半田ペースト7を転写することができるよう、図7(b)(イ)に示すように、均一な全体膜厚t0の塗膜7aが形成される。これに対し、図7(a)(ロ)、(ハ)に示す電子部品16A、16Bのように、全体が湾曲した状態で反り変形を示すものに対しては、図7(b)(ロ)、(ハ)に示すように、その反り程度、すなわち両端部の変位量d1,d2に応じた全体膜厚t1、t2の塗膜7aをまず形成し、次いで全体の湾曲状態に応じた膜厚変更部7bを形成して、膜厚分布が各半田バンプ16aの高さ差Δhに応じたものとなるようにする。さらに、図7(a)(ニ)に示す電子部品16Cのように、中央部分の変形が少なく両端部のみが局部的に反り変形を生じている場合には、図7(b)(ニ)に示すように、変位量d3に応じた全体膜厚t3の塗膜7aを形成した後、その変形状態に応じた膜厚変更部7bを形成する。   For example, for an electronic component 16 that hardly undergoes warping deformation, such as the electronic component 16 shown in FIG. 7A, it is possible to transfer a uniform desired supply amount of solder paste 7 to each solder bump 16a. As shown in FIG. 7B and FIG. 7A, a coating film 7a having a uniform overall film thickness t0 is formed. On the other hand, the electronic parts 16A and 16B shown in FIGS. 7A, 7B, and 7C, which are warped and deformed as a whole, are deformed as shown in FIGS. ), (C), a film 7a having a total film thickness t1, t2 corresponding to the degree of warpage, that is, displacements d1, d2 at both ends is first formed, and then a film corresponding to the entire curved state The thickness changing portion 7b is formed so that the film thickness distribution corresponds to the height difference Δh of each solder bump 16a. Further, as in the electronic component 16C shown in FIGS. 7A and 7D, when there is little deformation of the central portion and only both end portions are locally warped and deformed, FIGS. As shown in FIG. 5, after the coating film 7a having the total film thickness t3 corresponding to the displacement d3 is formed, the film thickness changing portion 7b corresponding to the deformation state is formed.

次に、この電子部品実装システムによる電子部品実装方法について、図8のフローに沿って各図を参照して説明する。この電子部品実装方法は、下面に複数の半田バンプ16aが形成された電子部品16を基板5に移送搭載して実装するものである。まずここでは第2の部品供給部13Bから、搭載ヘッド19によって電子部品16を取り出す(ST1)。   Next, an electronic component mounting method by the electronic component mounting system will be described with reference to each drawing along the flow of FIG. In this electronic component mounting method, the electronic component 16 having a plurality of solder bumps 16a formed on the lower surface is transferred and mounted on the substrate 5. First, here, the electronic component 16 is taken out from the second component supply unit 13B by the mounting head 19 (ST1).

次に、図9(a)に示すように、ペースト転写ユニット24の塗膜形成面25aに対して搭載ヘッド19に保持された電子部品16を下降させることにより、半田バンプ16aに半田ペースト7を転写する(ペースト転写工程)(ST2)。すなわち図9(b)に示すように、単位搭載ヘッド20に保持された電子部品16を塗膜7aに対して下降させて、各半田バンプ16aを塗膜7aに接触させことにより、図9(c)に示すように、電子部品16のそれぞれの半田バンプ16aには、以下に説明するように、所望転写量の半田ペースト7が転写される。   Next, as shown in FIG. 9A, the electronic component 16 held by the mounting head 19 is lowered with respect to the coating film forming surface 25a of the paste transfer unit 24, whereby the solder paste 7 is applied to the solder bumps 16a. Transfer (paste transfer process) (ST2). That is, as shown in FIG. 9B, the electronic component 16 held by the unit mounting head 20 is lowered with respect to the coating film 7a, and each solder bump 16a is brought into contact with the coating film 7a. As shown in c), a desired transfer amount of solder paste 7 is transferred to each solder bump 16a of the electronic component 16 as described below.

このペースト転写工程に先だって実行される成膜動作においては、実装対象となる電子部品の種類に応じて部品反り情報記憶部32に記憶された部品反り情報が読み出され、さらにこの部品反り情報に対応したスキージ移動データがスキージ移動データ記憶部33から読み出される。そして制御部30は、このスキージ移動情報に基づいて、スキージ駆動部35を制御することにより、スキージ28に複数の半田バンプ16aのそれぞれに当該電子部品の反り変形の状態に応じた所望転写量の半田ペースト7を転写するための膜厚分布の塗膜を形成する成膜動作を行わせる(図5参照)。   In the film forming operation that is performed prior to the paste transfer process, the component warpage information stored in the component warpage information storage unit 32 is read according to the type of electronic component to be mounted, and the component warpage information is further included in the component warpage information. Corresponding squeegee movement data is read from the squeegee movement data storage unit 33. Then, the control unit 30 controls the squeegee driving unit 35 based on the squeegee movement information, so that the squeegee 28 has a desired transfer amount corresponding to the warp deformation state of the electronic component on each of the plurality of solder bumps 16a. A film forming operation for forming a coating film having a film thickness distribution for transferring the solder paste 7 is performed (see FIG. 5).

これにより、塗膜7aには当該電子部品16の部品反り情報に基づいた形状の膜厚変更部7bが形成される。すなわちスキージ28を駆動するスキージ駆動部35を制御部30が部品反り情報に基づいて制御することにより、複数の半田バンプ16aのそれぞれに当該電子部品の反り変形の状態に応じた所望転写量の半田ペーストを転写するための膜厚分布の塗膜7aを形成するようにしている。   Thereby, the film thickness changing part 7b having a shape based on the component warpage information of the electronic component 16 is formed in the coating film 7a. That is, when the control unit 30 controls the squeegee driving unit 35 that drives the squeegee 28 based on the component warpage information, each of the plurality of solder bumps 16a has a desired transfer amount of solder according to the warp deformation state of the electronic component. A coating film 7a having a film thickness distribution for transferring the paste is formed.

次いで電子部品16を基板5へ搭載する(ST3)。すなわち搭載ヘッド19を移動させて、図10(a)に示すように、半田ペースト7の転写後の電子部品16を保持した単位搭載ヘッド20を基板5上に位置させ、半田バンプ16aを基板5の電極5aに位置合わせする。次いで電子部品16を下降させて、図10(b)に示すように、電子部品16を基板5に搭載して半田バンプ16aを基板5の電極5aに半田ペースト7を介して着地させる(部品搭載工程)。   Next, the electronic component 16 is mounted on the substrate 5 (ST3). That is, the mounting head 19 is moved so that the unit mounting head 20 holding the electronic component 16 after the transfer of the solder paste 7 is positioned on the substrate 5 as shown in FIG. To the electrode 5a. Next, the electronic component 16 is lowered, and as shown in FIG. 10B, the electronic component 16 is mounted on the substrate 5 and the solder bumps 16a are landed on the electrodes 5a of the substrate 5 via the solder paste 7 (component mounting). Process).

この後、電子部品16が搭載された基板5はリフロー装置M4に搬入される。そして図10(c)に示すように、基板5を電子部品16とともに半田融点温度以上に加熱して、半田バンプ16aおよび半田ペースト7中の半田成分を溶融させることにより、電子部品16を基板5に半田接合する(リフロー工程)(ST4)。このとき、電子部品16は熱変形を生じ、外縁部側が上向きに反るような変形挙動を示すことから、外縁部に位置する半田バンプ16aは、電子部品16とともに電極5aとの間の間隔が増大するように変位する。   Thereafter, the substrate 5 on which the electronic component 16 is mounted is carried into the reflow apparatus M4. Then, as shown in FIG. 10C, the substrate 5 is heated to the solder melting point temperature or more together with the electronic component 16 to melt the solder components in the solder bumps 16a and the solder paste 7, whereby the electronic component 16 is mounted on the substrate 5 as shown in FIG. And soldering (reflow process) (ST4). At this time, the electronic component 16 is thermally deformed and exhibits a deformation behavior such that the outer edge side warps upward. Therefore, the solder bump 16a located on the outer edge portion has a gap between the electronic component 16 and the electrode 5a. Displace to increase.

このような場合でも、各半田バンプ16aには当該電子部品16の部品反り情報に基づき、前述の所望転写量の半田ペースト7が転写により追加供給されていることから、反り変形により電極5aと半田バンプとの間隔が増大した部分において半田バンプ16aと電極5aとを半田接合するための半田量が不足することがない。すなわち、図10(c)に示すように、電子部品16の半田バンプ16aが溶融した半田成分は、半田ペースト7中の半田が溶融した半田成分と一体となって全ての半田バンプ16aを電極5aに正常に繋ぎ、導通不良や接合強度不足などの接合不良を生じることなく、電子部品16を電極5aに電気的に接続する半田接合部16bを良好に形成する。   Even in such a case, each solder bump 16a is additionally supplied with the desired transfer amount of the solder paste 7 based on the component warpage information of the electronic component 16, so that the electrode 5a and the solder are deformed by warp deformation. The amount of solder for soldering the solder bump 16a and the electrode 5a at the portion where the distance from the bump is increased is not insufficient. That is, as shown in FIG. 10C, the solder component in which the solder bump 16a of the electronic component 16 is melted is integrated with the solder component in which the solder in the solder paste 7 is melted, and all the solder bumps 16a are connected to the electrode 5a. Thus, the solder joint portion 16b that electrically connects the electronic component 16 to the electrode 5a is satisfactorily formed without causing connection failure such as poor connection or insufficient bonding strength.

図11はこのような薄型の半導体パッケージを半田接合により実装する場合に生じやすい接合不良の例を示すものである。図11(a)は、このようにリフロー過程において両端部が情報に反りやすい電子部品16に対して、半田ペースト7の追加供給を行わずに搭載した例を示している。この場合には、リフロー過程において反り変形が生じた際、中央部に位置する半田バンプ16aは基板の電極5aと良好に半田接合するが、両端部近傍の半田バンプ16aの位置では半田ペースト7の量が不足する。この結果、本来電子部品16と電極5aとを完全に繋ぐべき半田接合部16bが健全に形成されず、未接合部Cを有する接合不良となる。   FIG. 11 shows an example of a bonding failure that easily occurs when such a thin semiconductor package is mounted by solder bonding. FIG. 11A shows an example in which the solder paste 7 is mounted without additional supply to the electronic component 16 whose both ends are likely to warp information in the reflow process. In this case, when warping deformation occurs in the reflow process, the solder bump 16a located in the center portion is well soldered to the electrode 5a of the substrate, but the solder paste 7 is located at the position of the solder bump 16a near both ends. Insufficient quantity. As a result, the solder joint portion 16b that should originally completely connect the electronic component 16 and the electrode 5a is not formed soundly, resulting in a joint failure having the unjoined portion C.

また図11(b)は、このような電子部品16に対して、各半田バンプ16aに同一転写量の半田ペースト7の追加供給を行った例を示している。この場合には、リフロー過程において反り変形が生じた際、両端部近傍の半田バンプ16aの位置では、半田ペースト7の量が追加により適正量となって良好に半田接合が行われるが、中央部に位置する半田バンプ16aについては半田ペースト7の量が適正量よりも過剰となる。この結果この範囲においては過剰な半田が溶融状態において流動し、隣接する電極5a相互が半田によって連結される半田ブリッジBが発生する。   FIG. 11B shows an example in which the same transfer amount of the solder paste 7 is additionally supplied to each solder bump 16a for such an electronic component 16. In this case, when warping deformation occurs in the reflow process, the amount of the solder paste 7 is added to an appropriate amount at the positions of the solder bumps 16a in the vicinity of both end portions, and solder bonding is performed favorably. As for the solder bump 16a located at the position 1, the amount of the solder paste 7 is excessive than the appropriate amount. As a result, in this range, excessive solder flows in a molten state, and a solder bridge B is generated in which adjacent electrodes 5a are connected by solder.

これに対し本実施の形態に示す電子部品実装方法においては、前述のように電子部品の種類に応じて記憶された部品反り情報に基づいて複数の半田バンプのそれぞれに当該電子部品の反り変形の状態に応じた所望転写量の半田ペースト7が転写されることから、リフロー過程において各半田バンプ16aに半田ペースト7の過不足が生じることがない。 これにより、リフロー過程において反り変形を生じやすい薄型の半導体パッケージを半田接合によって基板に実装する場合における上述の接合不良を防止することができる。   On the other hand, in the electronic component mounting method shown in the present embodiment, the warp deformation of the electronic component is applied to each of the plurality of solder bumps based on the component warp information stored according to the type of the electronic component as described above. Since a desired amount of solder paste 7 corresponding to the state is transferred, excess or deficiency of the solder paste 7 does not occur in each solder bump 16a during the reflow process. As a result, it is possible to prevent the above-described bonding failure when a thin semiconductor package that is likely to be warped in the reflow process is mounted on the substrate by solder bonding.

本発明の電子部品搭載装置および電子部品実装方法は、反り変形を生じやすい電子部品を半田接合によって実装する場合における接合不良を防止することができるという効果を有し、半田バンプが形成された薄型の半導体パッケージを基板に半田接合により実装する分野に有用である。   The electronic component mounting apparatus and the electronic component mounting method according to the present invention have an effect of preventing bonding failure when mounting an electronic component that is likely to be warped and deformed by solder bonding, and are thin with solder bumps formed thereon. This is useful in the field of mounting a semiconductor package to a substrate by solder bonding.

本発明の一実施の形態の電子部品実装システムの構成を示すブロック図The block diagram which shows the structure of the electronic component mounting system of one embodiment of this invention 本発明の一実施の形態の電子部品実装システムにおける半田印刷の説明図Explanatory drawing of the solder printing in the electronic component mounting system of one embodiment of this invention 本発明の一実施の形態の電子部品搭載装置の平面図The top view of the electronic component mounting apparatus of one embodiment of this invention 本発明の一実施の形態の電子部品搭載装置におけるペースト転写ユニットの構造説明図Structure explanatory drawing of the paste transcription | transfer unit in the electronic component mounting apparatus of one embodiment of this invention 本発明の一実施の形態の電子部品搭載装置におけるペースト転写ユニットの動作説明図Explanatory drawing of operation | movement of the paste transcription | transfer unit in the electronic component mounting apparatus of one embodiment of this invention 本発明の一実施の形態の電子部品搭載装置の制御系の構成を示すブロック図The block diagram which shows the structure of the control system of the electronic component mounting apparatus of one embodiment of this invention 本発明の一実施の形態の電子部品実装方法における部品反り情報およびスキージ移動データの説明図Explanatory drawing of the component curvature information and squeegee movement data in the electronic component mounting method of one embodiment of this invention 本発明の一実施の形態の電子部品実装方法を示すフロー図The flowchart which shows the electronic component mounting method of one embodiment of this invention 本発明の一実施の形態の電子部品実装方法の工程説明図Process explanatory drawing of the electronic component mounting method of one embodiment of this invention 本発明の一実施の形態の電子部品実装方法の工程説明図Process explanatory drawing of the electronic component mounting method of one embodiment of this invention 本発明の一実施の形態の電子部品実装方法における半田ペーストの転写量と半田接合不良との関係を示す説明図Explanatory drawing which shows the relationship between the transfer amount of a solder paste, and a solder joint defect in the electronic component mounting method of one embodiment of this invention

符号の説明Explanation of symbols

1 電子部品実装ライン
5 基板
7 ペースト
7a 塗膜
13A 第1の部品供給部
13B 第2の部品供給部
16 電子部品
16a 半田バンプ
19 搭載ヘッド
20 単位搭載ヘッド
24 ペースト転写ユニット
25a 塗膜形成面
28 スキージ
DESCRIPTION OF SYMBOLS 1 Electronic component mounting line 5 Board | substrate 7 Paste 7a Coating film 13A 1st component supply part 13B 2nd component supply part 16 Electronic component 16a Solder bump 19 Mounting head 20 Unit mounting head 24 Paste transfer unit 25a Coating film formation surface 28 Squeegee

Claims (2)

下面に複数の半田バンプが形成された電子部品を基板に移送搭載する電子部品搭載装置であって、
前記電子部品を供給する部品供給部と、前記基板を保持して位置決めする基板保持部と、前記部品供給部から電子部品を取り出して前記基板保持部に保持された基板に移送搭載する搭載ヘッドと、前記搭載ヘッドを前記部品供給部と基板保持部との間で移動させるヘッド移動手段と、前記電子部品のリフロー過程における反り変形の状態を示す部品反り情報を記憶する部品反り情報記憶部と、前記搭載ヘッドの移動経路に配設され、前記半田バンプに転写される半田ペーストの塗膜を塗膜形成面に形成し、前記搭載ヘッドに保持された電子部品を前記塗膜形成面に対して下降させることにより前記複数の半田バンプに半田ペーストを転写するためのペースト転写ユニットと、前記ペースト転写ユニットを制御する制御部とを備え、
前記ペースト転写ユニットは、スキージ駆動部によって駆動されて前記塗膜形成面上で水平移動および垂直移動を組み合わせた成膜動作を行うスキージを有し、前記制御部が前記スキージ駆動部を前記部品反り情報に基づいて制御することにより、前記複数の半田バンプのそれぞれに当該電子部品の前記反り変形の状態に応じた所望転写量の半田ペーストを転写するための膜厚分布の塗膜を形成することを特徴とする電子部品搭載装置。
An electronic component mounting apparatus for transporting and mounting an electronic component having a plurality of solder bumps formed on the lower surface thereof,
A component supply unit for supplying the electronic component; a substrate holding unit for holding and positioning the substrate; and a mounting head for taking out the electronic component from the component supply unit and transferring and mounting it on the substrate held by the substrate holding unit; A head moving means for moving the mounting head between the component supply unit and the substrate holding unit; a component warp information storage unit for storing component warp information indicating a warp deformation state in a reflow process of the electronic component; A coating film of a solder paste disposed on a movement path of the mounting head and transferred to the solder bump is formed on a coating film forming surface, and an electronic component held by the mounting head is formed on the coating film forming surface. A paste transfer unit for transferring solder paste to the plurality of solder bumps by lowering, and a control unit for controlling the paste transfer unit;
The paste transfer unit includes a squeegee that is driven by a squeegee driving unit to perform a film forming operation combining horizontal movement and vertical movement on the coating film forming surface, and the control unit causes the squeegee driving unit to warp the component. By controlling based on the information, a coating film having a film thickness distribution is formed on each of the plurality of solder bumps to transfer a desired transfer amount of the solder paste according to the state of warping deformation of the electronic component. An electronic component mounting apparatus characterized by
電子部品を供給する部品供給部と、前記基板を保持して位置決めする基板保持部と、前記部品供給部から電子部品を取り出して前記基板保持部に保持された基板に移送搭載する搭載ヘッドと、前記搭載ヘッドを前記部品供給部と基板保持部との間で移動させるヘッド移動手段と、前記電子部品のリフロー過程における反り変形状態を示す部品反り情報を記憶する部品反り情報記憶部と、前記搭載ヘッドの移動経路に配設され、前記塗膜形成面上で水平移動および垂直移動を組み合わせた成膜動作を行うスキージにより前記半田バンプに転写される半田ペーストの塗膜を塗膜形成面に形成するペースト転写ユニットと、前記ペースト転写ユニットを制御する制御部とを備えた電子部品搭載装置によって、下面に複数の半田バンプが形成された電子部品を基板に移送搭載して実装する電子部品実装方法であって、
前記部品供給部から搭載ヘッドによって電子部品を取り出す工程と、前記ペースト転写ユニットの前記塗膜形成面に対して前記搭載ヘッドに保持された電子部品を下降させることにより、前記半田バンプに半田ペーストを転写するペースト転写工程と、前記電子部品を前記基板に搭載して前記半田バンプを前記基板の電極に前記半田ペーストを介して着地させる部品搭載工程とを含み、
前記ペースト転写工程に先だって実行される前記成膜動作において、前記スキージを駆動するスキージ駆動部を前記制御部が前記部品反り情報に基づいて制御することにより、前記複数の半田バンプのそれぞれに当該電子部品の前記反り変形の状態に応じた所望転写量の半田ペーストを転写するための膜厚分布の塗膜を形成することを特徴とする電子部品実装方法。
A component supply unit for supplying an electronic component, a substrate holding unit for holding and positioning the substrate, a mounting head for taking out the electronic component from the component supply unit and transferring and mounting it on the substrate held by the substrate holding unit; Head moving means for moving the mounting head between the component supply unit and the substrate holding unit, a component warp information storage unit for storing component warp information indicating a warp deformation state in a reflow process of the electronic component, and the mounting A coating film of solder paste transferred to the solder bumps is formed on the coating film forming surface by a squeegee that is disposed in the head movement path and performs a film forming operation combining horizontal movement and vertical movement on the coating film forming surface. The electronic component mounting apparatus includes a paste transfer unit that controls the paste transfer unit, and an electric component having a plurality of solder bumps formed on the lower surface. Parts An electronic component mounting method for mounting and transferring and mounting the substrate,
Removing the electronic component from the component supply unit by the mounting head, and lowering the electronic component held by the mounting head with respect to the coating film forming surface of the paste transfer unit, whereby solder paste is applied to the solder bumps. A paste transfer step of transferring, and a component mounting step of mounting the electronic component on the substrate and landing the solder bump on the electrode of the substrate via the solder paste,
In the film forming operation that is performed prior to the paste transfer step, the control unit controls a squeegee driving unit that drives the squeegee based on the component warpage information, so that each of the plurality of solder bumps includes the electronic squeegee. An electronic component mounting method comprising: forming a coating film having a film thickness distribution for transferring a desired transfer amount of a solder paste according to a state of warping deformation of a component.
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