JPH01283988A - High thermal conductivity board and manufacture thereof - Google Patents
High thermal conductivity board and manufacture thereofInfo
- Publication number
- JPH01283988A JPH01283988A JP11378888A JP11378888A JPH01283988A JP H01283988 A JPH01283988 A JP H01283988A JP 11378888 A JP11378888 A JP 11378888A JP 11378888 A JP11378888 A JP 11378888A JP H01283988 A JPH01283988 A JP H01283988A
- Authority
- JP
- Japan
- Prior art keywords
- thermally conductive
- heat
- highly thermally
- adhesive film
- resistant adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 34
- 239000002184 metal Substances 0.000 claims abstract description 34
- 239000002313 adhesive film Substances 0.000 claims abstract description 29
- 239000000919 ceramic Substances 0.000 claims abstract description 21
- 239000004020 conductor Substances 0.000 claims abstract description 21
- 238000002844 melting Methods 0.000 claims abstract description 6
- 230000008018 melting Effects 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 44
- 238000000034 method Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 6
- 230000007774 longterm Effects 0.000 description 4
- 239000012783 reinforcing fiber Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 241000218645 Cedrus Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
Landscapes
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electric Cables (AREA)
- Insulating Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、熱伝導性、耐熱性を有した高熱伝導性基板
及びその製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a highly thermally conductive substrate having thermal conductivity and heat resistance, and a method for manufacturing the same.
（従来の技術〕
従来、この種の高熱伝導性基板として第２図に示すもの
が知られている。第２図は従来の金属ベース基板の構成
説明用図である。(Prior Art) Conventionally, as this type of highly thermally conductive substrate, the one shown in FIG. 2 is known. FIG. 2 is a diagram for explaining the structure of a conventional metal base substrate.
図において、１は金属板で、この金属板１は高熱伝導性
基板の金属ベース基板であり、４は高熱伝熱伝導性基板
を構成している導体である金属箔で、５はこの金属箔４
と前記金属板１の間の絶縁層（Ｉ）としてのプリプレグ
シートで、このプリプレグシート５は、ガラスクロス等
の強化繊維にエポキシ樹脂などの熱効果性樹脂を含浸さ
せ半硬化させることによって作っである。In the figure, 1 is a metal plate, this metal plate 1 is a metal base substrate of a highly thermally conductive substrate, 4 is a metal foil that is a conductor constituting the highly thermally conductive substrate, and 5 is this metal foil. 4
This prepreg sheet 5 is used as the insulating layer (I) between the metal plate 1 and the metal plate 1, and the prepreg sheet 5 is made by impregnating reinforcing fibers such as glass cloth with a heat-effective resin such as epoxy resin and semi-curing. be.
従来の高熱伝導性基板は、このプリプレグシート５を金
属箔４と金属板１の間の絶縁層として用い、加熱加圧し
て一体化成形したものである。The conventional highly thermally conductive substrate uses this prepreg sheet 5 as an insulating layer between the metal foil 4 and the metal plate 1, and is integrally molded by heating and pressing.
しかしながら、従来の高熱、伝導性基板は、熱硬化性樹
脂を、ガラスクロス等の強化繊維に含浸し、半硬化させ
プリプレグシート５を製造する工程か入るため、高熱伝
導性基板の放熱特性が劣るという難点があった。However, conventional high heat conductive substrates require a process in which reinforcing fibers such as glass cloth are impregnated with thermosetting resin and semi-cured to produce the prepreg sheet 5, so the heat dissipation properties of high heat conductive substrates are inferior. There was a problem.
また、従来の高熱伝導性基板の製造方法においてはプリ
プレグシート５を製造したのち、それを金属板１．導体
４と重ね合わせて基板を成形する場合、プリプレグシー
ト５を製造する工程が入るため作業性が、怨く、セラミ
ックベーパ、フェス。In addition, in the conventional manufacturing method of a highly thermally conductive substrate, after manufacturing the prepreg sheet 5, it is attached to the metal plate 1. When forming a substrate by overlapping the conductor 4, a step is required to manufacture the prepreg sheet 5, which reduces workability.
プリプレグの３種の管理が必要となり手間がかかってし
まうなどの難点、及び高熱伝導性基板の放熱特性が劣る
などの問題点があった。There were problems such as the need to manage three types of prepreg, which was time-consuming, and the poor heat dissipation properties of the highly thermally conductive substrate.
この発明は、前記のような問題点を解消するためになさ
ねたもので、ガラス−エポキシ基板に比へ、セラミック
ベーパを用いるため放熱特性がよい高熱伝導性基板を提
供できる。The present invention was made to solve the above-mentioned problems, and it is possible to provide a highly thermally conductive substrate with good heat dissipation characteristics because ceramic vapor is used compared to a glass-epoxy substrate.
また、無溶剤タイプの耐熱性接着フィルムを用いること
により、無公害で作業性がよく、プリプレグシートを製
造する工程をはふくことができ、材料の長期保存も可能
となる製造方法を提供することを目的としている。In addition, by using a solvent-free heat-resistant adhesive film, it is possible to provide a manufacturing method that is non-polluting, has good workability, can eliminate the process of manufacturing prepreg sheets, and allows long-term storage of the material. It is an object.
このため、この発明に係る高熱伝導性基板は、導体と耐
熱性接着フィルム、セラミックベーパならびに金属板を
積層したものである。Therefore, the highly thermally conductive substrate according to the present invention is a lamination of a conductor, a heat-resistant adhesive film, a ceramic vapor, and a metal plate.
この発明の高熱伝導性基板の製造法は、耐熱性接着フィ
ルムとセラミックベーパを用い、導体と金属板の間で、
重ね合わせたのち、耐熱性接着フィルムの融点以上の温
度で、加熱加圧して一体化成形することにより高熱伝導
性基板を製造するものである。The method for manufacturing a highly thermally conductive substrate of this invention uses a heat-resistant adhesive film and ceramic vapor to connect a conductor and a metal plate.
After superimposing them, they are heated and pressed at a temperature higher than the melting point of the heat-resistant adhesive film to be integrally molded, thereby producing a highly thermally conductive substrate.
この発明の高熱伝導性基板は、絶縁層に高熱伝導性のセ
ラミックベーパと耐熱性の接着フィルムを用いたことに
より、高熱伝導性、耐熱性の高熱伝導性基板を迅速に製
作できる。The highly thermally conductive substrate of the present invention uses a highly thermally conductive ceramic vapor and a heat-resistant adhesive film for the insulating layer, so that a highly thermally conductive, heat-resistant, and highly thermally conductive substrate can be rapidly produced.
この発明の高熱伝導性基板は、金属板の上にセラミック
ベーパと耐熱性接着フィルムを重ね合わせたのち、さら
にその上に導体層を積層して製造される。この場合、耐
熱性接着フィルムの融点より高い温度で加熱加圧するこ
とにより、各層が接着し、一体化する。この方法で製造
すると、作業性にすぐれ、材料の長期保存も可能で熱伝
導性。The highly thermally conductive substrate of the present invention is manufactured by laminating ceramic vapor and a heat-resistant adhesive film on a metal plate, and then laminating a conductor layer thereon. In this case, each layer is bonded and integrated by heating and pressing at a temperature higher than the melting point of the heat-resistant adhesive film. Manufacturing using this method provides excellent workability, long-term storage of the material, and thermal conductivity.
耐熱性に優れた高熱伝導性基板を得ることができる。A highly thermally conductive substrate with excellent heat resistance can be obtained.
また、無溶剤は耐熱性接着フィルムを使用することによ
り、人体に杉苔をおよぼすことなく、作業時の無公害化
をはかれる。In addition, by using a solvent-free heat-resistant adhesive film, the work is pollution-free without exposing the human body to cedar moss.
（実施例〕 以下に、この発明の一実施例を図に基づいて説明する。(Example〕 An embodiment of the present invention will be described below based on the drawings.
第１図は、この発明の一実施例に係る高熱伝導性基板の
構成説明用断面図である。前出従来例第２図におけると
同一（相当）構成要素は同一符号で表わし説明の重複を
さける。FIG. 1 is a sectional view for explaining the structure of a highly thermally conductive substrate according to an embodiment of the present invention. The same (equivalent) components as in FIG. 2 of the prior art example are indicated by the same reference numerals to avoid duplication of explanation.
図において、１は厚みが０．５ｍｍ〜５ｍｍはどのアル
ミ板、鋼板、鉄板などの金属板、２はこの金属板１の上
に重ね合わせた高熱伝導性セラミックベーパであるセラ
ミックベーパで、このセラミックベーパ２は１００μｍ
〜３００μｍの厚みを有しており、３はこのラミックベ
ーパ２と金属の接着に用いる耐熱性の接着フィルムであ
る耐熱性接着フィルムで、この耐熱性接着フィルム３は
５０μｍ〜１００μｍの厚みを有しており、たとえば、
ＥＡ９６５５：ハイソール社、ＨＴ−４２４−ｕ：Ａｃ
ｃ社などを用いている。■はこの耐熱性接着フィルム３
と前記セラミックベーパ２により構成された絶縁層で、
この絶縁層重は、導体４と金属板１の間に構成されてい
る。In the figure, 1 is a metal plate with a thickness of 0.5 mm to 5 mm, such as an aluminum plate, a steel plate, or an iron plate. 2 is a ceramic vapor that is a highly thermally conductive ceramic vapor superimposed on the metal plate 1. Vapor 2 is 100μm
It has a thickness of ~300 μm, and 3 is a heat-resistant adhesive film that is a heat-resistant adhesive film used for bonding this lamic vapor 2 and metal, and this heat-resistant adhesive film 3 has a thickness of 50 μm to 100 μm. For example,
EA9655: Hysole, HT-424-u: Ac
Company c etc. are used. ■ is this heat resistant adhesive film 3
and an insulating layer constituted by the ceramic vapor 2,
This insulating layer is constructed between the conductor 4 and the metal plate 1.
金属板１．セラミックベーパ２．耐熱性接着フィルムを
重ね合わせ、導体４上に載置したのち、加熱加圧するこ
とにより一体化して高熱伝導性基板を得る。Metal plate 1. Ceramic vapor 2. The heat-resistant adhesive films are superimposed and placed on the conductor 4, and then heated and pressed to be integrated to obtain a highly thermally conductive substrate.
前記構成の高熱伝導性基板の製造方法について説明する
。A method of manufacturing the highly thermally conductive substrate having the above structure will be explained.
あらかじめ、金属板１．セラミックベーパ２゜耐熱性の
接着フィルム３．導体４を、それぞわ指定サイズに裁断
しておく。In advance, prepare a metal plate 1. Ceramic vapor 2° heat resistant adhesive film 3. Each conductor 4 is cut to a specified size.
この裁断された各材料を、金属板１．セラミックベーパ
２．耐熱性接着フィルム３．導体４の順に重ね合わせる
。Each of the cut materials is cut into a metal plate 1. Ceramic vapor 2. Heat-resistant adhesive film 3. Overlap them in the order of conductor 4.
つぎに、こわを前記耐熱性接着フィルム３の融点以上の
温度、圧力６０ ｋｇ／ｃｒｉ″１時間１２０分の条件
で加熱加圧し、一体化して成形する。Next, the stiff pieces are heated and pressed under conditions of a temperature higher than the melting point of the heat-resistant adhesive film 3 and a pressure of 60 kg/cri'' for 1 hour and 120 minutes to integrally mold them.
この発明の一実施例によれば、導体４と絶縁層工、金属
板１からなる高熱伝導性基板において、導体４と金属板
１の間の絶縁層部が、セラミックベーパ２と耐熱性接着
フィルム３とからなるので、迅速に製造でき、高熱伝導
性、耐熱性の高熱伝導性基板を提供できる。According to an embodiment of the present invention, in a highly thermally conductive substrate consisting of a conductor 4, an insulating layer, and a metal plate 1, the insulating layer between the conductor 4 and the metal plate 1 is made of ceramic vapor 2 and a heat-resistant adhesive film. 3, it is possible to provide a highly thermally conductive substrate that can be manufactured quickly and has high thermal conductivity and heat resistance.
また、前記実施例の高熱伝導性基板の製造方法によれば
、導体４と絶縁層部と金属板１とからなる高熱伝導性基
板の製造方法において、導体４と金属板１の間の絶縁層
Ｉとすべく、セラミックベーパ２と耐熱性接着フィルム
３を用い、導体４と金属板の間に位置させて、重ね合わ
せたのち、耐熱性接着フィルム３の融点以上の温度で加
熱加圧して一体化成形したことにより、絶縁層１部に、
強化繊維と熱硬化樹脂より得られたプリプレグシート５
を用いるかわりに、セラミックベーパ２と耐熱性接着フ
ィルム３を使用したので、高熱伝導性基板の製造作業の
高速化、材料の長期保存２作業時の無公害化を行うこと
かでき、また高熱伝導性、高耐熱性の高熱伝導性基板が
得られるという効果を有する。Further, according to the method of manufacturing a highly thermally conductive substrate of the above embodiment, in the method of manufacturing a highly thermally conductive substrate consisting of a conductor 4, an insulating layer portion, and a metal plate 1, an insulating layer between the conductor 4 and the metal plate 1 is provided. In order to achieve I, the ceramic vapor 2 and the heat-resistant adhesive film 3 are placed between the conductor 4 and the metal plate, overlapped, and then heated and pressed at a temperature equal to or higher than the melting point of the heat-resistant adhesive film 3 to integrally form them. As a result, one part of the insulating layer has
Prepreg sheet 5 obtained from reinforcing fiber and thermosetting resin
Instead of using ceramic vapor 2 and heat-resistant adhesive film 3, it is possible to speed up the manufacturing process of highly thermally conductive substrates, eliminate pollution during long-term storage of materials, and also use high thermally conductive substrates. This has the effect that a highly thermally conductive substrate with high heat resistance and high heat resistance can be obtained.
なお、上記実施例において、耐熱性接着フィルム３に無
溶剤の耐熱性接着フィルムを用いることにより、人体５
影響をおよぼすことなく作業を行うことができる。In the above embodiment, by using a solvent-free heat-resistant adhesive film as the heat-resistant adhesive film 3, the human body 5
Work can be done without any impact.
以上に説明したように、この発明に係る高熱伝導性基板
は、基板の絶縁層に高熱伝導性のセラミックベーパと耐
熱性の接着フィルムを用いたもので、迅速に製作でき、
高熱伝導体、耐熱性の基板を提供できる。As explained above, the highly thermally conductive substrate according to the present invention uses a highly thermally conductive ceramic vapor and a heat-resistant adhesive film for the insulating layer of the substrate, and can be manufactured quickly.
It can provide a high thermal conductor and heat resistant substrate.
また、この発明の高熱伝導性基板の製造法によれば、基
板の絶縁層部に強化繊維と熱硬化性樹脂により得られた
プリプレグシートを用いるかわりに、セラミックベーパ
と無溶剤タイプの耐熱性接着フィルムを使用することよ
り、基板製造作業の高速化、材料の長期保存１作業時の
無公害化を行うことができ、また、高耐熱、高熱伝導性
の基板が得られるという効果を有する。In addition, according to the method of manufacturing a highly thermally conductive substrate of the present invention, instead of using a prepreg sheet made of reinforcing fibers and a thermosetting resin for the insulating layer of the substrate, ceramic vapor and a solvent-free heat-resistant adhesive are used. By using a film, it is possible to speed up the substrate manufacturing operation, to avoid pollution during long-term storage of materials, and to obtain a substrate with high heat resistance and high thermal conductivity.
第１図はこの発明の一実施例による高熱伝導性基板の構
成説明用断面図、第２図は従来の金属ベース基板の構成
説明用断面図である。
１は金属板、２はセラミックベーパ、３は耐熱性の接着
フィル、４は導体、工は絶縁層である。FIG. 1 is a sectional view for explaining the structure of a highly thermally conductive substrate according to an embodiment of the present invention, and FIG. 2 is a sectional view for explaining the structure of a conventional metal base substrate. 1 is a metal plate, 2 is a ceramic vapor, 3 is a heat-resistant adhesive film, 4 is a conductor, and 1 is an insulating layer.
Claims (2)
おいて、導体と金属板の間の絶縁層が、高熱伝導性のセ
ラミックペーパーと耐熱性の接着フィルムとからなるこ
とを特徴とする高熱伝導性基板。(1) A highly thermally conductive substrate consisting of a conductor, an insulating layer, and a metal plate, characterized in that the insulating layer between the conductor and the metal plate is made of a highly thermally conductive ceramic paper and a heat-resistant adhesive film. substrate.
製造方法において、導体と金属板の間の絶縁層とすべく
、高熱伝導性のセラミックペーパーと耐熱性の接着フィ
ルムを用い、前記導体と金属板の間に位置させて重ね合
わせたのち、耐熱性の接着フィルムの融点以上の温度で
加熱加圧して一体化成形することを特徴とする高熱伝導
性基板の製造方法。(2) In a method for manufacturing a highly thermally conductive substrate consisting of a conductor, an insulating layer, and a metal plate, a highly thermally conductive ceramic paper and a heat-resistant adhesive film are used as an insulating layer between the conductor and the metal plate. A method for manufacturing a highly thermally conductive substrate, which comprises placing the metal plates on top of each other and then heating and pressing them at a temperature higher than the melting point of a heat-resistant adhesive film to integrally mold them.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11378888A JPH01283988A (en) | 1988-05-11 | 1988-05-11 | High thermal conductivity board and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11378888A JPH01283988A (en) | 1988-05-11 | 1988-05-11 | High thermal conductivity board and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01283988A true JPH01283988A (en) | 1989-11-15 |
Family
ID=14621110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11378888A Pending JPH01283988A (en) | 1988-05-11 | 1988-05-11 | High thermal conductivity board and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01283988A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018195549A (en) * | 2017-05-16 | 2018-12-06 | 日立化成能源科技股▲フン▼有限公司 | Battery pack structure |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61167544A (en) * | 1985-01-19 | 1986-07-29 | 昭和電工株式会社 | Printed substrate |
| JPS62189795A (en) * | 1986-02-17 | 1987-08-19 | 三菱電機株式会社 | Manufacture of heat conductive wiring board |
-
1988
- 1988-05-11 JP JP11378888A patent/JPH01283988A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61167544A (en) * | 1985-01-19 | 1986-07-29 | 昭和電工株式会社 | Printed substrate |
| JPS62189795A (en) * | 1986-02-17 | 1987-08-19 | 三菱電機株式会社 | Manufacture of heat conductive wiring board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018195549A (en) * | 2017-05-16 | 2018-12-06 | 日立化成能源科技股▲フン▼有限公司 | Battery pack structure |
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