JPH0396049U - - Google Patents
Info
- Publication number
- JPH0396049U JPH0396049U JP569990U JP569990U JPH0396049U JP H0396049 U JPH0396049 U JP H0396049U JP 569990 U JP569990 U JP 569990U JP 569990 U JP569990 U JP 569990U JP H0396049 U JPH0396049 U JP H0396049U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- hole
- external lead
- semiconductor package
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例である半導体用パ
ツケージの斜視図、第２図は第１図の断面図、第
３図は従来の半導体用パツケージの斜視図、第４
図は第３図の断面図である。
図において、６，７，８，９は外部リード、１
０は半導体チツプ、１１は金線等のワイヤ、１２
は銀ろう付部、１３はセラミツク、１４はスルー
ホール部、１５は金属ピンを示す。なお、図中、
同一符号は同一、または相当部分を示す。
Figure 1 is a perspective view of a semiconductor package which is an embodiment of this invention, Figure 2 is a sectional view of Figure 1, Figure 3 is a perspective view of a conventional semiconductor package, and Figure 4 is a perspective view of a conventional semiconductor package.
The figure is a sectional view of FIG. 3. In the figure, 6, 7, 8, 9 are external leads, 1
0 is a semiconductor chip, 11 is a wire such as a gold wire, 12
13 shows a silver soldering part, 13 shows a ceramic part, 14 shows a through-hole part, and 15 shows a metal pin. In addition, in the figure,
The same reference numerals indicate the same or equivalent parts.
Claims (1)
に、前記セラミツク上にスルーホールを設け、こ
のスルーホールに金属片を挿入し前記外部リード
と接続させたことを特徴とする半導体用パツケー
ジ。 A semiconductor package characterized in that a through hole is provided on the ceramic to take out the external lead from the back side of the ceramic, and a metal piece is inserted into the through hole and connected to the external lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP569990U JPH0396049U (en) | 1990-01-24 | 1990-01-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP569990U JPH0396049U (en) | 1990-01-24 | 1990-01-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0396049U true JPH0396049U (en) | 1991-10-01 |
Family
ID=31509398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP569990U Pending JPH0396049U (en) | 1990-01-24 | 1990-01-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0396049U (en) |
-
1990
- 1990-01-24 JP JP569990U patent/JPH0396049U/ja active Pending