JPH03101545U - - Google Patents
Info
- Publication number
- JPH03101545U JPH03101545U JP1027890U JP1027890U JPH03101545U JP H03101545 U JPH03101545 U JP H03101545U JP 1027890 U JP1027890 U JP 1027890U JP 1027890 U JP1027890 U JP 1027890U JP H03101545 U JPH03101545 U JP H03101545U
- Authority
- JP
- Japan
- Prior art keywords
- external terminal
- internal lead
- semiconductor chip
- semiconductor device
- gel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 description 1
Description
第１図は、この考案の半導体装置の一実施例を
示す一部を省略した断面図、第２図は、従来のこ
の種の半導体装置の一部を省略した断面図である
。
１……ベース、２……ヒートスプレツダ、３，
５……温度補償板、６……内部リード、６ａ……
Ｓベンド部、７……外部端子、８……ケース、９
……封止樹脂、１０……被覆部（ゲル状物質）、
１１……隙間。
FIG. 1 is a partially omitted cross-sectional view showing an embodiment of the semiconductor device of this invention, and FIG. 2 is a partially omitted cross-sectional view of a conventional semiconductor device of this type. 1...Base, 2...Heat spreader, 3,
5...Temperature compensation plate, 6...Internal lead, 6a...
S-bend part, 7...External terminal, 8...Case, 9
... Sealing resin, 10 ... Covering part (gel-like substance),
11...Gap.
Claims (1)
して一端が接続され、他端が外部端子に接続され
る内部リードを有し、これら半導体チツプおよび
外部端子の一部が樹脂封止される構造の半導体装
置において、前記内部リードにうち、相対的に横
断面積の小さい部位にゲル状物質で包囲した被覆
部を形成したことを特徴とする半導体装置。 A structure in which an internal lead is connected at one end to one electrode of a semiconductor chip via a temperature compensating plate and the other end is connected to an external terminal, and a portion of the semiconductor chip and external terminal are sealed with resin. 2. A semiconductor device according to claim 1, wherein a covering portion surrounded by a gel-like substance is formed in a portion of the internal lead having a relatively small cross-sectional area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1027890U JPH03101545U (en) | 1990-02-05 | 1990-02-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1027890U JPH03101545U (en) | 1990-02-05 | 1990-02-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03101545U true JPH03101545U (en) | 1991-10-23 |
Family
ID=31513855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1027890U Pending JPH03101545U (en) | 1990-02-05 | 1990-02-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03101545U (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59198740A (en) * | 1983-04-25 | 1984-11-10 | Mitsubishi Electric Corp | Resin seal type semiconductor compound element |
| JPS6076153A (en) * | 1983-10-03 | 1985-04-30 | Fuji Electric Co Ltd | Resin sealed semiconductor device |
| JPS63104454A (en) * | 1986-10-22 | 1988-05-09 | Mitsubishi Electric Corp | Semiconductor device |
| JPH01296649A (en) * | 1988-05-24 | 1989-11-30 | Mitsubishi Electric Corp | Semiconductor device |
-
1990
- 1990-02-05 JP JP1027890U patent/JPH03101545U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59198740A (en) * | 1983-04-25 | 1984-11-10 | Mitsubishi Electric Corp | Resin seal type semiconductor compound element |
| JPS6076153A (en) * | 1983-10-03 | 1985-04-30 | Fuji Electric Co Ltd | Resin sealed semiconductor device |
| JPS63104454A (en) * | 1986-10-22 | 1988-05-09 | Mitsubishi Electric Corp | Semiconductor device |
| JPH01296649A (en) * | 1988-05-24 | 1989-11-30 | Mitsubishi Electric Corp | Semiconductor device |
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