CN104481111A - Large-area multi-layer solid wood composite electric heating floor and preparation method thereof - Google Patents
Large-area multi-layer solid wood composite electric heating floor and preparation method thereof Download PDFInfo
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- CN104481111A CN104481111A CN201410617075.4A CN201410617075A CN104481111A CN 104481111 A CN104481111 A CN 104481111A CN 201410617075 A CN201410617075 A CN 201410617075A CN 104481111 A CN104481111 A CN 104481111A
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Abstract
The invention discloses a large-area multi-layer solid wood composite electric heating floor and a preparation method thereof. The large-area multi-layer solid wood composite electric heating floor comprises a waterproof layer, a combined substrate layer, a first insulating layer, a heating chip layer, a second insulating layer and a decorative layer, wherein the waterproof layer is fitted on the lower surface of the combined substrate layer; the first insulating layer, the heating chip layer, the second insulating layer and the decorative layer are orderly fitted on the upper surface of the combined substrate layer from bottom to top; the heating chip layer is a series circuit composed of two heating chips and a copper strip; the first insulating layer is formed by coating the upper surface of the combined substrate layer with a layer of insulating resin; the insulating layer is formed by coating the bottom surface of the decorative layer with a layer of insulating resin. Carbon fiber electric heating non-woven paper is taken as the heating chip, and is thin, thoroughly soaked with a glue, high in combined strength and lower than wood pulp conductive paper in decay power; the area of the solid wood composite electric heating floor is equal to the combined area of 7-8 small heating floors; the large-area multi-layer solid wood composite electric heating floor is convenient to mount, and a large quantity of power wires and mounting workload can be saved.
Description
Technical field
The present invention relates to a kind of large area multi-layer solid wood compound electro-thermal floor and preparation method thereof.
Background technology
In prior art, multi-layer solid wood composite heating floor only has the specification of small size, and adopt exothermic material to be wood pulp conductive paper, its production technology comprises the following steps: 1) dozens of on a large backing material plate face is connect power supply position and punch; 2) spread a several large wood pulp conductive paper after a large backing material plate upper surface being coated resin glue and arrange copper strips again; 3) carry out being spliced into the plane of a size with backing material plate on conductive paper with after several large decoration wood subcutaneous surface gluing of the same race; 4) through hot pressing, health, fixed thick, carry out after sanding process cutting little floor specification; 5) slot, leaching paint Wear-resistant Treatment.
The shortcoming of above-mentioned small-sized heating floor technique is: 1) heating board small size specification, installs very inconvenient, consumes manpower loaded down with trivial details in a large number and power line, brings potential faults; 2) wood pulp conductive paper intensity is low, and paper is thick, and seep through is poor, and water-resistance is weak, nonreactive strain elasticity, and decay common ratio is large; 3), when cutting small-sized heating floor on the long limit of the exposed heating floor of conductive paper, potential safety hazard is had; 4) purposes is single, must be combined and could use with not heating floor, independently can not use, cannot install and use on electrothermic kang.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of large area multi-layer solid wood compound electro-thermal floor
The another one technical problem that the present invention will solve is to provide a kind of preparation method of large area multi-layer solid wood compound electro-thermal floor.
For large area multi-layer solid wood compound electro-thermal floor, the technical solution used in the present invention is: comprise waterproofing course, decorative layer, combination substrate layer, the first insulating layer, heat generating core lamella and the second insulating layer;
To fit below described combination substrate layer balance layer, combination substrate layer be equipped with the first insulating layer, heat generating core lamella, the second insulating layer and decorative layer from top to bottom successively above;
Described combination substrate layer divides large backing material plate the backing material plate being cut to small size, then the backing material plate of multiple small size is reassembled into large-area backing material plate;
Described heat generating core lamella is be arranged in parallel by two panels euthermic chip, be equipped with tail end the copper strips be connected with euthermic chip respectively at the head end of every sheet euthermic chip, the copper strips being positioned at two panels euthermic chip tail end is interconnected, from the head end of wherein a slice euthermic chip by this euthermic chip to the copper strips of its tail end, pass through the head end of this euthermic chip to this euthermic chip from the copper strips of another sheet euthermic chip tail end again, two panels euthermic chip forms the heating circuit of series connection;
Described first insulating layer is formed by being coated with last layer insulating resin glue on combination substrate layer surface; Described second insulating layer is formed by decorative layer coated on bottom side last layer insulating resin glue.
As preferably, insulating resin glue is HL501 resin glue.
As preferably, euthermic chip is carbon fiber heating non-woven paper.
As preferably, decorative layer is again spliced into the wooden cortex with floor pattern after cutting into the truewood skin of fritter area by wooden skin.
As preferably, waterproofing course is melamine impregnated paper.
For the preparation method on large area multi-layer solid wood compound electro-thermal floor, the technical solution used in the present invention comprises the following steps:
(1) first the euthermic chip of selected power is carried out cutting by regulatory specifications, and copper strips is set at the hair two ends of euthermic chip, and by heating circuit in series for two panels euthermic chip;
(2) after large backing material plate being cut multiple small size backing material plate, small size backing material plate is slotted, then 8 ~ 9 small size backing material plates are spliced into large area substrates plate; Described large area substrates plate is after health is fixing, through fixed thick, sanding, beat power supply connecting hole, then coat insulating resin glue at the upper surface of large area substrates plate;
(3) using the plate cutting into small size as the wooden skin of decorative layer, the decorative layer with floor pattern is spliced into 8 ~ 9 wooden skins, insulating resin glue in the coated on bottom side of decorative layer;
(4) the power supply pin and box sub will the copper strips of euthermic chip loaded onto little copper sheet and make, makes heat generating core lamella;
(5) successively lay waterproofing course from top to bottom, coat insulating resin glue after combination substrate layer, heat generating core lamella and the decorative layer after coating insulating resin glue, hot press carries out pressing and obtains large area multi-layer solid wood compound electro-thermal floor;
(6) side on the large area multi-layer solid wood compound electro-thermal floor after pressing is slotted, multiple tracks priming paint is carried out to decor surface flow coating equipment, the decoration process of finish paint.
As preferably, euthermic chip is carbon fiber heating non-woven paper.
As preferably, combination backing material plate divides large backing material plate the backing material plate being cut to small size, after fluting plays glue, the backing material plate of multiple small size is spliced into large-area combination backing material plate again.
As preferably, decorative layer be wooden skin be spliced into floor install after pattern, or different wooden skin color splices any pattern, or uses any pattern decorative.
As preferably, insulating resin glue is HL501 resin glue, and waterproofing course is melamine impregnated paper.
The invention has the beneficial effects as follows:
Adopt carbon fiber electric heating non-woven paper as euthermic chip, paper is thin, water resistant, anti-strain elastic force, and soak into glue good, combined strength bination is high, and decay power is lower than wood pulp conductive paper, and the life-span is long; Solid wood compound electro-thermal floor area equals the area of 7 ~ 8 little heating floor combinations, easy for installation, saves a large amount of power line and installation workload, reduces fault rate.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
Fig. 1 is the structural representation of large area multi-layer solid wood compound electro-thermal floor of the present invention embodiment.
Fig. 2 is the heat generating core lamella schematic diagram of large area multi-layer solid wood compound electro-thermal floor of the present invention embodiment.
Fig. 3 is the substrate layer schematic diagram of large area multi-layer solid wood compound electro-thermal floor of the present invention embodiment.
Fig. 4 is the decorative layer truewood skin composed pattern schematic diagram of large area multi-layer solid wood compound electro-thermal floor of the present invention embodiment.
Fig. 5 is that the euthermic chip of large area multi-layer solid wood compound electro-thermal floor of the present invention embodiment is connected with copper strips and combines schematic diagram.
Fig. 6 is the A-A sectional view of Fig. 5.
In figure, 1-decorative layer, 2-underlying insulating layer, 3-euthermic chip, 4-power connection, 5-electrode copper strips, 6-upper-layer insulation film, 7-substrate layer, 8-waterproofing course, 9-power supply connecting hole.
Detailed description of the invention
Fig. 1 is a kind of large area multi-layer solid wood compound electro-thermal floor, is to be composited by decorative layer 1, underlying insulating layer 2, heat generating core lamella, power connection 4, electrode copper strips 5, upper-layer insulation film 6, substrate layer 7, waterproofing course 8.
The present embodiment large area multi-layer solid wood compound electro-thermal floor manufactures according to following steps:
1, first heat generating core lamella is made: ultra-thin carbon fiber heating non-woven paper is cut by regulatory specifications, two panels carbon fiber heating non-woven paper is arranged in parallel as euthermic chip 3, electrode copper strips 5 is laid at the two ends end to end of every sheet euthermic chip 3, and the electrode copper sheet being positioned at tail end is interconnected to constitute series circuit (Fig. 5), then weld as power connection 5 with the electrode copper strips 5 being positioned at every sheet euthermic chip head end with little copper sheet.The heat generating core lamella finally made as shown in Figure 2.
Relatively existing euthermic chip technique, this is replace copper strips to form loop with carbon fiber heating non-woven paper with ultra-thin euthermic chip, saves loop copper strips and the power line needed for installation.Electrode copper strips 5 with conduction carbon fiber heating non-woven paper with mutually intert the way of contact carry out being connected (Fig. 6), copper strips contact conduction paper adhesion is improved under not using conductive paste class situation, physics reversal interlocking relay is utilized to be used for more effective carbon fiber heating non-woven paper and the contact forces of copper strips of strengthening conduction dexterously, reduce the aging loose contact phenomenon of conductive paste thus, reduce fault rate, reduce costs, simplify installation procedure.
2, backing material plate production technology is combined: the backing material plate of 1) whole backing material plate being cut the same size specification in several and little floor; 2) slotted in little backing material plate four limit; 3) when installing with floor after fluting, the same operation is beaten glue intersection and is pieced together the rectangle large gauge combination backing material plate installing the same pattern with floor; 4) backing material plate is combined through 20 days natural ventilation health heat treatments to rectangle large gauge; 5) carry out after health process carrying out surely thick sanding process to combination backing material plate; 6) after fixed thick sanding process, punched in the external power supply position of combination backing material plate; 7) after punching, insulating resin glue is coated to combination backing material plate upper surface rubber-roller machine.As shown in Figure 3, power supply connecting hole 9 is left in centre to combination backing material plate structure.
3, decorative layer production technology is spliced: 1) choose qualified wooden skin and cut according to little floor size specification; 2) the wooden Pi Si limit after cutting is carried out gluing and is spliced into the rectangle decorative cover that the same pattern is installed on floor; 3) splice after decorative cover solidifies 2 ~ 3 hours and coat insulating resin glue with rubber-roller machine.Decoration layer pattern is as Fig. 4.
What 4, insulating layer material adopted is HL501 resin glue, HL501 resin glue has that insulation, heatproof, intensity are high, waterproof, anti-aging, be out of shape little feature, the insulating properties safety requirements of floor manufacture process requirement and heating floor product can be met.HL501 resin glue is coated respectively with combination substrate layer upper surface in the wooden skin bottom surface as decorative layer, then one is bonded with euthermic chip, through while drying after on the upper surface and soffit of euthermic chip, form insulating layer, reach the dual purpose of compound and insulation.
What 5, waterproof layer material adopted is melamine impregnated paper, and have balance, waterproof, moisture-proof role, on large area multi-layer solid wood compound electric heating plate, Main Function is waterproof, moistureproof.
6, the laying before carrying out pressing in the following order: 1) spread waterproofing course, 2) substrate layer is combined, 3) combination of euthermic chip copper strips, 4) place fixing little copper sheet at copper strips power supply input and output position, 5) splicing wood skin decorative layer is spread, with hot press pressing 5 ~ 8 hours.
7, form large area multi-layer solid wood compound electro-thermal floor four limit parallel bars ultra-wide groover to pressing to slot.
8, multiple tracks priming paint is carried out in the large area multi-layer solid wood compound electro-thermal floor completing fluting on pouring paint machine, the process of multiple tracks finish paint incrustation.Also the wooden cortex of decoration can be replaced by parquets facing paper, pressing rear surface Wear-resistant Treatment directly carries out alundum (Al2O3) wearing layer pressing process by moment pressing method, carry out large area multilayer heating board again to have slotted Product Process, this method saves the wear-resisting leaching paint technique of priming paint, and therefore cost is lower.
9, after the source of welding current electric wire of power connection 4 position, do insulation firmly process, fill with YY2010A/B insulation encapsulated glue, this glue good fluidity intensity is high, and insulation is high temperature resistant, firmly, anti-aging.
The large area multi-layer solid wood compound electro-thermal floor of the present embodiment not only with the solid wood composite heating floor producing technology of existing small-sized on different, and adopt different heat chip material, different structure combined type substrate layer, different decorative layer splicing wood skin effect pattern, while product quality improves, the increasing of area brings more multipurpose, can floor file warm up, also electrothermic kang can be laid separately, reduce 8 ~ 9 times of installation workload and power line, in technology and product quality, strategic structural.
Above-described embodiment of the present invention, does not form limiting the scope of the present invention.Any amendment done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within claims of the present invention.
Claims (10)
1. large area multi-layer solid wood compound electro-thermal floor, comprises waterproofing course, decorative layer; It is characterized in that, also comprise combination substrate layer, the first insulating layer, heat generating core lamella and the second insulating layer;
To fit below described combination substrate layer waterproofing course, combination substrate layer be equipped with the first insulating layer, heat generating core lamella, the second insulating layer and decorative layer from top to bottom successively above;
Described combination substrate layer divides large backing material plate the backing material plate being cut to small size, then the backing material plate of multiple small size is reassembled into large-area backing material plate;
Described heat generating core lamella is be arranged in parallel by two panels euthermic chip, be equipped with tail end the copper strips be connected with euthermic chip respectively at the head end of every sheet euthermic chip, the copper strips being positioned at two panels euthermic chip tail end is interconnected, from the head end of wherein a slice euthermic chip by this euthermic chip to the copper strips of its tail end, pass through the head end of this euthermic chip to this euthermic chip from the copper strips of another sheet euthermic chip tail end again, two panels euthermic chip forms the heating circuit of series connection;
Described first insulating layer is formed by being coated with last layer insulating resin glue on combination substrate layer surface; Described second insulating layer is formed by decorative layer coated on bottom side last layer insulating resin glue.
2. large area multi-layer solid wood compound electro-thermal floor according to claim 1, is characterized in that, described insulating resin glue is HL501 resin glue.
3. large area multi-layer solid wood compound electro-thermal floor according to claim 1, is characterized in that, described euthermic chip is carbon fiber heating non-woven paper.
4. large area multi-layer solid wood compound electro-thermal floor according to claim 1, is characterized in that, described decorative layer is again spliced into the wooden cortex with floor pattern after cutting into the truewood skin of fritter area by wooden skin.
5. large area multi-layer solid wood compound electro-thermal floor according to claim 1, it is characterized in that, described waterproofing course is melamine impregnated paper.
6. the preparation method on large area multi-layer solid wood compound electro-thermal floor as claimed in claim 1, comprises the following steps:
(1) first the euthermic chip of selected power is carried out cutting by regulatory specifications, and copper strips is set at the hair two ends of euthermic chip, and by heating circuit in series for two panels euthermic chip;
(2) after large backing material plate being cut multiple small size backing material plate, small size backing material plate is slotted, then 8 ~ 9 small size backing material plates are spliced into large area substrates plate; Described large area substrates plate is after health is fixing, through fixed thick, sanding, beat power supply connecting hole, then coat insulating resin glue at the upper surface of large area substrates plate;
(3) using the plate cutting into small size as the wooden skin of decorative layer, the decorative layer with floor pattern is spliced into 8 ~ 9 wooden skins, insulating resin glue in the coated on bottom side of decorative layer;
(4) the power supply pin and box sub will the copper strips of euthermic chip loaded onto little copper sheet and make, makes heat generating core lamella;
(5) successively lay waterproofing course from top to bottom, coat insulating resin glue after combination substrate layer, heat generating core lamella and the decorative layer after coating insulating resin glue, hot press carries out pressing and obtains large area multi-layer solid wood compound electro-thermal floor;
(6) side on the large area multi-layer solid wood compound electro-thermal floor after pressing is slotted, multiple tracks priming paint is carried out to decor surface flow coating equipment, the decoration process of finish paint.
7. preparation method according to claim 6, is characterized in that: described euthermic chip is carbon fiber heating non-woven paper.
8. preparation method according to claim 6, is characterized in that: described combination backing material plate divides large backing material plate the backing material plate being cut to small size, after fluting plays glue, the backing material plate of multiple small size is spliced into large-area combination backing material plate again.
9. preparation method according to claim 6, is characterized in that: described decorative layer is that wooden skin is spliced into the rear pattern of floor installation, or different wooden skin color splices any pattern, or uses any pattern decorative.
10. preparation method according to claim 6, is characterized in that: described insulating resin glue is HL501 resin glue, and described waterproofing course is melamine impregnated paper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410617075.4A CN104481111A (en) | 2014-10-31 | 2014-10-31 | Large-area multi-layer solid wood composite electric heating floor and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410617075.4A CN104481111A (en) | 2014-10-31 | 2014-10-31 | Large-area multi-layer solid wood composite electric heating floor and preparation method thereof |
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| CN104481111A true CN104481111A (en) | 2015-04-01 |
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| CN201410617075.4A Pending CN104481111A (en) | 2014-10-31 | 2014-10-31 | Large-area multi-layer solid wood composite electric heating floor and preparation method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105928042A (en) * | 2016-05-04 | 2016-09-07 | 中国林业科学研究院木材工业研究所 | Composite electric heating board and preparing method thereof |
| CN106703364A (en) * | 2016-12-27 | 2017-05-24 | 南京林业大学 | Self-heating multilayered wood floor and preparation method thereof |
| WO2018103296A1 (en) * | 2016-12-09 | 2018-06-14 | 久盛地板有限公司 | Preparation process for built-in carbon fiber electric-heating-layer reinforced floor and wood floor thereof |
| CN111372341A (en) * | 2020-03-27 | 2020-07-03 | 江苏蕴石灵实业有限公司 | Manufacturing method of floor heating stone heated by carbon fibers |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2538902Y (en) * | 2002-01-25 | 2003-03-05 | 安东宪 | Electrothermic composite floor |
| CN1651240A (en) * | 2005-03-11 | 2005-08-10 | 赵更泉 | Production technology of high wear resistant wood composite floor |
| KR20070075606A (en) * | 2006-01-13 | 2007-07-24 | 삼성전자주식회사 | Image forming apparatus |
| CN201063870Y (en) * | 2007-06-18 | 2008-05-21 | 康建民 | Heating board dedicated for wooden floor |
| CN102607097A (en) * | 2011-02-18 | 2012-07-25 | 上海现戈电气有限公司 | Heating-core floor board and conductive heating board used for same |
-
2014
- 2014-10-31 CN CN201410617075.4A patent/CN104481111A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2538902Y (en) * | 2002-01-25 | 2003-03-05 | 安东宪 | Electrothermic composite floor |
| CN1651240A (en) * | 2005-03-11 | 2005-08-10 | 赵更泉 | Production technology of high wear resistant wood composite floor |
| KR20070075606A (en) * | 2006-01-13 | 2007-07-24 | 삼성전자주식회사 | Image forming apparatus |
| CN201063870Y (en) * | 2007-06-18 | 2008-05-21 | 康建民 | Heating board dedicated for wooden floor |
| CN102607097A (en) * | 2011-02-18 | 2012-07-25 | 上海现戈电气有限公司 | Heating-core floor board and conductive heating board used for same |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105928042A (en) * | 2016-05-04 | 2016-09-07 | 中国林业科学研究院木材工业研究所 | Composite electric heating board and preparing method thereof |
| WO2018103296A1 (en) * | 2016-12-09 | 2018-06-14 | 久盛地板有限公司 | Preparation process for built-in carbon fiber electric-heating-layer reinforced floor and wood floor thereof |
| CN106703364A (en) * | 2016-12-27 | 2017-05-24 | 南京林业大学 | Self-heating multilayered wood floor and preparation method thereof |
| CN106703364B (en) * | 2016-12-27 | 2022-04-01 | 南京林业大学 | Self-heating solid wood composite floor and preparation method thereof |
| CN111372341A (en) * | 2020-03-27 | 2020-07-03 | 江苏蕴石灵实业有限公司 | Manufacturing method of floor heating stone heated by carbon fibers |
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Effective date of registration: 20170126 Address after: 266000 East Road, high tech Zone, Shandong, Qingdao, 826-57 Applicant after: QINGDAO GRAPHENE CARBON NEW MATERIAL TECHNOLOGY CO., LTD. Address before: 266000 Licang City, Qingdao Province, No. nine East Road, room 1206, room 320, room Applicant before: QINGDAO QINGLAN ENERGY SAVING TECHNOLOGY CO., LTD. |
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