CN104712129A - Three-layer solid wood composite electric heating floor and manufacturing method thereof - Google Patents
Three-layer solid wood composite electric heating floor and manufacturing method thereof Download PDFInfo
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- CN104712129A CN104712129A CN201510120008.6A CN201510120008A CN104712129A CN 104712129 A CN104712129 A CN 104712129A CN 201510120008 A CN201510120008 A CN 201510120008A CN 104712129 A CN104712129 A CN 104712129A
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Abstract
The invention discloses a three-layer solid wood composite electric heating floor and a manufacturing method thereof. The three-layer solid wood composite electric heating floor comprises a decoration wood veneer, an upper insulation layer, an electric heating chip, a lower insulation layer and a three-layer solid wood base material layer. The three-layer solid wood base material layer is formed by laminating an upper wood veneer, a lower wood veneer and a solid wood batten base material layer clamped between the upper wood veneer and the lower wood veneer. The decoration wood veneer, the upper insulation layer, the electric heating chip, the lower insulation layer and the three-layer solid wood base material layer are sequentially overlapped and laid from top to bottom and laminated into the complete floor. The lower surface of the decoration wood veneer is coated with insulation resin glue to form the upper insulation layer and is attached to the upper surface of the electric heating chip. The upper surface of the three-layer solid wood base material layer is coated with insulation resin glue to form the lower insulation layer and is attached to the lower surface of the electric heating chip. The electric heating chip is formed by coating the surface of a copper strip used as a power plug with conductive hot melt glue and laying the copper strip on the surface of carbon fiber electric heating non-woven paper. According to the three-layer solid wood composite electric heating floor, the amount of adopted glue is small, the deformation degree is low, and the floor is more environmentally friendly. The electric heating chip and the copper strip are connected firmly, safety is good, and the service life is long.
Description
Technical field
The present invention relates to a kind of three-layer real-wood compound electro-thermal floor and preparation method thereof.
Background technology
In prior art, the base material on multi-layer solid wood composite heating floor is pressed and overlapped synthesizing multilayer solid wood composite base material after multiple wooden skin gluings of employing, and its production technology comprises the following steps: 1) be pressed into substrate layer with after 6 layers and above large wooden skin gluing; 2) punch connecing power supply position after substrate sheet surface being carried out sanding process; 3) conductive paper is spread after large backing material plate upper surface being coated resin glue; 4) copper strips of any technical measures is not taked to be deployed directly on conductive paper; 5) be routed to above conductive paper after decorative layer bottom surface gluing, 6) through hot press pressing, health, carries out cutting floor specification, 7 after the fixed thick process of sanding) slot, leaching paint process.
Above-mentioned multi-layer solid wood composite heating floor has the following disadvantages:
1) due to adopt substrate layer 6 layers more than greatly a wooden skin gluing be pressed into, greatly, and the specification of heating floor is limited floor deformation degree, is only suitable for producing comparatively that small-sized is as 910X127mm, and area only has 0,115 squares; 2) pressing of delta wood skin needs to use a large amount of glue, and product environmental-protecting performance reduces; 3) because glue consumption is many, the coefficient of thermal expansion because of glue during heating is greater than wood materials, more increases floor deformation degree; 4) conductive paper and copper strips are directly laid without any technical finesse, cause loose contact to be broken down short for application life with power attenuation; 5) because floor specification is less, correspondingly during laying to increase a large amount of power line and joint, therefore will spend more power line and artificial, and bring more potential faults.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of three-layer real-wood compound electro-thermal floor.
The another one technical problem that the present invention will solve is to provide a kind of preparation method of three-layer real-wood compound electro-thermal floor.
For three-layer real-wood compound electro-thermal floor, the technical solution used in the present invention is: a kind of three-layer real-wood compound electro-thermal floor, comprises decoration wooden skin, upper insulating layer, copper strips, electrothermal chip, lower insulating layer, three-layer real-wood substrate layer;
Three-layer real-wood substrate layer is formed through pressing by the plank of solid wood substrate layer accompanying the little wood lath splicing of plural block solid wood between overwood skin and lower wooden skin;
Decorate that wooden skin, upper insulating layer, electrothermal chip, copper strips, lower insulating layer, three-layer real-wood substrate layer are overlapping successively from top to bottom to be laid and pressing is monoblock floor;
Copper strips one side scribbles conductive hot melt glue and to be laid in the surface of electrothermal chip, as power connection;
Be coated with between the upper surface of three-layer real-wood substrate layer insulating resin glue form under insulating layer, the electrothermal chip and the lower insulating layer that have laid copper strips are fitted;
Insulating layer on the soffit coating insulating resin glue of the wooden skin of decoration is formed also is fitted with the upper surface of electrothermal chip.
As preferably, electrothermal chip is carbon fiber electric heating non-woven paper.
As preferably, conductive hot melt glue by weight with polyurethane hot melt and graphite powder mixes form at 3: 1.
As preferably, insulating resin glue is HL501 resin glue.
For the preparation method on three-layer real-wood compound electro-thermal floor, the technical solution used in the present invention is: comprise the following steps:
(1) first select electrothermal chip specification by power and carry out cutting by design size;
(2) the overwood skin after gluing and the plank of solid wood substrate layer between lower wooden skin, folder spliced by the little wood lath of plural block solid wood, make solid wood base material layer after pressing;
(3) punch in the copper strips power connection place that corresponding electrothermal chip lays on three-layer real-wood substrate layer;
(4) by three-layer real-wood substrate layer upper surface coating insulating resin glue, the electric power connection line with fan-shaped termination is then arranged;
(5) be laid in the copper strips smearing conductive hot melt glue the one side of electrothermal chip, and copper strips becomes the power connection of electrothermal chip;
(6) electrothermal chip one being covered with copper strips is faced down be laid on the upper surface of three-layer real-wood substrate layer, and make that the fan-shaped termination of copper strips face and electric power connection line is fully superimposed to be close to;
(7) wooden subcutaneous surface coating insulating resin glue will be decorated, be then routed to above electrothermal chip;
(8) three-layer real-wood substrate layer, electrothermal chip, decoration wood skin that will lay successively from below to up, put into hot press and carry out pressing, make three-layer real-wood compound electro-thermal floor;
(9) a point splitted groove is carried out on the three-layer real-wood compound electro-thermal floor after pressing;
(10) the solid wood composite heating floor surface after fluting is carried out the fixed thick leaching paint process of sanding, be made as finished product.
As preferably, electrothermal chip is carbon fiber electric heating non-woven paper.
As preferably, conductive hot melt glue is that polyurethane hot melt mixes with 3: 1 by weight with graphite powder and forms.
As preferably, insulating resin glue is HL501 resin glue.
Compared with traditional solid sawn composite heating floor base material layer, the invention has the beneficial effects as follows:
1) glue consumption is few, and degree of deformation is also little, more environmental protection;
2) power line of fan-shaped termination and copper strips contact area abundant, and when heating floor hot pressing, unnecessary glue pours in punching place, and under the assistance of pressure force, fan-shaped termination is fully connected with copper strips face and solidifies, technique is ensured the quality of products simply again.
3) any large-scale specification heating floor can be processed, decrease a large amount of installation procedure and unnecessary power line;
4) electrothermal chip and copper strips adopt conductive hot melt glue high-temperature laminating, be connected firmly, prevent because electrothermal chip and copper strips loose contact cause power attenuation and the fault rate of electric heating floor, improve practicality and the safety of product, improve quality and the application life of electric heating floor.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
Fig. 1 is the structural representation of three-layer real-wood compound electro-thermal floor of the present invention embodiment.
Fig. 2 is the three-layer real-wood substrate layer structural representation of three-layer real-wood compound electro-thermal floor of the present invention embodiment.
Fig. 3 is the electrothermal chip copper strips combination schematic diagram of three-layer real-wood compound electro-thermal floor of the present invention embodiment.
Fig. 4 is the electric power connection line structural representation of three-layer real-wood compound electro-thermal floor of the present invention embodiment.
Mark in figure, 1-decorates wooden skin, the upper insulating layer of 2-, 3-carbon fiber electric heating non-woven paper, 4-copper strips, insulating layer under 5-, 6-substrate layer, 7-overwood skin, the little wood lath of 8-, 9-power supply connecting hole, wooden skin under 10-, 11-conductive hot melt glue, 12-electric power connection line.
Detailed description of the invention
Fig. 1 is a kind of three-layer real-wood compound electro-thermal floor, is to be composited by the wooden skin 1 of decoration, upper insulating layer 2, electrothermal chip, copper strips 4, lower insulating layer 5, three-layer real-wood substrate layer 6.
Above-mentioned three-layer real-wood electric heating floor manufactures according to following steps:
(1) first select carbon fiber electric heating non-woven paper by power, and carry out cutting by dimensions.
(2) be laid in the surperficial two ends of carbon fiber electric heating non-woven paper 3 after the copper strips 4 external coating conductive hot melt glue 11 being used as power connection, makes the electrothermal chip with power connection.
(3) three-layer real-wood substrate layer 6 is processed, first after the upper surface gluing of lower wooden skin 10, the little wood lath 8 of cross arrangement some blocks is spliced to form solid wood board splicing layer (Fig. 2), then the overwood skin 7 after the gluing of bottom surface is covered above solid wood board splicing layer, then be pressed into three-layer real-wood substrate layer 6 through hot press.
(4) punching in the power connection place of the copper strips on three-layer real-wood substrate layer on corresponding electrothermal chip, forms power connection hole 9.
(5) upper surface of three-layer real-wood substrate layer 6 coating HL501 resin glue is formed lower insulating layer 5, on lower insulating layer, then arrange the electric power connection line 12 with fan-shaped termination.
(6) lay carbon fiber electric heating non-woven paper 3 on three-layer real-wood substrate layer surface, and carbon fiber electric heating non-woven paper 3 is laid with one of copper strips 4 faces down (Fig. 4), and copper strips 4 is adjacent to the fan-shaped termination of electric power connection line 12 is fully superimposed.
(7) wooden skin 1 soffit brushing HL501 resin glue will be decorated and form upper insulating layer 2, then be taped against above electrothermal chip.
(8) from top to bottom successively by the wooden skin 1 of decoration, upper insulating layer 2, electrothermal chip, lower insulating layer 5, three-layer real-wood substrate layer 6 overlap, be placed in hot press and carry out pressing.
(9) a point splitted groove is carried out on the three-layer real-wood compound electro-thermal floor after pressing.
(10) the three-layer real-wood compound electro-thermal floor surface after fluting is carried out the fixed thick leaching paint process of sanding, obtain finished product.
Not only there is a great difference on the three-layer real-wood compound electro-thermal floor of the present embodiment with the production technology on current multi-layer solid wood composite heating floor, and it is fewer than current multi-layer solid wood composite heating floor glue consumption, degree of deformation is little, decay power is little, and fault rate is little, can machining large specification heating floor, reduce a large amount of installation procedure and unnecessary power line, further increase usability and the safety of product, improve the feature of environmental protection and the quality of heating floor, extend the application life of heating floor.
The present embodiment is clipped in the three-layer real-wood substrate layer be pressed between upper and lower wooden cortex after adopting tens of little plank cross arrangement combinations, what this substrate layer decreased backing material plate to greatest extent makes glue consumption, improve the feature of environmental protection, reduce degree of deformation, be exaggerated the size restrictions of heating floor, overcome multi-layer solid wood floor and use the problem and feature of environmental protection problem that a large amount of glue after heat degree of deformation is large, adopt electrothermal chip print on the surface after conductive hot melt glue with electrothermal chip hot pressing method of attaching, contact firmly, eliminate copper strips directly to lay power attenuation that in conventional method, loose contact causes and produce the phenomenon that electric arc burns out heating board, heating floor from production technology, qualitatively, in environmental protection, in practicality, achieve change sexual development application life.
Above-described embodiment of the present invention, does not form limiting the scope of the present invention.Any amendment done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within claims of the present invention.
Claims (8)
1. a three-layer real-wood compound electro-thermal floor, is characterized in that, comprises decoration wooden skin, upper insulating layer, copper strips, electrothermal chip, lower insulating layer, three-layer real-wood substrate layer;
Described three-layer real-wood substrate layer is formed through pressing by the plank of solid wood substrate layer accompanying the little wood lath splicing of plural block solid wood between overwood skin and lower wooden skin;
The wooden skin of described decoration, upper insulating layer, electrothermal chip, copper strips, lower insulating layer, three-layer real-wood substrate layer are overlapping successively from top to bottom to be laid and pressing is monoblock floor;
Described copper strips one side scribbles conductive hot melt glue and to be laid in the surface of electrothermal chip, as power connection;
Be coated with between the upper surface of three-layer real-wood substrate layer insulating resin glue form under insulating layer, the electrothermal chip and the lower insulating layer that have laid copper strips are fitted;
Insulating layer on the soffit coating insulating resin glue of the wooden skin of decoration is formed also is fitted with the upper surface of electrothermal chip.
2. three-layer real-wood compound electro-thermal floor according to claim 1, it is characterized in that, described electrothermal chip is carbon fiber electric heating non-woven paper.
3. three-layer real-wood compound electro-thermal floor according to claim 1, is characterized in that, described conductive hot melt glue by weight with polyurethane hot melt and graphite powder mixes form at 3: 1.
4. three-layer real-wood compound electro-thermal floor according to claim 1, it is characterized in that, described insulating resin glue is HL501 resin glue.
5. the preparation method on three-layer real-wood compound electro-thermal floor as claimed in claim 1, comprises the following steps:
(1) first select electrothermal chip specification by power and carry out cutting by design size;
(2) the overwood skin after gluing and the plank of solid wood substrate layer between lower wooden skin, folder spliced by the little wood lath of plural block solid wood, make solid wood base material layer after pressing;
(3) punch in the copper strips power connection place that corresponding electrothermal chip lays on three-layer real-wood substrate layer;
(4) by three-layer real-wood substrate layer upper surface coating insulating resin glue, the electric power connection line with fan-shaped termination is then arranged;
(5) be laid in the copper strips smearing conductive hot melt glue the one side of electrothermal chip, and copper strips becomes the power connection of electrothermal chip;
(6) electrothermal chip one being covered with copper strips is faced down be laid on the upper surface of three-layer real-wood substrate layer, and make that the fan-shaped termination of copper strips face and electric power connection line is fully superimposed to be close to;
(7) wooden subcutaneous surface coating insulating resin glue will be decorated, be then routed to above electrothermal chip;
(8) three-layer real-wood substrate layer, electrothermal chip, decoration wood skin that will lay successively from below to up, put into hot press and carry out pressing, make three-layer real-wood compound electro-thermal floor;
(9) a point splitted groove is carried out on the three-layer real-wood compound electro-thermal floor after pressing;
(10) the solid wood composite heating floor surface after fluting is carried out the fixed thick leaching paint process of sanding, be made as finished product.
6. preparation method according to claim 5, is characterized in that, described electrothermal chip is carbon fiber electric heating non-woven paper.
7. preparation method according to claim 5, is characterized in that, described conductive hot melt glue is that polyurethane hot melt mixes with 3: 1 by weight with graphite powder and forms.
8. preparation method according to claim 5, is characterized in that, described insulating resin glue is HL501 resin glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510120008.6A CN104712129A (en) | 2015-03-16 | 2015-03-16 | Three-layer solid wood composite electric heating floor and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510120008.6A CN104712129A (en) | 2015-03-16 | 2015-03-16 | Three-layer solid wood composite electric heating floor and manufacturing method thereof |
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| CN104712129A true CN104712129A (en) | 2015-06-17 |
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| CN201510120008.6A Pending CN104712129A (en) | 2015-03-16 | 2015-03-16 | Three-layer solid wood composite electric heating floor and manufacturing method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105275182A (en) * | 2015-09-10 | 2016-01-27 | 浙江康辉木业有限公司 | Novel built-in self-heating floor based on carbon fiber surface heating body |
| CN105298078A (en) * | 2015-09-10 | 2016-02-03 | 浙江康辉木业有限公司 | Novel electric heating wooden floor with internal high-strength fiber and production method thereof |
| CN107288311A (en) * | 2017-08-02 | 2017-10-24 | 德华兔宝宝装饰新材股份有限公司 | A kind of solid wood is combined self-heating floor |
| WO2018103296A1 (en) * | 2016-12-09 | 2018-06-14 | 久盛地板有限公司 | Preparation process for built-in carbon fiber electric-heating-layer reinforced floor and wood floor thereof |
| CN108265936A (en) * | 2016-12-30 | 2018-07-10 | 比亚迪股份有限公司 | A kind of floor assembly and preparation method thereof |
| CN114103375A (en) * | 2021-11-26 | 2022-03-01 | 铁力山（北京）控制技术有限公司 | Carbon fiber composite electric heating wood board with heat storage performance and preparation method thereof |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02252855A (en) * | 1989-03-27 | 1990-10-11 | Koichi Miura | Cushion floor |
| JPH06264605A (en) * | 1993-03-16 | 1994-09-20 | Daiken Trade & Ind Co Ltd | Heating floor board and floor structure |
| JPH07127237A (en) * | 1993-10-29 | 1995-05-16 | Matsushita Electric Works Ltd | Floor material for heating |
| CN2538902Y (en) * | 2002-01-25 | 2003-03-05 | 安东宪 | Electrothermic composite floor |
| CN2669043Y (en) * | 2003-12-10 | 2005-01-05 | 金银 | Far infrared electric-heating decorative board |
| CN202043305U (en) * | 2011-02-01 | 2011-11-16 | 吉林大学 | High-temperature-resisting carbon fiber paper soft composite electric heating slice |
| CN202214946U (en) * | 2011-08-15 | 2012-05-09 | 上海热丽电热材料有限公司 | Low temperature plane waterproof heating floor module |
| CN103320076A (en) * | 2013-06-28 | 2013-09-25 | 苏州毫邦新材料有限公司 | Anisotropic conductive hot melt adhesive |
| CN103742970A (en) * | 2014-01-28 | 2014-04-23 | 沈阳北美木业有限公司 | Carbon fiber or carbon crystal electric heating floor capable of being cut at random and mounted conveniently, and use method |
-
2015
- 2015-03-16 CN CN201510120008.6A patent/CN104712129A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02252855A (en) * | 1989-03-27 | 1990-10-11 | Koichi Miura | Cushion floor |
| JPH06264605A (en) * | 1993-03-16 | 1994-09-20 | Daiken Trade & Ind Co Ltd | Heating floor board and floor structure |
| JPH07127237A (en) * | 1993-10-29 | 1995-05-16 | Matsushita Electric Works Ltd | Floor material for heating |
| CN2538902Y (en) * | 2002-01-25 | 2003-03-05 | 安东宪 | Electrothermic composite floor |
| CN2669043Y (en) * | 2003-12-10 | 2005-01-05 | 金银 | Far infrared electric-heating decorative board |
| CN202043305U (en) * | 2011-02-01 | 2011-11-16 | 吉林大学 | High-temperature-resisting carbon fiber paper soft composite electric heating slice |
| CN202214946U (en) * | 2011-08-15 | 2012-05-09 | 上海热丽电热材料有限公司 | Low temperature plane waterproof heating floor module |
| CN103320076A (en) * | 2013-06-28 | 2013-09-25 | 苏州毫邦新材料有限公司 | Anisotropic conductive hot melt adhesive |
| CN103742970A (en) * | 2014-01-28 | 2014-04-23 | 沈阳北美木业有限公司 | Carbon fiber or carbon crystal electric heating floor capable of being cut at random and mounted conveniently, and use method |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105275182A (en) * | 2015-09-10 | 2016-01-27 | 浙江康辉木业有限公司 | Novel built-in self-heating floor based on carbon fiber surface heating body |
| CN105298078A (en) * | 2015-09-10 | 2016-02-03 | 浙江康辉木业有限公司 | Novel electric heating wooden floor with internal high-strength fiber and production method thereof |
| CN105298078B (en) * | 2015-09-10 | 2018-02-06 | 浙江康辉木业有限公司 | A kind of electrothermal heating wood floors of built-in high-intensity fiber and preparation method thereof |
| WO2018103296A1 (en) * | 2016-12-09 | 2018-06-14 | 久盛地板有限公司 | Preparation process for built-in carbon fiber electric-heating-layer reinforced floor and wood floor thereof |
| CN108265936A (en) * | 2016-12-30 | 2018-07-10 | 比亚迪股份有限公司 | A kind of floor assembly and preparation method thereof |
| CN107288311A (en) * | 2017-08-02 | 2017-10-24 | 德华兔宝宝装饰新材股份有限公司 | A kind of solid wood is combined self-heating floor |
| CN114103375A (en) * | 2021-11-26 | 2022-03-01 | 铁力山（北京）控制技术有限公司 | Carbon fiber composite electric heating wood board with heat storage performance and preparation method thereof |
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Effective date of registration: 20170112 Address after: 266000 East Road, high tech Zone, Shandong, Qingdao, 826-57 Applicant after: QINGDAO GRAPHENE CARBON NEW MATERIAL TECHNOLOGY CO., LTD. Address before: 266000 Licang City, Qingdao Province, No. nine East Road, room 1206, room 320, room Applicant before: QINGDAO QINGLAN ENERGY SAVING TECHNOLOGY CO., LTD. |
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Application publication date: 20150617 |
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