JPS59104296A - Hot press - Google Patents
Hot pressInfo
- Publication number
- JPS59104296A JPS59104296A JP57211418A JP21141882A JPS59104296A JP S59104296 A JPS59104296 A JP S59104296A JP 57211418 A JP57211418 A JP 57211418A JP 21141882 A JP21141882 A JP 21141882A JP S59104296 A JPS59104296 A JP S59104296A
- Authority
- JP
- Japan
- Prior art keywords
- plates
- heat insulating
- hot
- parallelism
- hot press
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
- B31D—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER, NOT PROVIDED FOR IN SUBCLASSES B31B OR B31C
- B31D3/00—Making articles of cellular structure, e.g. insulating board
- B31D3/02—Making articles of cellular structure, e.g. insulating board honeycombed structures, i.e. the cells having an essentially hexagonal section
- B31D3/0284—Laminating honeycomb cores; applying cover sheets to core edges; working core edges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Press Drives And Press Lines (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明はコンピュータなど各種電子機器の多層プリント
配線板を接着する際に好適なホットプレスに関するもの
である。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a hot press suitable for bonding multilayer printed wiring boards of various electronic devices such as computers.
従来の多層プリント配線板接着用として使用されるホッ
トプレスとしては、第1図に示す如く、プレス本体1に
固定されたラムシリンダー2のラム3上に、下ボルスタ
4が載せられ、下ボルスタ4上には下断熱板5を介し、
下熱板6が、締付ポルト7で固定されさらに被成形物搬
入搬出用開口 。As shown in FIG. 1, in a conventional hot press used for bonding multilayer printed wiring boards, a lower bolster 4 is placed on a ram 3 of a ram cylinder 2 fixed to a press body 1. On top, there is a lower heat insulating board 5,
The lower heating plate 6 is fixed with a tightening port 7, and an opening for carrying in and out of the molded object is provided.
部を設けた上部に中間熱板8がカウンターシリンダー9
で支持され最上部は上熱板10が上断熱板11で熱的に
絶縁されプレス本体1と支柱12で連結された上ボルス
タ13に締付ボルト14で固定されている。このホット
プレスは、下熱板6と中間熱板8および中間熱板8と上
熱板10間に多層プリント板などの被成形物を挿入し、
各々の熱板6,8.11に加熱装置15より成形熱エネ
ルギーを与えると同時にラムシリンダー2およびカウン
ターシリンダー9に油圧装置16より油圧金供給し、被
処理物を加圧接着するものである。An intermediate heating plate 8 is placed on the upper part of the counter cylinder 9.
At the top, an upper hot plate 10 is thermally insulated by an upper heat insulating plate 11 and is fixed with tightening bolts 14 to an upper bolster 13 connected to the press body 1 by struts 12. This hot press inserts a molded object such as a multilayer printed board between a lower hot plate 6 and an intermediate hot plate 8, and between an intermediate hot plate 8 and an upper hot plate 10,
Molding thermal energy is applied to each of the hot plates 6, 8, and 11 by a heating device 15, and at the same time, hydraulic pressure is supplied to the ram cylinder 2 and counter cylinder 9 from a hydraulic device 16 to bond the objects to be processed under pressure.
ところで、前記上下ボルスタ4,13と上下熱板6.1
0′t−熱的に絶縁する上下断熱板5,11は上下ボル
スタ4,13に挿入されるため、上下断熱板5,11は
精度の而から長さ500ミリメートルに対し0.03
ミリメートル以下の平行度が要求される。By the way, the upper and lower bolsters 4 and 13 and the upper and lower hot plates 6.1
0't - Since the upper and lower heat insulating plates 5, 11 that thermally insulate are inserted into the upper and lower bolsters 4, 13, the upper and lower heat insulating plates 5, 11 have a length of 0.03 mm for a length of 500 mm due to accuracy.
Parallelism of less than a millimeter is required.
しかしながら、従来使用している石綿繊維による断熱板
5,11は、断熱板単独の機械加工によ9基準長さ50
0ミリメートルに対し0.1〜0.2ミリメートル程度
の平行度しか得られないため、ボルスタに組付けた後、
すシ曾を加工もしくはシムにより調整して使用していた
。However, the conventionally used heat insulating boards 5 and 11 made of asbestos fiber have a standard length of 50 mm due to the machining of the insulating boards alone.
Since parallelism of only about 0.1 to 0.2 mm can be obtained with respect to 0 mm, after assembling it to the bolster,
Sushi was used after being adjusted by processing or shims.
このような方法で平行度を得ていることや石綿繊維の熱
サイクルによる経年変化が生じることで平行度の維持が
むずかしいため、約1年毎に平行度修正作業を実施して
いるという欠点があった。Parallelism is obtained using this method, and asbestos fibers change over time due to thermal cycles, making it difficult to maintain parallelism, so the drawback is that parallelism correction work is carried out approximately every year. there were.
本発明は上記の点に鑑み、被接着物が挿入される熱板の
平行度の精度?向上させるようにし/ζことと目的とす
る。In view of the above points, the present invention has been developed based on the accuracy of the parallelism of the hot plate into which the object to be adhered is inserted. The aim is to improve / ζ.
精度の高いホットプレスを製作するには、加熱部と本体
の間に断熱効果の良い、精度の高い加工が可能で均質な
圧縮弾性率をもちかつ、経年変化の少ない断熱板を使用
する必要があるという考え方に基づいて、ハニカム材上
加工容易な金属又は樹脂板でサンドインチ構造に一体化
した@熱板とする。In order to manufacture a hot press with high precision, it is necessary to use a heat insulating board between the heating part and the main body that has a good insulation effect, can be processed with high precision, has a homogeneous compressive elastic modulus, and has little change over time. Based on this idea, we created a @heat plate that is integrated into a sand inch structure using a metal or resin plate that is easy to process on honeycomb material.
以下本発明の一実施例を第2図および第3図によシ説明
する。An embodiment of the present invention will be described below with reference to FIGS. 2 and 3.
第2図および第3図において、第1図と同一符号のもの
は同一部分を示す。In FIGS. 2 and 3, the same reference numerals as in FIG. 1 indicate the same parts.
21.22は前記上下ボルスタ4,13と上下熱板6,
110間に挿入される上、下断熱板で、この上、下断熱
板21,22は、/・ニカム材17が接着剤18を介し
て金属板19によシサンドイツチされ、その外周を断熱
繊維20で保護される構造になっている。21.22 are the upper and lower bolsters 4, 13 and the upper and lower hot plates 6,
The upper and lower heat insulating boards 21 and 22 are inserted between the upper and lower heat insulating boards 110, and the upper and lower heat insulating boards 21 and 22 are made of nicum material 17 which is sandwiched with a metal plate 19 via adhesive 18, and the outer periphery of which is covered with insulating fibers 20. The structure is protected by
このようにハニカム材17を金属板19によシサンドイ
ツチした断熱板21,22の内部は、無数の小さな気密
室になっているため対流が起らず、断熱効果がきわめて
良好である。また金属板によるサンドインチでるるため
、ノにカムサンドイッチを成形後機械加工により、精度
の高い平行度が得られることよシ、ホットプレスとして
の精度も向上する。The insides of the heat insulating plates 21 and 22, which are formed by sandwiching the honeycomb material 17 with the metal plate 19, have countless small airtight chambers, so that no convection occurs and the heat insulating effect is extremely good. In addition, since the sandwich inch is made of a metal plate, high-precision parallelism can be obtained by machining after forming the cam sandwich, and the accuracy as a hot press can also be improved.
例えば断熱板21.22としてノメツクス(ナイロン不
織布)を基材として作ったノ・ニカム材をフェノール樹
脂を用いて金属板でサンドインチ構造に成形後サンドイ
ッチしている金属版画面金、精度の高い平面加工すれば
、圧縮弾性率5.0×10 ’ kg/ cr/l、平
行度基準長さ500叫に対し0.02、熱伝導率0.0
3に2I/m−h−’I::で経年変化は石綿繊維の約
5倍の断熱板が得られる。本断熱板をホットプレスに使
用すれば、組合せによる修 −正加工が不要で、プレス
精度としてJISB6403の精度等級特級の平行度が
約5年間は維持できる。For example, as the heat insulating board 21, 22, a metal plate made of Nomex (nylon nonwoven fabric) as a base material is formed into a sandwich structure with metal plates using phenol resin, and then sandwiched. If processed, compressive elasticity modulus is 5.0×10' kg/cr/l, parallelism standard length is 0.02, thermal conductivity is 0.0
3 to 2 I/m-h-'I:: A heat insulating board with a aging change of about 5 times that of asbestos fiber can be obtained. If this heat insulating board is used in a hot press, there is no need for any combination modifications, and the press accuracy can maintain the parallelism of JISB6403 precision class special grade for about 5 years.
本発明のホットプレスによれば、被接着物が挿入される
熱板の平行度が高精度に得られる。According to the hot press of the present invention, the parallelism of the hot plates into which the objects to be adhered are inserted can be obtained with high precision.
したがって、例えば多層プリント配線板など被接着物の
接着作業に大きな効果を有する。Therefore, it has a great effect on bonding work of objects to be bonded, such as multilayer printed wiring boards.
第1図は従来のホットプレスの概略正面図、第2図は本
発明のホットプレスにおける断熱板の断面図、第3図は
本発明のホットプレスの概略正面図でおる。
1・・・プレス本体、2・・・ラムシリンダー、4.1
3・・・上下ボルスタ、15・・・加熱装置、16・・
・油圧装置、17・・・ハニカム材、20・・・断熱繊
維、21゜22・・・上下断熱板。
代理人 弁理士 薄田利幸
Y 1 口
μ
第2 図
’f、3 口FIG. 1 is a schematic front view of a conventional hot press, FIG. 2 is a sectional view of a heat insulating plate in the hot press of the present invention, and FIG. 3 is a schematic front view of the hot press of the present invention. 1... Press body, 2... Ram cylinder, 4.1
3... Upper and lower bolsters, 15... Heating device, 16...
・Hydraulic device, 17...Honeycomb material, 20...Insulating fiber, 21° 22...Upper and lower insulation board. Agent Patent attorney Toshiyuki Usuda 1 mouth μ Figure 2 'f, 3 mouth
Claims (1)
との間に断熱板を挿入して成るホットプレスにおいて、
前記断熱板を、ノ・ニカム材の上下側を金属板又は樹脂
板によシ一体的に固着してサンドイッチ構造としたこと
を特徴とするホットプレス。In a hot press, a workpiece is heated and pressurized between bolsters, and a heat insulating plate is inserted between the bolster and the hot plate.
A hot press characterized in that the heat insulating plate is formed into a sandwich structure by integrally fixing the upper and lower sides of the non-nikum material to a metal plate or a resin plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57211418A JPS59104296A (en) | 1982-12-03 | 1982-12-03 | Hot press |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57211418A JPS59104296A (en) | 1982-12-03 | 1982-12-03 | Hot press |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59104296A true JPS59104296A (en) | 1984-06-16 |
Family
ID=16605623
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57211418A Pending JPS59104296A (en) | 1982-12-03 | 1982-12-03 | Hot press |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59104296A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6182999A (en) * | 1984-09-28 | 1986-04-26 | Showa Aircraft Ind Co Ltd | Insulating material for high-frequency heating press device |
US5496433A (en) * | 1992-03-27 | 1996-03-05 | Hitachi Techno Engineering Co., Ltd. | Hot press for use in production of multilayered substrate |
CN105346190A (en) * | 2015-09-29 | 2016-02-24 | 张义勇 | Multi-layer board pressing method |
CN106113886A (en) * | 2016-02-23 | 2016-11-16 | 廖日森 | A kind of make-up machine multi cylinder laminating mechanism |
CN107396551A (en) * | 2017-07-28 | 2017-11-24 | 贵州鑫阳科技股份有限公司 | Equipment for controlling slab to process |
CN109624370A (en) * | 2018-11-28 | 2019-04-16 | 苏州鸿赞蜂窝材料有限公司 | A kind of aluminium honeycomb core hot press equipped with high precisely guidance system |
CN112848383A (en) * | 2020-12-31 | 2021-05-28 | 荣成碳纤维科技有限公司 | Preparation method and preparation device of carbon fiber interlaminar shear sample strip |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5192461A (en) * | 1975-02-10 | 1976-08-13 | ||
JPS5310486B1 (en) * | 1970-11-18 | 1978-04-14 |
-
1982
- 1982-12-03 JP JP57211418A patent/JPS59104296A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5310486B1 (en) * | 1970-11-18 | 1978-04-14 | ||
JPS5192461A (en) * | 1975-02-10 | 1976-08-13 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6182999A (en) * | 1984-09-28 | 1986-04-26 | Showa Aircraft Ind Co Ltd | Insulating material for high-frequency heating press device |
US5496433A (en) * | 1992-03-27 | 1996-03-05 | Hitachi Techno Engineering Co., Ltd. | Hot press for use in production of multilayered substrate |
CN105346190A (en) * | 2015-09-29 | 2016-02-24 | 张义勇 | Multi-layer board pressing method |
CN106113886A (en) * | 2016-02-23 | 2016-11-16 | 廖日森 | A kind of make-up machine multi cylinder laminating mechanism |
CN107396551A (en) * | 2017-07-28 | 2017-11-24 | 贵州鑫阳科技股份有限公司 | Equipment for controlling slab to process |
CN107396551B (en) * | 2017-07-28 | 2019-04-30 | 贵州鑫阳科技股份有限公司 | Equipment for controlling slab processing |
CN109624370A (en) * | 2018-11-28 | 2019-04-16 | 苏州鸿赞蜂窝材料有限公司 | A kind of aluminium honeycomb core hot press equipped with high precisely guidance system |
CN112848383A (en) * | 2020-12-31 | 2021-05-28 | 荣成碳纤维科技有限公司 | Preparation method and preparation device of carbon fiber interlaminar shear sample strip |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69028378T2 (en) | Process for the production of a heat-conducting mixed material | |
JP2005059596A (en) | Method for forming stepped laminate | |
JPS59104296A (en) | Hot press | |
WO2012002355A1 (en) | Composite material molding die and production method therefor | |
JPH03255690A (en) | Heat pipe buried circuit board and manufacture thereof | |
AU7970691A (en) | Process for the production of a multilayer printed circuit board | |
JPS5828384Y2 (en) | Multilayer printed board lamination equipment | |
JPS6169197A (en) | Method and layer structure for producing multilayer printed circuit board | |
JPS6046097A (en) | Hot press | |
CN213167226U (en) | Novel heat conduction copper clad laminate structure | |
JPS6223733A (en) | Lamination press | |
JPS63162553A (en) | Sandwich glass | |
JP2773344B2 (en) | Method for manufacturing multilayer printed wiring board | |
JPH02296394A (en) | Manufacture of multilayer printed-wiring board | |
SE8704034L (en) | DIRECT HIGH PRESSURE LAMINATION | |
JPH04168793A (en) | Manufacture of multilayer copper-clad board | |
JPH0538917Y2 (en) | ||
JPH0340709B2 (en) | ||
JPH02241091A (en) | Lamination of multilayer laminated board | |
JPH0626875B2 (en) | Copper clad laminate | |
JPS6028607Y2 (en) | Composite structure heat-resistant mica board | |
JPS60166428A (en) | Laminate molding method of metal lined laminated board | |
JPH01283988A (en) | High thermal conductivity board and manufacture thereof | |
JPH04296084A (en) | Printed wiring board backed with heat dissipating plate | |
JPH04185408A (en) | Manufacture of thermosetting resin laminate |