JP3062178B1 - Manufacturing method of laminate for printed wiring board - Google Patents

Abstract

An object of the present invention is to provide a method for manufacturing a laminated board for a printed wiring board, which can reduce a cooling time after heating performed for melting a resin of a resin-impregnated sheet. SOLUTION: A resin-impregnated sheet impregnated with a resin, a plurality of laminated materials 33a having a metal layer and the like, and this laminated material 3
After laminating a plurality of laminated plate plates 32a and the like having an area larger than 3a and the like, air having a lower temperature than the laminated material is supplied between the plurality of laminated plate plates.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a laminated board for a printed wiring board, and more particularly to a method for manufacturing a laminated board for a printed wiring board which can shorten a cooling time in a cooling step.

[0002]

2. Description of the Related Art Conventionally, a laminated board used as a base material of a printed wiring board is manufactured by, for example, stacking a plurality of layer components including prepregs, integrally forming the layers by heating and pressing, and then cooling. Have been. FIG. 7 is a schematic view showing a method for manufacturing a conventional laminate for a printed wiring board.

[0003] First, a laminated material 3 is formed by stacking a plurality of layer materials such as a core material and a prepreg.
Next, the plurality of laminated materials 3 and the laminated plate 2 are alternately stacked. Hereinafter, the one thus configured is referred to as a stacked stack. Thereafter, the laminated stack 1 is pressurized while heating using a laminating press (not shown) to integrate the layer components. In this laminating press,
A pair of heating plates that can be heated are vertically separated from each other, so that the stack 1 disposed between the heating plates can be pressurized while being heated by pressing means such as hydraulic pressure. ing. By pressing the laminated stack 1 while heating it using the laminating press having the above-described configuration,
The prepreg melts and hardens. Thereby, the layer components are integrated.

Next, the integrated layer components are cooled using a cooling press (not shown). In this cooling press, a pair of hot plates that can be cooled are vertically spaced apart from each other. Can be pressed. The reason why pressure is applied instead of simply cooling the layer components is to stabilize the dimensional change of the laminate and reduce warpage. By pressing the laminated stack 1 while cooling it using the cooling press having the above-described configuration, the layer components are cooled.
In this way, a laminated plate having stable dimensions and little warpage is obtained.

[0005] However, if the above-mentioned cooling press machine is used to cool the laminate, a long cooling time is required and productivity is low.

Therefore, in order to improve such a defect, a method of forcibly cooling a heated laminate with cool air (cooling air) has been disclosed (Japanese Patent Laid-Open No. Hei 7-156171).
No.).

[0007]

However, even in the case of forced cooling by cooling air, as shown in FIG. 7, after heating the laminated stack 1, the outer peripheral portion of the laminated stack 1 and the adjacent laminated plate Since the high-temperature air layer 9 in which the high-temperature air stays is formed in the gap between the two, the high-temperature air layer 9 cannot be removed simply by injecting the cooling air into the high-temperature air layer 9. For this reason, in the manufacturing method described in Japanese Patent Application Laid-Open No. 7-156171, heat exchange between cooling air and a laminate plate is performed.
That is, it is difficult to efficiently exchange heat between the cooling air and the laminate, and there is a problem that the cooling time of the laminate is long.

The present invention has been made in view of the above problems, and a method of manufacturing a laminated board for a printed wiring board which can shorten the cooling time after heating performed for melting the resin of the resin-impregnated sheet. The purpose is to provide.

[0009]

According to the present invention, there is provided a method of manufacturing a laminated board for a printed wiring board, comprising a plurality of laminated materials having a resin-impregnated sheet and a metal foil impregnated with a resin, and a plurality of laminated materials having an area larger than the laminated material. laminating of a sheet material, prior
A step of heating and pressing the plurality of laminated materials and the plurality of plate materials,
Moving the plurality of laminated materials and the plurality of plate materials to a cooling press machine
And a step of injecting air having a lower temperature than the laminated material from a plurality of nozzles between the plurality of plate materials.

In the present invention, since air having a lower temperature than that of the laminated material is injected between the plate materials from the plurality of nozzles after laminating the laminated material and the plate material, a high-temperature layer stagnating between the plate materials can be easily formed. Removed. Therefore, the laminate is cooled at a high speed.

Another printed circuit board laminate according to the present invention
The production method of the resin is a resin-impregnated sheet impregnated with a resin and
A plurality of laminated materials having a metal foil and an area larger than that of the laminated materials.
Laminating a plurality of large plate materials, and laminating the plurality of plate materials
Heating and pressing a plate and a plurality of plate members;
Moving the layer material and the plurality of plate materials to a cooling press machine,
Inject air between the plurality of plate members at a temperature lower than that of the laminated member.
Further comprising the step of exhausting the air staying between the plate while morphism you characterized.

Further, the step of injecting the air may have a step of injecting air from a direction inclined with respect to the side surface of the laminate.

Further, the step of injecting air may include a step of injecting air while changing a direction of the plate material with respect to a plate surface.

Further, the resin-impregnated sheet may be a prepreg.

Further, the step of injecting the air, it is desirable to have a process for further injecting the air into the outer periphery of the plate. By injecting air to the outside of the plate material, the cooling efficiency is further improved.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a laminate for a printed wiring board according to an embodiment of the present invention will be specifically described below with reference to the accompanying drawings. 1 and 2 are schematic views showing a method of manufacturing a laminated board for a printed wiring board according to an embodiment of the present invention in the order of steps. 3A and 3B are diagrams showing a cooling process of a laminated material in the method for manufacturing a laminated board for a printed wiring board according to the embodiment of the present invention, wherein FIG. 3A is a schematic side view,
(B) is a schematic plan view. FIG. 4 is a schematic view showing a flow of cooling air in a cooling step of a laminated material in a method of manufacturing a laminated board for a printed wiring board according to an embodiment of the present invention. In FIG. 3 (b), the lowermost layered plate and members above the layered material are omitted.

First, as shown in FIG.
4b and one end of the metal band 34a are placed in a predetermined work area. Next, a rectangular laminated plate plate 32a made of anodized aluminum is placed on the metal band 34a.
Is placed. The size of the laminated plate 32a is, for example, 750 mm on one side, 1400 mm on the other side,
The thickness is 2 mm. After that, the metal band 34a is folded 180 degrees and placed on the laminated plate 32a. Next, the thermosetting prepreg 36a, the inner core material 35a, and the thermosetting prepreg 36b are placed on the metal band 34a in this order. Next, the metal band 34b is turned 180 degrees and placed on the prepreg 36b. Then, the metal strip 34
b, the laminated plate 32b is placed on the metal band 34b.
Is folded 180 degrees and placed on the laminate plate 32b. Next, the thermosetting prepreg 36c, the inner core material 35b and the thermosetting prepreg 36 are formed on the metal band 34b.
d are placed in this order. Next, the metal band 34a is folded back by 180 degrees and placed on the prepreg 36d.
Is placed on the laminate plate 32c. Then, the stacking of the two-layer prepreg and the inner core material is repeated in the order described above, and the metal strip 34 is placed on the uppermost laminated plate.
The other ends of a and 34b are arranged. Thus, the laminated plate and the laminated material are alternately, for example, 50
An 80 mm thick laminated stack 31 is formed.

The metal bands 34a and 34b are, for example, 18 μm thick copper foil. The length of one side of each thermosetting prepreg is 500 mm, and the length of the other side is 1200 m.
m, the thickness is 0.2 mm. The length of one side of the inner layer core material is 500 mm, the length of the other side is 600 mm, and the thickness is 1.
0 mm. Each inner core material is made of an epoxy resin, and two copper oxide films are formed on the surface of the inner core material by etching and blackened. At this time, the thickness of the laminated material is about 1.6 mm.

Next, the stacking stack 31 is moved to a stacking press machine 7 provided with hot plates 8a and 8b which are vertically separated from each other by using a transport cart with rollers. In this laminating press machine 7, as shown in FIG.
And metal bands 34a and 34b disposed at the top and bottom of the stack 31.
Are connected to the hot plates 8a and 8b, respectively, so that a direct current flows.
1 can be pressurized. This laminating press 7
The stack 31 is placed between the hot plates 8a and 8b of
A voltage is applied to both ends of the metal conductor, and the stacked stack is heated by Joule heat generated from the metal conductor, and is pressed between both hot plates. For example, while heating at a maximum temperature of 180 ° C. for 60 minutes by energization, the maximum pressure is 10 kgf / cm.
^2. Pressurize with ² . As a result, each prepreg in the laminated material is melted and solidified to integrate the respective layer components.

Next, as shown in FIGS. 3A and 3B, the laminated stack 31 including the laminated material formed by the integration is moved to the cooling press 37. In this cooling press 37, a pressure plate 38a and a pressure plate 38b which are vertically separated from each other are provided. The stacked stack 31 is disposed between the two pressing plates, and the stacked stack 31 is pressed by pressing means such as hydraulic pressure. It can be pressurized. Further, two pairs of blower units 11 are provided so as to sandwich the stacked stack 31 from four directions in the horizontal direction (one pair is not shown). Further, the cooling press 37 is provided with cooling air supply means (not shown) for supplying cooling air to the blower unit 11 and an exhaust duct 13 for exhausting air.

Further, in the blower unit 11, a plurality of air nozzles 11a are provided so as to be able to jet cooling air in the laminating direction toward the gap between the adjacent laminated plate plates 32, respectively. Furthermore, this air nozzle 11
A plurality of a are arranged at a distance from each other in the surface direction of the laminated stack 31, and the angle at which the cooling air is injected is 45 degrees with respect to the end face of the laminated plate 33. The exhaust duct 13 is arranged at a position where the cooling air injected from the air nozzle 11a can be collected.

In order for the cooling air to easily flow into the gap between the adjacent laminated plate plates, it is necessary to reduce the flux and increase the flow velocity. Therefore, the diameter of the air nozzle 11a is, for example, 1 mm. 0.0 mm. In addition, the interval in the vertical direction (vertical direction) of the air nozzle is, for example, 10 mm,
In order to allow the cooling air to flow into the gaps between the laminated plate plates, the cooling plates are provided so as to be able to swing up and down, for example, at an amplitude of 10 mm and 20 times / minute. In the horizontal direction (horizontal direction), for example, 20
The air nozzles 11a are arranged at an interval of 0 mm, and the injection angle of the cooling air is set to 45 degrees with respect to the end face of the laminated material in order to improve air circulation. The gap between the tip of the air nozzle 11a and the laminated plate is improved to improve the cooling efficiency.
The thickness is preferably about 10 mm to 30 mm, for example, 20 mm in consideration of the positional accuracy of the laminated plate. For example, compressed air (6 kgf / cm ² ) air-cooled to 20 ° C. is used as cooling air. Further, in order to prevent the air heated to a high temperature from staying in the cold press, an exhaust duct for discharging the air is installed according to the flow of the air.

The stack 31 is placed between the hot plates 38a and 38b of the cooling press, and the air stack 11 is
A cooling air is injected from a to cool each laminated plate.

Specifically, the heated stack 31
Of the cooling press 37 provided with the blowing unit 11
It is placed between a pair of pressure plates 38a and 38b. Next, the stack 31 is pressurized at a surface pressure of 10 kgf / cm ² by the pressurizing plates 38a and 38b of the cooling press 37, and the exhaust fan is started. Thereafter, cooling air at 20 ° C. is injected from the air nozzle 11a at 6 kgf / cm ² to cool the laminated material until the temperature at the center of the laminated material changes from 180 ° C. to 40 ° C. Next, the supply of the cooling air is stopped and the exhaust fan is stopped. Next, the pressure plates 38a and 38b are raised to release the pressure.

Thus, a high-temperature air layer in which high-temperature air stays before the cooling step is formed in the outer peripheral portion of the stacked stack 31 and in the gap between the adjacent stacked plate plates.
Since the cooling air is injected toward the gap between the adjacent laminated plate plates toward the surface thereof, as shown in FIG. 4, the high-temperature air layer is easily removed, and each laminated plate plate is efficiently cooled by the cooling air. Cooled. In addition, since the injection angle of the cooling air is 45 degrees with respect to the end surface of each laminated material, the air circulation is high and the heat exchanged high-temperature air is easily removed. Further, since cooling air is injected from four sides to the laminated material, heat exchange between the air and the laminated plate can be performed efficiently.

As described above, in the method of manufacturing a laminated board for a printed wiring board according to the present embodiment, heat is efficiently exchanged between the cooling air and each of the laminated board plates. Since the heat is transferred to the laminated plate in contact therewith, each laminated material is efficiently cooled. That is, the cooling time of the laminated material is reduced.

The cooling effect can be further improved by changing the number of air nozzles, the direction of jetting the cooling air, and the temperature of the cooling air.

Next, the cooling mechanism of the laminated material will be described in detail below. FIG. 5 is a schematic view showing a cooling mechanism of the laminated plate.

The portion (exposed portion) 42a of the laminated plate 42 extending outside from the laminated material 43 is the laminated plate 4
The hot air layer that stays between the two is forcibly removed and cooled by contact with the supplied cooling air. On the other hand, the portion (non-exposed portion) 42b of the laminated plate 42 that comes into contact with the laminated material 43 has a high temperature due to heat radiation from the laminated material 43. Therefore, the exposed portion 42a and the non-exposed portion 42
b, a heat gradient is generated, and heat is transmitted from the non-exposed portion 42b to the exposed portion 42a according to the law of heat conduction. at the same time,
Due to the thermal gradient between the non-exposed portion 42b and the laminated material 43 thus cooled, the laminated material 43 is cooled by absorbing heat. Therefore, the exposed portion 42 of the laminated plate 42
By increasing the heat radiation rate from a to the air, the heat radiation rate of the laminated material 33 can be increased, that is, the cooling time can be shortened.

The heat conduction in the layered wall is different from that of the material 2
It can be thought of as a model that supplies heat from one side of a two-layer wall and calculates the amount of heat conducted to the other side. FIG. 6 is a schematic diagram showing a heat conduction model.

The heat transfer rate is q, the surface area of the first layer 21 corresponding to the laminated plate is A ₁ , the surface area of the second layer corresponding to the air layer in contact with the laminated plate is A ₂ , The thermal conductivity is λ ₁ , the thermal conductivity of the second layer 22 is λ ₂ ,
The layer thickness of the first layer is L ₁ , the layer thickness of the second layer 22 is L ₂ ,
The temperature of the surface on the side not in contact with the layer 22 is t ₁ ,
The temperature of the contact surface between the first layer and the second layer 22 is t ₂ ,
Assuming that the surface temperature on the side not in contact with the layer 21 is t ₃ , the heat transfer rate q is expressed by the following equation 1.

[0032]

## EQU1 ## q = λ ₁ A ₁ (t ₁ −t ₂ ) / L ₁ = λ ₂ A ₂ (t ₂ −
t ₃ ) / L ₂

From the above equation (1), the first layer 21 and the second layer 22
In other words, the heat transfer speed q, that is, the heat radiation speed increases in proportion to the temperature difference δt from the above, that is, (t ₂ −t ₃ ). Therefore, the second
It can be seen that the supply of cooling air at a lower temperature to the layer 22 increases the heat transfer rate.

The heat transfer rate q increases in proportion to the contact area A ₁ or A ₂ of the layer. That is, the cooling air is forcibly sent into the gap between the laminated plate plates, and the area where the cooling air layer comes into contact with the laminated plate per unit time is increased, so that the heat transfer speed (radiation speed) may be increased. Understand.

Further, the heat transfer rate q increases in proportion to the thermal conductivity.
It will be good. Thermal conductivity λ of first layer 21 ₁Is basically made of material
It is constant if it does not change. On the other hand, the heat conduction of the second layer 22
Rate λ_TwoIs equivalent to an air layer,
By controlling the humidity greatly, the thermal conductivity λ_TwoIs slightly
growing. Therefore, the thermal conductivity of this cooling air medium is restricted.
Control will increase the heat transfer rate (radiation rate).
I understand.

In the present embodiment, heating and pressurization are performed in the state of a laminated stack. However, the present invention is not limited to this. And heating and pressurizing to produce a laminate. Also,
In the present embodiment, the stacked stack is heated by using Joule heat from the metal conductor generated by applying a voltage to the metal conductor, but the present invention is not limited to this.
Even if it is applied to the case of using the most commonly used hydraulic hot platen type press machine (a device that heats the stack by transferring the heat of the hot plate from both ends of the stack), Similar effects can be obtained. The material of the laminated plate is not limited to aluminum, but may be stainless steel or the like, and is not particularly limited.

The cooling gas can be a heat medium. Not only air (oxygen-nitrogen mixture) but also other gases may be used, and the shape, number, arrangement and angle of the air nozzles are not limited to those shown in the present embodiment.

Further, if the pressurizing plate of the cooling press machine is provided with an air-cooling and water-cooling mechanism, the cooling effect of the laminate can be further improved.

The center temperature of the laminated material heated to 180.degree.
The time required for cooling to about 1 hour was about 1 hour.

On the other hand, when the laminated stack was cooled by natural cooling without supplying cooling air, and other conditions were the same as those of the embodiment, the cooling time was about 6 hours. The cooling time was about 2 hours in the case where the cooling air was simply blown onto the laminated stack and the other conditions were the same as in the example.

As described above, in the present embodiment, the time required for cooling is 1/6 as compared with the case where natural cooling is performed without supplying cooling air. In addition, the time required for cooling was し て compared to the case where only cooling air was supplied. Thus, it can be seen that the cooling time can be significantly reduced by defining the cooling air injection conditions.

[0042]

As described in detail above, according to the present invention,
After laminating the laminated material and the sheet material, air with lower temperature than the laminated material
Since the injection is performed between the plate members from the plurality of nozzles, the high-temperature air layer that has accumulated between the plate members can be easily removed. Therefore, the cooling time of the laminated material can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a stacked stack.

FIG. 2 is a schematic view illustrating a method of applying pressure while heating a laminated stack.

3A and 3B are diagrams illustrating a process of cooling a laminated material in a method for manufacturing a laminated board for a printed wiring board according to an embodiment of the present invention, wherein FIG. 3A is a schematic side view, and FIG. It is.

FIG. 4 is a schematic diagram showing a flow of cooling air.

FIG. 5 is a schematic diagram showing a cooling mechanism of a laminated plate.

FIG. 6 is a schematic diagram showing a heat conduction model.

FIG. 7 is a schematic view illustrating a method for manufacturing a conventional laminate for a printed wiring board.

[Explanation of symbols]

 1, 31; laminated stack 2, 32a, 32b, 32c, 42; laminated plate 3, 33a, 33b, 43; laminated material 7; laminated press 8a, 8b; hot platen 9; high-temperature air layer 11; blowing unit 11a Air nozzle 13; Exhaust duct 21; First layer 22; Second layer 34a, 34b; Metal bands 35a, 35b; Inner layer core material 36a, 36b, 36c, 36d; Prepreg 37; Exposed part 42b; unexposed part

Continued on the front page (51) Int.Cl. ⁷ Identification code FI B29L 31:34

Claims (6)

(57) [Claims] 1. A laminating a plurality of plates area is greater than the plurality of the laminate and the laminate having a resin impregnated resin-impregnated sheet and a metal foil, wherein the plurality of stacked
Heating and pressing a plate and a plurality of plate members;
Moving the layer material and the plurality of plate materials to a cooling press machine,
Injecting air having a lower temperature than the laminated material from a plurality of nozzles between the plurality of plate materials, the method for manufacturing a laminated board for a printed wiring board. 2. A resin-impregnated sheet impregnated with resin and gold.
A plurality of laminated materials having a metal foil and an area larger than that of the laminated materials.
Laminating a plurality of large plate materials, and laminating the plurality of plate materials
Heating and pressing a plate and a plurality of plate members;
Moving the layer material and the plurality of plate materials to a cooling press machine,
Inject air between the plurality of plate members at a temperature lower than that of the laminated member.
And evacuating the air remaining between the plate members while irradiating the printed circuit board. Wherein the step of injecting the air is laminated for printed wiring board according to claim 1 or 2, characterized by comprising the step of injecting air from a direction inclined with respect to the side surface of the laminate Plate manufacturing method. 4. The method according to claim 1, wherein the step of injecting air includes the step of injecting air while changing a direction of the plate material with respect to a plate surface.
13. The method for producing a laminate for a printed wiring board according to the above item. 5. The method for manufacturing a laminate for a printed wiring board according to claim 1, wherein the resin-impregnated sheet is a prepreg. 6. The printed wiring board according to claim 1, wherein the step of injecting the air further includes a step of injecting the air to an outer peripheral portion of the plate material. A method for manufacturing a laminate.