JPH01157425U - - Google Patents
Info
- Publication number
- JPH01157425U JPH01157425U JP4690288U JP4690288U JPH01157425U JP H01157425 U JPH01157425 U JP H01157425U JP 4690288 U JP4690288 U JP 4690288U JP 4690288 U JP4690288 U JP 4690288U JP H01157425 U JPH01157425 U JP H01157425U
- Authority
- JP
- Japan
- Prior art keywords
- metal
- lead
- semiconductor unit
- metal foil
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 4
- 239000011888 foil Substances 0.000 claims 2
- 238000000059 patterning Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Description
第１図〜第４図はこの考案の一実施例を示し、
第１図は複数のＬＳＩユニツトを連結した状態を
示す図、第２図はその連結部分を示す拡大図、第
３図はその側面図、第４図Ａ〜Ｃはその製造工程
を示す図、第５図および第６図は従来例を示す図
である。
１０……ＬＳＩユニツト、１１……連結部材、
１２……樹脂フイルム、１３……金属リード、１
４……ＬＳＩチツプ。
Figures 1 to 4 show an embodiment of this invention,
FIG. 1 is a diagram showing a state in which a plurality of LSI units are connected, FIG. 2 is an enlarged view showing the connected part, FIG. 3 is a side view thereof, and FIGS. 4A to C are diagrams showing the manufacturing process. FIGS. 5 and 6 are diagrams showing conventional examples. 10... LSI unit, 11... Connection member,
12...Resin film, 13...Metal lead, 1
4...LSI chip.
Claims (1)
パターン形成し、この金属リードに半導体チツプ
を接合してなる半導体ユニツトと、 この半導体ユニツトを順次切り離し可能に連結
する前記金属リードと同じ金属箔よりなる連結部
材と、 を具備してなる半導体ユニツトの連結構造。[Claims for Utility Model Registration] A semiconductor unit formed by patterning a metal lead made of metal foil on a resin film and bonding a semiconductor chip to the metal lead, and the metal connecting the semiconductor unit in a sequentially separable manner. A connection structure for a semiconductor unit, comprising a connection member made of the same metal foil as the lead, and the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4690288U JPH064581Y2 (en) | 1988-04-08 | 1988-04-08 | Semiconductor unit connection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4690288U JPH064581Y2 (en) | 1988-04-08 | 1988-04-08 | Semiconductor unit connection structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01157425U true JPH01157425U (en) | 1989-10-30 |
| JPH064581Y2 JPH064581Y2 (en) | 1994-02-02 |
Family
ID=33446699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4690288U Expired - Lifetime JPH064581Y2 (en) | 1988-04-08 | 1988-04-08 | Semiconductor unit connection structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH064581Y2 (en) |
-
1988
- 1988-04-08 JP JP4690288U patent/JPH064581Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH064581Y2 (en) | 1994-02-02 |