JPS6028607Y2 - Composite structure heat-resistant mica board - Google Patents
Composite structure heat-resistant mica boardInfo
- Publication number
- JPS6028607Y2 JPS6028607Y2 JP10570880U JP10570880U JPS6028607Y2 JP S6028607 Y2 JPS6028607 Y2 JP S6028607Y2 JP 10570880 U JP10570880 U JP 10570880U JP 10570880 U JP10570880 U JP 10570880U JP S6028607 Y2 JPS6028607 Y2 JP S6028607Y2
- Authority
- JP
- Japan
- Prior art keywords
- mica
- heat
- laminated
- composite structure
- resistant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Description
【考案の詳細な説明】
本考案は優れた曲げ加工特性を持つ耐熱マイカ板に関す
る。[Detailed Description of the Invention] The present invention relates to a heat-resistant mica plate having excellent bending properties.
従来耐熱性マイカ集成板として、クラッシュマイカを水
ゼット等により砕剥したマイカ鱗片（２０〜２００メツ
シユ）を抄紙機等により抄造して得られた集成マイカ箔
となし、該箔にシリコン樹脂を含浸させた後重ね合せ加
熱加圧硬化させた集成マイカ板が広く使用されている。Conventionally, heat-resistant mica laminated boards are made into laminated mica foil obtained by making mica scales (20 to 200 mesh) by crushing crushed mica with water jet etc. using a paper machine etc., and impregnating the foil with silicone resin. Laminated mica plates are widely used, which are cured by heating and pressurizing.
この集成マイカ板を例えばバンドヒーターの抵抗体の支
持および絶縁体として曲げて使用する場合、板の曲げ外
側面に引張り応力、内側面に圧縮応力が加わり、この応
力により外側に亀裂、内側面にしわまたは折れを生じ絶
縁不良となる欠点を有する。For example, when this laminated mica plate is bent and used as a support for the resistor of a band heater and as an insulator, tensile stress is applied to the outside surface of the board and compressive stress is applied to the inside surface of the board. It has the disadvantage of causing wrinkles or folds, resulting in poor insulation.
本考案はこの欠点をなくした優れた曲げ特性を有する集
成マイカ板を提供するにある。The object of the present invention is to provide a laminated mica plate which eliminates this drawback and has excellent bending properties.
本考案の複合構造の耐熱マイカ板を図面に基づいて説明
すると、第１図は本考案の耐熱マイカ板の側面図、第２
図は集成マイカ層の断面図である。The composite structure heat-resistant mica board of the present invention will be explained based on the drawings. Figure 1 is a side view of the heat-resistant mica board of the present invention,
The figure is a cross-sectional view of the assembled mica layer.
１は外側層の集成マイカ層で、微細マイカ鱗片３が該璧
開面が平行且つ近接してシリコン樹脂４で結合されてい
る。Reference numeral 1 denotes a composite mica layer as an outer layer, in which fine mica scales 3 are bonded with a silicone resin 4 with their opening surfaces parallel and close to each other.
シリコン樹脂４の量は通常約９％前後の量である。The amount of silicone resin 4 is usually around 9%.
２は中間の集成マイカ層で、外側集成マイカ層で使用さ
れたシリコン樹脂量よりはるかに少ない例えば３％のシ
リコン樹脂量で結合された集成マイカ層である。2 is the middle mica assemblage layer, which is a mica assemblage layer bonded with an amount of silicone resin, for example 3%, which is much less than the amount of silicone resin used in the outer assemblage layer.
各層の厚さは例えば各々０．１５１Ｍ１程度のものであ
る。The thickness of each layer is, for example, about 0.151M1.
耐熱性接着剤としては前記シリコン樹脂のほか、無機質
接着剤例えば、燐酸および硼酸並びにＡＩ、 Ｃａ。Heat-resistant adhesives include, in addition to the silicone resins mentioned above, inorganic adhesives such as phosphoric acid and boric acid, as well as AI and Ca.
Ｂａ、 Ｚｎ、 Ｍｇの燐酸塩または硼酸塩の混合物も
使用できる。Mixtures of phosphates or borates of Ba, Zn, Mg can also be used.
また集成マイカ板は前記の製法のほか、微細マイカ鱗片
の抄造液中に接着剤を混入し、また必要に応じ繊維類の
補強材を混合して抄造して得られた箔を重ね合せて加熱
加圧硬化させることによっても得られる。In addition to the manufacturing method described above, laminated mica boards are produced by mixing adhesive into the paper-making solution of fine mica scales and, if necessary, mixing reinforcing materials such as fibers. It can also be obtained by curing under pressure.
本考案の複合構造の耐熱マイカ板は硬化した集成マイカ
板をそれぞれ接着することによっても得られるが、外側
の接着剤含有量の多い未硬化集成マイカシートの中間に
外側集成マイカシートよりも接着剤含有量の少い、ある
いは接着剤を含有しない集成マイカ箔をはさみ、これを
加熱加圧硬化させることによって容易に得られる。The composite structure heat-resistant mica board of the present invention can also be obtained by gluing cured laminated mica sheets, but the outer uncured laminated mica sheet with a higher adhesive content has a higher adhesive content than the outer laminated mica sheet. It can be easily obtained by sandwiching laminated mica foil with a small content or no adhesive and curing it under heat and pressure.
中間に集成マイカ箔を使用するときは外側集成マイカシ
ート中に含浸されている接着剤の１部が加熱により集成
マイカ箔中に浸透し結合する。When an intermediate mica foil lamination is used, a portion of the adhesive impregnated in the outer laminated mica sheet penetrates and bonds into the laminated mica foil upon heating.
接着剤の含有量は接着剤の種類により異なるが、外側集
成マイカ層においてはマイカ鱗片を強固に保持する量で
ある。The content of the adhesive varies depending on the type of adhesive, but is an amount that will firmly hold the mica scales in the outer aggregated mica layer.
本考案の複合構造の耐熱マイカ板は、中間に接着剤の含
有量の少い集成マイカ層を介在するため、曲げが容易で
、曲げによって応力が加っても、応力が弱められ亀裂、
しわ、破れも生じにくくなる特性を有する。The heat-resistant mica plate with a composite structure of the present invention has a laminated mica layer with a low adhesive content in the middle, so it is easy to bend, and even if stress is applied due to bending, the stress is weakened and there is no cracking.
It has the property of being less prone to wrinkles and tears.
１図は本考案の複合構造の耐熱マイカ板の側面図、第２
図は集成マイカシートの断面図を示す。
１：外側集成マイカ層、２：中間集成マイカ層、３：マ
イカ鱗片、４：接着剤。Figure 1 is a side view of the heat-resistant mica plate with a composite structure of the present invention, Figure 2
The figure shows a cross-sectional view of the assembled mica sheet. 1: outer laminated mica layer, 2: middle laminated mica layer, 3: mica scales, 4: adhesive.
Claims (1)
性接着剤で結合された集成マイカ層を両側に配し、それ
らの中間に両側の集成マイカ層よりも少量の耐熱性接着
剤で結合された集成マイカ層を介在させたものからなる
複合構造の耐熱マイカ板。 ２ 中間層の集成マイカ層の結合接着剤量が、０〜１５
％、好ましくは０〜６％である実用新案登録請求の範囲
第１項記載の複合構造の耐熱マイカ板。[Claims for Utility Model Registration] 1. A laminated mica layer in which fine mica scales are bonded with a heat-resistant adhesive with the arm opening surfaces parallel and close to each other is arranged on both sides, and a laminated mica layer on both sides is placed between them. A heat-resistant mica board with a composite structure consisting of a laminated mica layer bonded with a small amount of heat-resistant adhesive. 2 The amount of bonding adhesive in the intermediate mica layer is 0 to 15
%, preferably from 0 to 6%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10570880U JPS6028607Y2 (en) | 1980-07-28 | 1980-07-28 | Composite structure heat-resistant mica board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10570880U JPS6028607Y2 (en) | 1980-07-28 | 1980-07-28 | Composite structure heat-resistant mica board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5729329U JPS5729329U (en) | 1982-02-16 |
| JPS6028607Y2 true JPS6028607Y2 (en) | 1985-08-30 |
Family
ID=29467069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10570880U Expired JPS6028607Y2 (en) | 1980-07-28 | 1980-07-28 | Composite structure heat-resistant mica board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6028607Y2 (en) |
-
1980
- 1980-07-28 JP JP10570880U patent/JPS6028607Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5729329U (en) | 1982-02-16 |
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