JPH01177091U - - Google Patents
Info
- Publication number
- JPH01177091U JPH01177091U JP7350188U JP7350188U JPH01177091U JP H01177091 U JPH01177091 U JP H01177091U JP 7350188 U JP7350188 U JP 7350188U JP 7350188 U JP7350188 U JP 7350188U JP H01177091 U JPH01177091 U JP H01177091U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- figures
- washers
- ceramic package
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
第１図ａ，ｂはこの考案による一体型はんだワ
ツシヤの正面図及び側面図、第２図ａ〜ｃはこの
考案による一体型はんだワツシヤをソケツトに通
してセラミツクパツケージに装着した組込み状態
を示す平面図、Ｂ−Ｂ′線断面図およびはんだ付
け状態の断面図、第３図ａ〜ｄは従来のはんだワ
ツシヤの平面図および側面図ならびにはんだワツ
シヤ組込み状態を示す平面図、Ａ−Ａ′線断面図
、第４図はソケツト付セラミツクパツケージ全体
の斜視図である。
図において、１ｂはこの考案による一体型はん
だワツシヤ、２はセラミツクパツケージ、３はセ
ラミツクパツケージ２に内蔵された半導体集積回
路と接続している金めつき、４は外部半導体集積
回路のリードが接続されるソケツトを示す。なお
、図中、同一符号は同一、又は相当部分を示す。
Figures 1a and b are front and side views of the integrated solder washer according to this invention, and Figures 2 a to c are plan views showing the assembled state in which the integrated solder washer according to this invention is passed through a socket and attached to a ceramic package cage. Figures 3A to 3D are a plan view and a side view of a conventional soldering washer, a plan view showing a soldering washer assembled state, and a sectional view taken along A-A' line. 4 are perspective views of the entire ceramic package with socket. In the figure, 1b is the integrated solder washer according to this invention, 2 is the ceramic package, 3 is the gold plating connected to the semiconductor integrated circuit built in the ceramic package 2, and 4 is the lead to which the external semiconductor integrated circuit is connected. Shows the socket. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
て一体物とし、前記はんだワツシヤの接続部をく
びれさせるか、あるいは薄くしたことを特徴とす
る一体型はんだワツシヤ。 An integrated solder washer characterized in that a plurality of solder washers are connected in series to form an integral body, and the connecting portions of the solder washers are constricted or thinned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7350188U JPH01177091U (en) | 1988-06-01 | 1988-06-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7350188U JPH01177091U (en) | 1988-06-01 | 1988-06-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01177091U true JPH01177091U (en) | 1989-12-18 |
Family
ID=31298643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7350188U Pending JPH01177091U (en) | 1988-06-01 | 1988-06-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01177091U (en) |
-
1988
- 1988-06-01 JP JP7350188U patent/JPH01177091U/ja active Pending