JPH02213082A - Exothermic plywood - Google Patents
Exothermic plywoodInfo
- Publication number
- JPH02213082A JPH02213082A JP3184289A JP3184289A JPH02213082A JP H02213082 A JPH02213082 A JP H02213082A JP 3184289 A JP3184289 A JP 3184289A JP 3184289 A JP3184289 A JP 3184289A JP H02213082 A JPH02213082 A JP H02213082A
- Authority
- JP
- Japan
- Prior art keywords
- resin layer
- resin
- plywood
- exothermic
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011120 plywood Substances 0.000 title claims abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 62
- 239000011347 resin Substances 0.000 claims abstract description 62
- 239000003365 glass fiber Substances 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 19
- 239000002023 wood Substances 0.000 claims description 19
- 239000000853 adhesive Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 abstract description 13
- 239000003822 epoxy resin Substances 0.000 abstract description 6
- 229920000647 polyepoxide Polymers 0.000 abstract description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052799 carbon Inorganic materials 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 238000010276 construction Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 53
- 238000000034 method Methods 0.000 description 24
- 229920003002 synthetic resin Polymers 0.000 description 18
- 239000000057 synthetic resin Substances 0.000 description 18
- 238000010438 heat treatment Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000011231 conductive filler Substances 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011491 glass wool Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は発熱合板に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to heat generating plywood.
（従来の技術と発明が解決しようとする課題）従来、床
暖房に用いる発熱合板としては、例えば、合板等の基材
表面に、面状発熱体、絶縁材。(Prior Art and Problems to be Solved by the Invention) Conventionally, heat-generating plywood used for floor heating includes, for example, a sheet heating element and an insulating material on the surface of a base material such as plywood.
耐圧板、アルミニウム板等の均熱板および木質化粧板を
接着剤にて適宜組み合わけて積層一体化したものがある
。There is one in which a pressure-resistant plate, a heat equalizing plate such as an aluminum plate, and a wooden decorative board are laminated and integrated by appropriately combining them with an adhesive.
しかしながら、一般に木質材は加熱、冷却に伴う吸放湿
によって伸縮するものであり、乾燥しずぎると、塗膜割
れや干割れを生じやすい。しかし、アルミニウム等の金
属製均熱板と木質化粧板とは接着性が悪いため、前記発
熱合板を長期間使用すると、木質化粧板が波打ち、外観
劣化が著しいとともに、前記干割れ等によって漏電する
おそれがあり、危険であった。However, wood materials generally expand and contract due to moisture absorption and release during heating and cooling, and if they are too dry, they are likely to cause cracks in the paint film or dry cracks. However, since the adhesion between heat equalizing plates made of metal such as aluminum and wood decorative boards is poor, if the heating plywood is used for a long period of time, the wood decorative boards will become wavy, the appearance will deteriorate significantly, and electrical leakage will occur due to the drying cracks, etc. It was potentially dangerous.
前述の不具合を解消するため、木質化粧板を厚くしたり
、ｓｉｔ防止のために保護層を別途設けるなど種々の工
夫が提案されているが、前者の場合には熱効率が低下す
るとともに、重量が増大するという問題点がある一方、
後者の場合には部品点数、生産工数が増大し、生産性が
低下するという問題点があった。In order to solve the above-mentioned problems, various measures have been proposed, such as making the wood decorative board thicker and providing a separate protective layer to prevent sit. However, in the former case, the thermal efficiency decreases and the weight increases. While there is a problem of increasing
In the latter case, the number of parts and the number of production steps increase, resulting in a decrease in productivity.
本発明は、前記問題点に鑑み、経時劣化が少なく、安全
で軽量、かつ、生産性が高い発熱合板を擾供することを
目的とする。SUMMARY OF THE INVENTION In view of the above-mentioned problems, an object of the present invention is to provide a heat-generating plywood that is safe, lightweight, and highly productive, with little deterioration over time.
（課題を解決するための手段）
本発明にかかる発熱合板は、前記目的を達成するため、
基材の上面に、下から防水樹脂層、電極を備えた発熱樹
脂層、ガラス繊維混入樹脂層および木質化粧板の順に少
なくとも前記樹脂層の一層を自己接着性により他層と貼
着一体化構成としたものである。(Means for Solving the Problems) In order to achieve the above object, the heat generating plywood according to the present invention has the following features:
On the top surface of the base material, at least one layer of the resin layer is integrated with other layers by self-adhesiveness in the following order: a waterproof resin layer, a heat-generating resin layer with electrodes, a glass fiber-containing resin layer, and a wood decorative board from below. That is.
（作用と発明の効果）
したがって、本発明によれば、各層を少なくとも一層の
自己接着性の樹脂層で貼着することにより、具体的には
各樹脂層を加熱、加圧下で硬化させることにより、全層
を接着剤で貼着一体化するものに比べ、接着時に生じる
応力が小さくなり、反りが生じにくく、又、強固に一体
化するので、いわば−枚板の発熱合板を得られることに
なる。(Operation and Effects of the Invention) Therefore, according to the present invention, each layer is pasted with at least one self-adhesive resin layer, specifically, by curing each resin layer under heat and pressure. Compared to the case where all the layers are bonded together with adhesive, the stress generated during bonding is smaller, warping is less likely to occur, and it is tightly integrated, so it is possible to obtain a single sheet of heat-generating plywood. Become.
特に、木質化粧板の下面に自己接着性のガラス繊維混入
樹脂層を用いると、木質化粧板の裏面凹凸になじんで密
着するので、前記木質化粧板が補強される。このため、
木質化粧板が発熱樹脂層の加熱、冷却によって吸放湿を
繰り返しても、前記木質化粧板に干割れ、波打ち１反り
が生じにくく、耐久性が向上する。In particular, if a self-adhesive glass fiber-containing resin layer is used on the lower surface of the decorative wooden board, it will adapt and adhere to the unevenness of the back surface of the decorative wood board, thereby reinforcing the decorative wood board. For this reason,
Even if the wood decorative board repeatedly absorbs and desorbs moisture by heating and cooling the heat-generating resin layer, dry cracking, waving, and warping are less likely to occur in the wood decorative board, and durability is improved.
また、前記ガラス繊維混入樹脂層は発熱樹脂層の上面に
密着して被覆するので、発熱合板の絶縁性、防水性が向
上し、漏電を防止する。Furthermore, since the glass fiber-containing resin layer closely covers the upper surface of the heat-generating resin layer, the insulation and waterproof properties of the heat-generating plywood are improved and electric leakage is prevented.
しかも、繊維を含有する前記ガラス繊維混入樹脂層は機
械的強度が高いので、外部から衝撃力が加わっても、発
熱樹脂層に亀裂が生じにくい。このため、発熱樹脂層の
抵抗値が変化せず、安全である。Moreover, since the glass fiber mixed resin layer containing fibers has high mechanical strength, cracks are unlikely to occur in the heat generating resin layer even if an impact force is applied from the outside. Therefore, the resistance value of the heat generating resin layer does not change and is safe.
さらに、本発明によれば、各樹脂層自体が従来例におけ
る板状発熱体、耐圧板等の機能を有するとともに、接着
剤としての機能をも有するので、接着剤が不要になり、
生産工数が減少し、生産性が向上するととらに、薄く、
かっ、軽い発熱合板が得られるという効果がある。Furthermore, according to the present invention, each resin layer itself has the functions of a plate-shaped heating element, a pressure plate, etc. in the conventional example, and also has a function of an adhesive, so there is no need for an adhesive.
In addition to reducing production man-hours and improving productivity,
This has the effect of producing light heat generating plywood.
（実施例）
以下、発明にがかる一実施例を添付図面に従って説明す
る。(Embodiment) An embodiment of the invention will be described below with reference to the accompanying drawings.
本発明にかかる発熱合板１は、基材２の上面に防水樹脂
層３、電極４を備えた発熱樹脂層５、ガラス繊維混入樹
脂層６および木質化粧板７の順に積層し、前記各層を有
機的結合により一体化したものである。The heat generating plywood 1 according to the present invention has a waterproof resin layer 3, a heat generating resin layer 5 having electrodes 4, a glass fiber mixed resin layer 6, and a wood decorative board 7 laminated in this order on the upper surface of a base material 2, and each of the layers is It is integrated by physical connections.
基材２としては、合板、パーティクルボード。The base material 2 is plywood or particle board.
インシュレーションボード、ケイ酸カルシウム板等の単
体又はこれらの複合板が挙げられる。Examples include single bodies such as insulation boards and calcium silicate boards, or composite boards thereof.
なお、必要に応じて前記基材２は、その裏面にグラスウ
ール等の断熱材を設けておいてもよい。Note that, if necessary, the base material 2 may be provided with a heat insulating material such as glass wool on the back surface thereof.
防水樹脂層３は、後述する電極４を備えた発熱樹脂層５
を、前記基材２の下面から絶縁するためのらので、合成
樹脂液を前記基材２の表面に５０〜５００９７ｘ”の割
合で直接塗布、固化して形成してもよく、又は、厚さ５
〜５０ ａｆｌｓ（Ｉ ｍ１Ｉｓ＝千分のＩ １ｎｃｈ
４０．０２５ｍｍ）、好ましくはｌＯ〜３０ ｗｉｔｓ
の樹脂含浸紙もしくは不織布に前記合成樹脂液を含浸し
てシート状にしたものを、前記基材２の上面に配し、熱
圧一体化して形成してもよい。The waterproof resin layer 3 includes a heat generating resin layer 5 provided with an electrode 4 which will be described later.
To insulate from the lower surface of the base material 2, a synthetic resin liquid may be directly applied to the surface of the base material 2 at a ratio of 50 to 50097 x and solidified, or the thickness may be 5
~50 afls (I m1Is = I 1 nch in 1,000
40.025mm), preferably lO ~ 30 wits
A sheet of resin-impregnated paper or nonwoven fabric impregnated with the synthetic resin liquid may be placed on the upper surface of the base material 2 and integrated under heat and pressure.
前記合成樹脂としては、例えば、エポキシ樹脂。Examples of the synthetic resin include epoxy resin.
ウレタン樹脂、アクリル樹脂、メラミン樹脂、フェノー
ル樹脂等が挙げられる。Examples include urethane resin, acrylic resin, melamine resin, and phenol resin.
前記防水樹脂！ｆ！ｉ３は下面からの防水性、絶線性を
高めるとともに、後述する発熱樹脂層５を均質に形成し
、発熱にバラツキが生じないようにガラス繊維や炭カル
、シリカ、タルク等の無機質フィラーを用いて適宜肉も
ちを良好にすることが好ましい。Said waterproof resin! f! i3 improves waterproofness and wire insulation from the bottom surface, and the heat-generating resin layer 5 (described later) is uniformly formed, using inorganic fillers such as glass fiber, charcoal, silica, and talc to prevent variations in heat generation. It is preferable to improve the texture as appropriate.
電極４は導電材、例えば、銅製テープ、銅線からなるも
ので、前記防水樹脂層３の−Ｅ面の両縁部に、５〜１０
０ＣＩのピッチで平行に配し、電極４の端部を外部電源
に接続可能としである。The electrode 4 is made of a conductive material, such as a copper tape or a copper wire.
The electrodes 4 are arranged in parallel with a pitch of 0CI, and the ends of the electrodes 4 can be connected to an external power source.
発熱樹脂層５は前記電極４の通電によって発熱するもの
であり、この発熱樹脂層５を形成する方法としては、以
下に述べる複数の方法がある。The heat generating resin layer 5 generates heat when the electrode 4 is energized, and there are several methods for forming the heat generating resin layer 5 as described below.
第１の方法は、合成樹脂液に導電性フィラーを混練した
ものを、前記防水樹脂層３および電極４の表面に１００
〜１０００９７貢−好ましくは３００〜５００ｖ／ｘ”
の割合で直接塗布、固化して形成する方法である。In the first method, a synthetic resin liquid mixed with a conductive filler is applied to the surfaces of the waterproof resin layer 3 and the electrodes 4 at a rate of 100%.
~100097 tributaries - preferably 300-500v/x”
It is a method of directly coating and solidifying at a ratio of .
前記合成樹脂としては、エポキシ樹脂、ポリエステルＩ
＃脂、ウレタン樹脂、アクリル樹脂１フェノール樹脂、
ｐｖｃ樹脂等が挙げられる。As the synthetic resin, epoxy resin, polyester I
#fat, urethane resin, acrylic resin 1 phenol resin,
Examples include pvc resin.
また、前記導電性フィラーとしては、カーボン。Further, the conductive filler is carbon.
グラファイト、金属粉、金属酸化物等が挙げられる。Examples include graphite, metal powder, metal oxides, and the like.
第２の方法は、厚さ１（１−２００ｉｉ１ｓ、好ましく
は２０〜Ｉ ＯＯ＋ａｉ１ｇのカーボン繊維不織布等の
導電性シートに前記合成樹脂液を含浸させたしのを、前
記防水樹脂層３および電極４の表面に熱圧一体化して形
成する方法である。The second method is to impregnate a conductive sheet such as a carbon fiber non-woven fabric with a thickness of 1 (1-200ii1s, preferably 20 to IOO+ai1g) with the synthetic resin liquid, and apply it to the waterproof resin layer 3 and the electrode 4. This is a method in which the material is formed by heat-pressing and integrating it onto the surface of the material.
ガラス繊維混入樹脂層６はガラス繊維と合成樹脂とから
なるもので、前記合成樹脂としては、例えば、ポリエス
テル樹脂、エポキシ樹脂１フェノール樹脂、メラミン樹
脂等が挙げられる。The glass fiber mixed resin layer 6 is made of glass fiber and a synthetic resin, and examples of the synthetic resin include polyester resin, epoxy resin, phenol resin, and melamine resin.
このガラス繊維混入樹脂層６を前記発熱樹脂層５の表面
に形成する方法としては以下に述べる種々の方法がある
。There are various methods for forming this glass fiber mixed resin layer 6 on the surface of the heat generating resin layer 5, which will be described below.
第１の方法は、前記合成樹脂液にガラス繊維チョップス
トランドを混練したものを、前記発熱樹脂層５の表面に
１００〜１０００９／ｘ″、好ましくは３００〜５００
９／ｘ”の割合で塗布して形成する方法である。塗布量
を１００〜Ｉ Ｏ００ｇ／＊”としたのは、Ｉ ＯＯ９
／３１”未満であると、絶縁性。The first method is to knead glass fiber chopped strands into the synthetic resin liquid and apply it to the surface of the heat generating resin layer 5 at a rate of 100 to 10009/x'', preferably 300 to 500.
This is a method of coating at a ratio of 9/x''.The coating amount was set to 100 to 100g/*'' because of I09
If it is less than /31", it is insulating.
強度が劣るからであり、 １０００９／ｘ”を越える
と、重く、厚くなるだけでなく、熱効率が悪くなるから
である。This is because the strength is inferior, and if it exceeds 10009/x'', it not only becomes heavy and thick, but also has poor thermal efficiency.
第２の方法は、厚さ１０〜２００ｍ１ｌｓのガラスｍ維
シートに前記合成樹脂液を含浸させて得たシート状のも
のを、前記発熱樹脂層５の表面に配する方法である。厚
さ１０〜２００ｍ１ｌｓのガラス繊維シートを使用する
のは、厚さが１０ｍ１ｌｓ未満であると、絶縁性や強度
が劣るからであり、２００ｓｉ ｈを越えると、重く、
厚くなり、熱効率が悪化するからである。The second method is a method in which a sheet-like sheet obtained by impregnating a glass m-fiber sheet with a thickness of 10 to 200 mls with the synthetic resin liquid is placed on the surface of the heat generating resin layer 5. The reason why a glass fiber sheet with a thickness of 10 to 200 mls is used is because if the thickness is less than 10 mls, the insulation and strength will be poor, and if it exceeds 200 sih, it will be heavy and
This is because it becomes thicker and the thermal efficiency deteriorates.
第３の方法は、発熱樹脂１５の表面に前記ガラス繊維シ
ートを敷設した後、これに前記熱硬化性合成樹脂液を塗
布する方法である。The third method is to lay the glass fiber sheet on the surface of the heat-generating resin 15 and then apply the thermosetting synthetic resin liquid thereto.
上記いずれの方法においてもガラス繊維混入樹脂層６の
硬化前に後述する木質化粧板７を配し、熱圧一体化して
形成すると、木質化粧板７の裏面の凹凸に樹脂やガラス
繊維が充填され、補強されることになる。In any of the above methods, if a wood decorative board 7 (described later) is placed before the glass fiber-containing resin layer 6 is cured, and the wood decorative board 7 is integrated by heat and pressure, the unevenness on the back surface of the wood decorative board 7 will be filled with resin or glass fiber. , will be reinforced.
木質化粧板７としては、厚さ０．２＊ｘないし３ｚｘの
木材単板、または、これを表層に用いた厚さ２ｘｘ〜７
ｎの化粧合板が挙げられる。As the wood decorative board 7, a wood veneer with a thickness of 0.2*x to 3zx, or a wood veneer with a thickness of 2xx to 7 using this as the surface layer.
Examples include decorative plywood.
前記木材単板としては、例えば、無処理単板の他、ＷＰ
Ｃ単板、アセチル化処理単板、無機化合物注入単板等を
用いると、より耐久性が向上するので、好ましい。As the wood veneer, for example, in addition to untreated veneer, WP
It is preferable to use a C veneer, an acetylated veneer, an inorganic compound-injected veneer, or the like because the durability is further improved.
本実施例にかかる発熱合板ｌを製造する方法としては、
既述した各層の製造方法を組み合わせることにより、種
々の方法が考えられ、例えば、以下に述べる方法がある
。The method for manufacturing the heat generating plywood l according to this example is as follows:
By combining the manufacturing methods for each layer described above, various methods can be considered, such as the methods described below.
第１の方法は各樹脂層のすべてを樹脂含浸シートで形成
する方法で、基材２の上面に樹脂含浸シートを順次敷設
した後、木質化粧板を載置し、加熱、圧締することによ
り、接着一体化して積層する方法である。The first method is to form all of the resin layers with resin-impregnated sheets. After sequentially laying the resin-impregnated sheets on the top surface of the base material 2, a wooden decorative board is placed, heated, and pressed. This is a method of bonding and laminating them together.
この方法においては、合成樹脂の種類、各層の厚さ、ガ
ラス繊維の混入率等の条件によって加熱。In this method, heating is performed depending on conditions such as the type of synthetic resin, the thickness of each layer, and the percentage of glass fiber mixed in.
圧締条件は異なるが、一般に加圧温度１００〜２００℃
、圧力２０〜１５０ ｋｇ／ｃｘ”、加圧時間数秒〜数
分が適当である。Pressing conditions vary, but generally the pressing temperature is 100-200℃
, a pressure of 20 to 150 kg/cx'' and a pressurizing time of several seconds to several minutes.
この方法によると、−度に形成でき、隣接する樹脂同志
が混合せず、好ましい。According to this method, it is possible to form the resin layer in one step, and adjacent resins do not mix with each other, which is preferable.
第２の方法は、各樹脂層の選択される樹脂層をウェット
な状態の合成樹脂から直接形成する方法である。すなわ
ち、基材２の上面に合成樹脂液を塗布して形成した防水
樹脂層３、その表面に所定のピッチで電極４を配し、つ
いで、あらかじめ合成樹脂液に導電性フィラーを混練一
体化してなるシート材を用いて形成した発熱樹脂層５を
配し、さらに、合成樹ＩＩＩ液にガラス繊維チョップス
トランドを混練したものを塗布し、その表面に木質化粧
板７を配した後、熱圧一体化して積層する方法である。The second method is to directly form selected resin layers of each resin layer from a wet synthetic resin. That is, a waterproof resin layer 3 is formed by coating a synthetic resin liquid on the upper surface of a base material 2, electrodes 4 are arranged on the surface at a predetermined pitch, and then a conductive filler is kneaded and integrated with the synthetic resin liquid in advance. A heat-generating resin layer 5 formed using a sheet material of This is a method of laminating layers.
なお、−度に熱圧しないで、順次、加熱、仮圧締して各
層を形成する方法を併用してもよい。Note that a method of sequentially heating and temporarily pressing to form each layer without heat-pressing may be used in combination.
一般に合成樹脂液の種類等によって熱圧条件は異なるが
、加熱温度８０〜２００℃、圧力２〜３０に９／ｃｍ″
、加圧時間２分〜数十分が適当であり、本法によれば各
層を接着させるために高い圧力を必要としない。In general, heat and pressure conditions vary depending on the type of synthetic resin liquid, etc., but the heating temperature is 80 to 200℃, the pressure is 2 to 30℃, 9/cm''
, a pressure time of 2 minutes to several tens of minutes is appropriate, and according to this method, high pressure is not required to bond each layer.
また、ガラス繊維混入樹脂層６をウェットな合成樹脂液
で形成することにより、木質化粧板お上び発熱樹脂層と
の密着性を向上させると、特に好ましい。同様に、発熱
樹脂層５をウェットな状態の合成樹脂とし、他の樹脂層
にシート体を用いてもよい。Furthermore, it is particularly preferable to form the glass fiber-containing resin layer 6 with a wet synthetic resin liquid to improve the adhesion with the wood decorative board and the heat-generating resin layer. Similarly, the heat generating resin layer 5 may be made of wet synthetic resin, and the other resin layers may be made of sheet bodies.
本発明にかかる発熱合板の製造方法は、前述の方法に限
らず、樹脂含浸シートと液状樹脂およびあらかじめ硬化
した樹脂シートとを適宜併用してもよい。The method for producing heat generating plywood according to the present invention is not limited to the above-described method, and may appropriately use a resin-impregnated sheet, a liquid resin, and a pre-cured resin sheet in combination.
図は本発明にかかる発熱合板の一実施例を示す断面図で
ある。
１・・・発熱合板、２・・・基材、３・・・防水樹脂層
、４・・・電極、５・・・発熱樹脂層、６・・・ガラス
繊維混入樹脂層、７・・・木質化粧板。The figure is a sectional view showing an embodiment of the heat generating plywood according to the present invention. DESCRIPTION OF SYMBOLS 1... Heat generating plywood, 2... Base material, 3... Waterproof resin layer, 4... Electrode, 5... Heat generating resin layer, 6... Glass fiber mixed resin layer, 7... Wooden decorative board.
Claims (1)
発熱樹脂層、ガラス繊維混入樹脂層および木質化粧板の
順に前記樹脂層の少なくとも一層を自己接着性により他
層と貼着一体化したことを特徴とする発熱合板。(1) On the top surface of the base material, at least one layer of the resin layer is adhered to other layers using self-adhesive properties in the following order: a waterproof resin layer, a heat-generating resin layer with electrodes, a glass fiber-containing resin layer, and a wood decorative board. Heat generating plywood characterized by its integrated structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3184289A JPH02213082A (en) | 1989-02-10 | 1989-02-10 | Exothermic plywood |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3184289A JPH02213082A (en) | 1989-02-10 | 1989-02-10 | Exothermic plywood |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02213082A true JPH02213082A (en) | 1990-08-24 |
Family
ID=12342307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3184289A Pending JPH02213082A (en) | 1989-02-10 | 1989-02-10 | Exothermic plywood |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02213082A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010091185A (en) * | 2008-10-08 | 2010-04-22 | Panasonic Corp | Heating apparatus and vehicle heater using the same |
| CN102312545A (en) * | 2011-07-05 | 2012-01-11 | 上海热丽电热材料有限公司 | Low-temperature heating solid wood composite floor and preparation method thereof |
| CN103687103A (en) * | 2013-12-20 | 2014-03-26 | 昆山建通电子科技有限公司 | Electric leakage prevention heating floor and manufacturing method thereof |
| CN104521628A (en) * | 2014-12-18 | 2015-04-22 | 邱有英 | Heater for farmland seedling culture |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55100688A (en) * | 1979-01-23 | 1980-07-31 | Sekisui Chemical Co Ltd | Method of manufacturing panel heating plate |
| JPS61261567A (en) * | 1985-05-15 | 1986-11-19 | 松下電工株式会社 | Floor heating panel |
-
1989
- 1989-02-10 JP JP3184289A patent/JPH02213082A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55100688A (en) * | 1979-01-23 | 1980-07-31 | Sekisui Chemical Co Ltd | Method of manufacturing panel heating plate |
| JPS61261567A (en) * | 1985-05-15 | 1986-11-19 | 松下電工株式会社 | Floor heating panel |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010091185A (en) * | 2008-10-08 | 2010-04-22 | Panasonic Corp | Heating apparatus and vehicle heater using the same |
| CN102312545A (en) * | 2011-07-05 | 2012-01-11 | 上海热丽电热材料有限公司 | Low-temperature heating solid wood composite floor and preparation method thereof |
| US8866048B2 (en) | 2011-07-05 | 2014-10-21 | Shanghai Rell Electric Heating Systems Co., Ltd | Low-temperature heat-generating solid wood laminate floor and preparation method thereof |
| CN103687103A (en) * | 2013-12-20 | 2014-03-26 | 昆山建通电子科技有限公司 | Electric leakage prevention heating floor and manufacturing method thereof |
| CN104521628A (en) * | 2014-12-18 | 2015-04-22 | 邱有英 | Heater for farmland seedling culture |
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