JPH0729317B2 - Hot press - Google Patents

Description

Description: FIELD OF THE INVENTION The present invention relates to a hot press suitable for adhering a multilayer printed wiring board of various electronic devices such as a computer.

[Background of the Invention]

In recent years, in order to realize high-density mounting of parts on a molded article such as a printed wiring board, there is a tendency to make a plurality of printed wiring boards multi-layered. In order to realize this multilayer structure, wiring board materials having better properties are being demanded.

Conventionally, as a hot press for heating and pressurizing a plurality of printed wiring boards in multiple layers, as shown in FIG. 3, a lower bolster 4 is mounted on a ram 3 of a main ram cylinder 2 fixed to a press lower frame 1. The lower heat plate 6 is fixed on the lower bolster 4 via the lower heat insulating plate 5, and the upper heat plate 7 is thermally heated by the upper heat insulating plate 8 on the upper portion of the opening for loading and unloading of the adhered portion. Insulated, pressed lower frame 1 and columns 10
The one fixed to the upper bolster 9 connected by means of Japanese Patent Application Laid-Open No. 59-87894 is known.

In this hot press, an adherend 11 such as a multilayer printed wiring board is inserted between the lower heating plate 6 and the upper heating plate 7, and the upper and lower heating plates 6, 7 are connected.
In addition, while applying molding heat energy by an electric heater, steam, etc., a hydraulic pressure is supplied from the hydraulic device 12 to the main ram cylinder to pressurize the adherend 11 for adhesion.
The bonded and heated object to be bonded is cooled in a pressurized state, and the bonding process is completed.

By the way, due to the high performance of wiring board materials,
It has been required to reach temperatures as high as 400 ° C or higher. In a hot press that can heat up to such a high temperature, when cooling from a high temperature state, if a water cooling method is used in which cooling water is passed through the passages in the hot platen, the steam pressure generated in the hot platen becomes as high as several tens of atmospheres. Therefore, the cooling system needs to be a device with high withstand voltage, which increases the manufacturing cost. Moreover, it is considered that the life of the hot platen becomes considerably short due to repeated rapid cooling and high temperature heating. On the other hand, an air cooling method using compressed air instead of water cooling can be considered. This method is good because it does not shorten the life of the hot platen and does not generate steam pressure, but the amount of heat transfer from the hot platen to air is very small compared to the case of cooling water. The cooling rate is much slower. Therefore, productivity is reduced.

Incidentally, a conventional cooling system diagram is shown in FIG. In FIG. 4, compressed air or cooling water passes through the strainer 15 and the inlet valve 13 and enters the upper and lower heating plates 6 and 7. Then, the heat of the hot platen is taken and discharged to the outside through the strainer 16 and the outlet valve 14.

[Object of the Invention]

The present invention has been made in view of the above points, and an object thereof is to provide a hot press having high productivity by including a cooling device capable of rapidly cooling a hot platen heated to a high temperature.

[Outline of Invention]

The present invention creates a compressed compressed air by mixing a small amount of cooling water with the compressed air, and removes heat of vaporization from the heating plate when the atomized water vaporizes in the hot plate. , The platen is cooled rapidly.

A hot press having such a cooling device.

Example of Invention

An embodiment of the hot press of the present invention will be described below with reference to FIGS. 1 and 2.

In FIGS. 1 and 2, the same reference numerals as those in FIGS. 3 and 4 indicate the same parts. In FIG. 1, the compressed air passes through the strainer 15 and the inlet valve 13, and passes through the upper and lower heating plates 6 and 7.
To the outside through the strainer 16 and the outlet valve 14. Compressed air in the atomized state is generated by mixing cooling water whose flow rate is limited by the throttle valve 20 through the water inlet valve 17 into this air. Since this mist vaporizes in the passage in the heating plate, the heating plate can be cooled faster than in the case of using only air.

Further, as shown in FIG. 2, by providing an indicator 18 and a temperature detector 19 to control the flow rate of the cooling water flowing through the cooling water inlet valve, the cooling rate of the hot platen can be controlled.

〔The invention's effect〕

According to the hot press of the present invention, since the cooling rate can be increased, it is possible to increase the productivity in bonding wiring boards.

[Brief description of drawings]

1 and 2 are cooling system diagrams of the hot press of the present invention, and FIG. 3 is a front view showing the structure of the hot press.
FIG. 4 is a conventional cooling system diagram. 1 ... Press lower frame, 2 ... Ram cylinder, 3 ...
… Ram, 4 …… Lower bolster, 5 …… Lower heat insulating plate, 6 ……
Lower heating plate, 7 ... Upper heating plate, 8 ... Upper heat insulating plate, 9 ... Upper bolster, 10 ... Post, 11 ... Adhered material, 13 ... Inlet valve, 14 ... Outlet valve, 15 ... … Strainer, 16 …… Strainer, 17 …… Water inlet valve, 18 …… Indicator, 19 …… Temperature detector, 20 …… Throttle valve.

Claims (2)

[Claims] 1. A hot press comprising a ram cylinder, upper and lower bolsters, a hot platen, etc., wherein a cooling passage and a cooling device are provided in the hot platen, and compressed air and cooling water are mixed in the cooling device to form a sprayed state. A hot press comprising a device for generating compressed air. 2. The hot press according to claim 1, wherein the cooling device is provided with a device for controlling the cooling rate of the hot platen by controlling the amount of water in the sprayed compressed air.