JPH03101546U - - Google Patents
Info
- Publication number
- JPH03101546U JPH03101546U JP1990009190U JP919090U JPH03101546U JP H03101546 U JPH03101546 U JP H03101546U JP 1990009190 U JP1990009190 U JP 1990009190U JP 919090 U JP919090 U JP 919090U JP H03101546 U JPH03101546 U JP H03101546U
- Authority
- JP
- Japan
- Prior art keywords
- aluminum nitride
- integrated circuit
- hybrid integrated
- heat sink
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Description
第１図はこの考案の一実施例である混成集積回
路の斜視図、第２図はこの考案の他の実施例を示
す混成集積回路の断面正面図、第３図は従来の混
成集積回路の斜視図である。
図において、３……トランジスタチツプ、４…
…Ａｇ系導体、５……金線、７……ＡｌＮ、８…
…ＡｌＮ７の金めつき部分、９……ＡｌＮの段差
部を示す。なお、図中、同一符号は同一、または
相当部分を示す。
Fig. 1 is a perspective view of a hybrid integrated circuit which is an embodiment of this invention, Fig. 2 is a cross-sectional front view of a hybrid integrated circuit showing another embodiment of this invention, and Fig. 3 is a diagram of a conventional hybrid integrated circuit. FIG. In the figure, 3...transistor chip, 4...
...Ag-based conductor, 5...Gold wire, 7...AlN, 8...
...A gold-plated part of AlN7, 9...A stepped part of AlN. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
し、この窒化アルミは電極をとるために部分的に
金めつきを施したことを特徴とする混成集積回路
。 A hybrid integrated circuit characterized by using aluminum nitride as a chip heat sink, and partially gold plating the aluminum nitride to form electrodes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990009190U JPH03101546U (en) | 1990-02-01 | 1990-02-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990009190U JPH03101546U (en) | 1990-02-01 | 1990-02-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03101546U true JPH03101546U (en) | 1991-10-23 |
Family
ID=31741711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990009190U Pending JPH03101546U (en) | 1990-02-01 | 1990-02-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03101546U (en) |
-
1990
- 1990-02-01 JP JP1990009190U patent/JPH03101546U/ja active Pending