JPH01158791A - Connecting apparatus - Google Patents

Abstract

PURPOSE:To avoid the deformation of a second elastic substrate caused by the deformation of a pressing means and press the second substrate against a first substrate for bonding uniformly and efficiently by providing a rigid and heat-conductive member between the pressing means and the second substrate. CONSTITUTION:A hard substrate 31 which is a first substrate and a flexible substrate 35 which is a second substrate are pressed and connected to each other by a pressing jig 34 which is a pressing means, a flexible film 27 and a metal plate 36 which is a rigid member with a heat-conducting property. A substrate pressing jig 32 presses the hard substrate 31 downward. The flexible film 27 is pressed against the hard substrate 31 and the pressing jig 34 by fluid flowing into an airtight chamber 28 in the directions shown by arrows 42. The pressing jig 34 presses the flexible substrate 35 upward through the metal plate 36. Therefore, the deformation of the second elastic substrate caused by the deformation of the pressing means can be avoided and, for instance, even if the second substrate has through-holes, the second substrate can be pressed against the first substrate for bonding uniformly and efficiently.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a device for connecting a connecting terminal strip of one substrate to a flexible connecting terminal strip of another substrate, and more particularly, The present invention relates to a connection device that is suitably implemented when connecting a hard board and a flexible wiring board without using a connector.

Prior Art FIG. 5 is a cross-sectional view showing the structure of the main parts of a conventional connecting device. The connection device connects the connection terminal strip of the hard substrate 1 to which electronic components etc. can be attached, and the connection terminal strip of the flexible substrate 2 containing lead wires for wiring, using an anisotropically conductive film (Fig. 5). (not shown).

In FIG. 5, the substrate holding jig 3 is fixed with bolts or the like (not shown) and presses the hard substrate 1 from above. Below this hard substrate 1, there is a flexible substrate 2 and a pressure jig 4.
and flexible film 5 are installed. The flexible film 5 constitutes a part of an airtight chamber whose inside is filled with a fluid such as gas or liquid, and when this fluid flows into the airtight chamber, the flexible film 5 is applied in the direction shown by the arrow A1. be pressured.

The pressure jig 4 is made of a material having heat resistance and elasticity, such as silicone rubber, and the pressure jig 4 allows the connection terminal strip between the rigid substrate 1 and the flexible substrate 2 to have anisotropic conductivity. Strong adhesion through the membrane (Special Publication Showa 5')-1
4872>.

In this way, the connection terminal strip of the rigid substrate 1 and the connection terminal strip of the flexible substrate 2 are pressed from above and below and brought into close contact with each other. In this state, infrared rays are irradiated from above in FIG. 5 by an infrared lamp or the like. The anisotropic conductive film includes metal particles in a heat-melting synthetic resin, and the synthetic resin is melted by infrared rays, thereby connecting the rigid substrate 1 and the flexible substrate 2. This infrared lamp emits infrared rays in a stationary state, or emits focused infrared rays while moving along the connection terminal strip (Japanese Patent Publication No. 56-1182
85>.

Problems to be Solved by the Invention In the prior art described above, when the connection terminal strip of the rigid substrate 1 and the connection terminal strip of the flexible substrate 2 are pressed and heated by the pressure jig 4, the pressure jig 4 Due to its elasticity, the anisotropically conductive film 6 is melted by heating as shown in FIG. Enter. When the connection is completed and the pressure jig 4 and the flexible substrate 2 are separated, the deformed flexible substrate 2 tries to return to its original shape, so the adhesion between the flexible substrate 2 and the anisotropic conductive film 6 A force acts in the direction of peeling off this adhesive (in the direction of arrow A2 in FIG. 6), reducing the reliability of the connection.

Further, as shown in FIG. 7, when the connection terminal strip of the flexible substrate 2 has a through hole 9, the pressurizing jig 4 has elasticity, so it can crowd into the through hole 9 and close the through hole 9. A load is applied in the direction of expansion (direction of arrow A3 in Figure 7). Since the through hole 9 of the flexible substrate 2 includes only the copper lead 8, the saw lead 8 may break due to such a load.

Furthermore, as shown in FIG. 8, when connecting a plurality of flexible substrates 2 to one rigid substrate 1, the infrared lamp is moved along line D or line E in order to shorten the connection time. while emitting infrared rays. Thus, in FIG.
, 12.13 are connected. However, the distance from the heat source in the connection terminal strips 12 and 13 is long, and the effect of increasing the temperature by infrared irradiation is reduced, making it impossible to equalize the temperature and reducing the reliability of the connection.

SUMMARY OF THE INVENTION An object of the present invention is to provide a connection device that solves the above-mentioned problems, prevents breakage of lead wires, etc. by adding a simple configuration, and can perform reliable and reliable connections.

Means for Solving the Problems The present invention heat-melts a first substrate provided with a first connection terminal strip and a flexible second substrate provided with a second connection terminal strip. In the connection device, the second substrate is pressed against the first substrate using a pressure contact means and connected to each other by interposing a connecting member having adhesive properties and adhesive properties, wherein the pressure contact means and the second connection terminal are connected to each other. The connecting device is characterized by including a rigid member having thermal conductivity disposed between the connecting device and the band.

Function According to the present invention, the first connecting terminal strip of the first substrate and the second connecting terminal strip of the second substrate having visibility are connected by a connecting member having thermal meltability and adhesive properties. They are interposed and connected by pressure contact by pressure contact means.

At this time, a thermally conductive rigid member is arranged between the pressure welding means and the second connection terminal band, and the pressure welding means presses the second board toward the first board with this rigid member interposed. do.

Therefore, the second
This prevents deformation of the substrate, and allows the second substrate to be evenly and effectively pressed against the first substrate, even when the second substrate has a through-hole, and can be heated evenly in the press-welded state. During lifting, since the rigid member has thermal conductivity, it is possible to equalize the temperature of the connection terminal zone of the first board and the second board to be connected.

Embodiment FIG. 3 is a plan view showing the configuration of a connecting device 40 according to an embodiment of the present invention, and FIG. 4 is a side view showing a part of the connecting device 40 in cross section.

The connection device 40 connects the hard substrate 3 to which electronic components etc. are attached.
The connection terminal band of the first flexible substrate 35 and the connection terminal band of the flexible substrate 35 including lead wires for wiring are connected via an anisotropically conductive film serving as a connection means.

Flange portion 22 of a container 21 made of deep drawn metal material
At several places, for example, four places, the packings 23a, 23b,
The peripheral edge of the flexible film 27 is tightened and fixed using the presser fitting 24, the bolt 25, and the nut 26. In this way, the container 21 and the flexible film 27 form an airtight chamber 28. The flexible film 27 is made of, for example, a polyimide film, has airtightness and elasticity under high temperature and high pressure, and can be deformed.
It also has appropriate heat resistance and mechanical strength.

At the bottom of the container 21 (lower part in Figure 4), a gas such as air or nitrogen gas or a liquid such as water or oil is placed in an airtight chamber 28.
Two inlet pipes are provided for inflow into the.

The clip 30, which is fixed to the flange portion 22 of the container 21 with the bolt 25 mentioned above, presses the hard substrate 31 downward from the top in FIG. 4 via the substrate holding jig 32. Further, this clip 30 also presses the flexible film 27 from the top to the bottom in FIG. 4 via the film holding jig 33 at its arm portion. The film holding jig 33 is made of a strong material such as metal that will not be deformed by the maximum pressure applied to the airtight chamber 28, and has an appropriate thickness.

FIG. 1 is a sectional view showing the configuration of a portion of the connecting device 40. As shown in FIG. The connection device 40 connects a hard substrate 31 that is a first substrate, a flexible substrate 35 that is a second substrate, a pressure jig 34 and a flexible film 27 that are pressure contact means, and a metal plate 36 that is a rigid member. Press to connect.

The substrate holding jig 32 presses the hard substrate 31 from above to below in FIG. The flexible film 27 is attached to the airtight chamber 2
In the direction indicated by arrow 42 by the fluid flowing into 8,
The hard substrate 31 and pressurizing oil tool 34 are pressed. The pressing jig 34 presses the flexible substrate 35 upward in FIG. 1 via the metal plate 36.

FIG. 2 is a sectional view showing the structure of the vicinity of the connecting portion between the connecting terminal strip of the rigid substrate 31 and the connecting terminal strip of the flexible substrate 35. As shown in FIG. A conductive wiring 37 made of metal wiring or ITO is exposed in the connection terminal strip of the hard substrate 31 . Further, copper leads 38 are exposed in the connection terminal strip of the flexible substrate 35 corresponding to the conductive wiring 37, and the copper lead 38 between the conductive wiring 37 of the hard substrate 31 and the flexible substrate 35 is exposed.
The electrode 38 faces the electrode 38 with three anisotropically conductive films, which are connecting members, interposed therebetween.

As described above, the rigid substrate 31 is pressed downward in FIG. 2, and the flexible substrate 35 is pressed upward via the metal plate 36 by the pressing jig 34.

The metal plate 36 has the same shape as the pressing part of the pressing jig 34, for example, a flat surface, and has a thickness of, for example, about 0.3rnr.

When the hard substrate 31 and the flexible substrate 3=8-5 are pressed together through the anisotropically conductive M39 and heated with an infrared lamp or the like, the three anisotropically conductive films melt. melt to have a property. At this time, the metal plate 36 that presses the flexible substrate 35 has appropriate rigidity, so it presses the flexible substrate 35 without deforming it, and thereby the conductive wiring 37 of the rigid substrate 31
Force is effectively applied to the copper leads 38 of the flexible substrate 35.

The anisotropic conductive film 39 contains metal particles in a heat-melting synthetic resin, and when pressed with high pressure by the conductive wiring 37 and the copper lead 38, the metal particles are crushed and become conductive. As a result, the space 44 between the conductive wiring 37 and the copper lead 38 becomes electrically conductive.

In this embodiment, the material of the pressing jig 34 is silicone rubber having elasticity, but since it is configured to press the flexible substrate 35 through the metal plate 36, the copper lead of the flexible substrate 35 is It is possible to prevent a situation in which the pressurizing jig 34 is crowded during the process 38 and the flexible substrate 35 is deformed. Further, the metal plate 36 is
Since it has high thermal conductivity, it is possible to equalize the temperature distribution in the connection terminal zone of the rigid substrate 31 and the connection terminal zone of the flexible substrate 35, thereby improving the adhesion strength and the reliability of the connection. Ru.

In this embodiment, three anisotropically conductive films are used as the connection members, but the connections can also be made using, for example, solder.

Effects As explained above, according to the present invention, by arranging a thermally conductive rigid member between the pressure contact means and the second substrate, the second substrate has elasticity as the pressure contact means deforms. For example, even if the second substrate has a through hole, the second substrate can be evenly and effectively pressed against the first substrate. Since the rigid member has thermal conductivity, it is possible to equalize the temperature of the connection terminal bands of the first and second substrates to be connected.

Therefore, by adding a simple configuration, breakage of lead wires and the like can be prevented and reliable and reliable connections can be made without increasing costs.

[Brief explanation of the drawing]

Fig. 1 is a cross-sectional view showing the configuration of the main parts of a connecting device 4o according to an embodiment of the present invention, Fig. 2 is an enlarged cross-sectional view showing the connecting part in connection by the connecting device 4°, and Fig. 3 is a connecting FIG. 4 is a plan view showing the configuration of the device 4o, FIG. 4 is a side view showing a part of the connecting device 4o in cross section, FIG. 5 is a sectional view showing the configuration of the main part of the conventional connecting device, and FIG. FIG. 7 is a cross-sectional view for explaining problems when the flexible substrate 2 has through-holes 9, and FIG. FIG. 3 is a plan view for explaining problems when connecting the substrate 2 to one hard substrate 1. FIG. 27.--Flexible film l\, 31 hard substrate,
34. Pressure jig, 35. Flexible board, 36.
Metal plate, 37... Conductive wiring, 38... Copper lead,
3/anisotropic conductive membrane, 4o connection device hegu○

Claims (1)

[Scope of Claims] A first substrate provided with a first connection terminal band and a flexible second substrate provided with a second connection terminal band have heat-fusible and adhesive properties. A connection device that connects the second board to the first board by pressing the second board toward the first board using a pressure contact means with a connection member interposed therebetween, wherein the second board is arranged between the pressure contact means and the second connection terminal band. A connection device comprising a rigid member having thermal conductivity.