JPH0310272U - - Google Patents
Info
- Publication number
- JPH0310272U JPH0310272U JP7068789U JP7068789U JPH0310272U JP H0310272 U JPH0310272 U JP H0310272U JP 7068789 U JP7068789 U JP 7068789U JP 7068789 U JP7068789 U JP 7068789U JP H0310272 U JPH0310272 U JP H0310272U
- Authority
- JP
- Japan
- Prior art keywords
- flap
- temperature
- burn
- circulation path
- hot air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007664 blowing Methods 0.000 claims 2
- 238000001514 detection method Methods 0.000 description 1
Landscapes
- Tests Of Electronic Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989070687U JP2511205Y2 (ja) | 1989-06-16 | 1989-06-16 | バ―ンイン処理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989070687U JP2511205Y2 (ja) | 1989-06-16 | 1989-06-16 | バ―ンイン処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0310272U true JPH0310272U (en, 2012) | 1991-01-31 |
JP2511205Y2 JP2511205Y2 (ja) | 1996-09-25 |
Family
ID=31607055
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989070687U Expired - Lifetime JP2511205Y2 (ja) | 1989-06-16 | 1989-06-16 | バ―ンイン処理装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2511205Y2 (en, 2012) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10270453A (ja) * | 1997-03-28 | 1998-10-09 | Koyo Lindberg Ltd | 半導体熱処理装置およびこれを用いた半導体基板の昇降温方法 |
JP2005121625A (ja) * | 2003-09-24 | 2005-05-12 | Sharp Corp | バーンイン装置 |
WO2008032397A1 (fr) * | 2006-09-15 | 2008-03-20 | Advantest Corporation | Appareil de test de composant électronique |
JP2013231654A (ja) * | 2012-04-27 | 2013-11-14 | Espec Corp | 環境試験装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5759256A (en) * | 1980-09-26 | 1982-04-09 | Fujitsu Ltd | Temperature test system |
JPS58211175A (ja) * | 1982-05-27 | 1983-12-08 | ゼロツクス・コ−ポレ−シヨン | 複写機 |
JPS59145949A (ja) * | 1983-02-09 | 1984-08-21 | Nippon Saamic:Kk | 広域温湿度雰囲気試験装置 |
JPS619853U (ja) * | 1984-06-21 | 1986-01-21 | 株式会社 藤田製作所 | バ−ンイン処理装置 |
JPS6157875U (en, 2012) * | 1984-09-20 | 1986-04-18 | ||
JPS62169065A (ja) * | 1986-01-22 | 1987-07-25 | Fujita Seisakusho:Kk | バ−ンイン処理装置 |
-
1989
- 1989-06-16 JP JP1989070687U patent/JP2511205Y2/ja not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5759256A (en) * | 1980-09-26 | 1982-04-09 | Fujitsu Ltd | Temperature test system |
JPS58211175A (ja) * | 1982-05-27 | 1983-12-08 | ゼロツクス・コ−ポレ−シヨン | 複写機 |
JPS59145949A (ja) * | 1983-02-09 | 1984-08-21 | Nippon Saamic:Kk | 広域温湿度雰囲気試験装置 |
JPS619853U (ja) * | 1984-06-21 | 1986-01-21 | 株式会社 藤田製作所 | バ−ンイン処理装置 |
JPS6157875U (en, 2012) * | 1984-09-20 | 1986-04-18 | ||
JPS62169065A (ja) * | 1986-01-22 | 1987-07-25 | Fujita Seisakusho:Kk | バ−ンイン処理装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10270453A (ja) * | 1997-03-28 | 1998-10-09 | Koyo Lindberg Ltd | 半導体熱処理装置およびこれを用いた半導体基板の昇降温方法 |
JP2005121625A (ja) * | 2003-09-24 | 2005-05-12 | Sharp Corp | バーンイン装置 |
WO2008032397A1 (fr) * | 2006-09-15 | 2008-03-20 | Advantest Corporation | Appareil de test de composant électronique |
JP2013231654A (ja) * | 2012-04-27 | 2013-11-14 | Espec Corp | 環境試験装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2511205Y2 (ja) | 1996-09-25 |
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