JPH01130554U - - Google Patents

Info

Publication number
JPH01130554U
JPH01130554U JP2599188U JP2599188U JPH01130554U JP H01130554 U JPH01130554 U JP H01130554U JP 2599188 U JP2599188 U JP 2599188U JP 2599188 U JP2599188 U JP 2599188U JP H01130554 U JPH01130554 U JP H01130554U
Authority
JP
Japan
Prior art keywords
support plate
lead wire
external
lead
external lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2599188U
Other languages
Japanese (ja)
Other versions
JPH0528778Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988025991U priority Critical patent/JPH0528778Y2/ja
Publication of JPH01130554U publication Critical patent/JPH01130554U/ja
Application granted granted Critical
Publication of JPH0528778Y2 publication Critical patent/JPH0528778Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案を応用したパワートランジスタ
の斜視図、第２図は組立段階のリードフレームの
平面図を示す。 １……支持板、２……第一の外部リード、３…
…第二の外部リード、４……パワートランジスタ
チツプ（半導体チツプ）、５……第一のリード細
線、６……第二のリード細線、７……樹脂封止体
（外囲体）、８……端部。 FIG. 1 is a perspective view of a power transistor to which the present invention is applied, and FIG. 2 is a plan view of a lead frame in the assembly stage. 1... Support plate, 2... First external lead, 3...
...Second external lead, 4...Power transistor chip (semiconductor chip), 5...First thin lead wire, 6...Second thin lead wire, 7...Resin sealing body (enveloping body), 8 ……edge.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 支持板と、該支持板に固着されかつ電気的に接
続された半導体チツプと、前記支持板とは別体と
して形成されかつ前記支持板に連結されかつ前記
支持板と電気的に接続された端部を有する第一の
外部リードと、該第一の外部リードと前記支持板
とを電気的に接続する第一のリード細線と、前記
支持板とは別体として形成され前記支持板に直接
に連結されない第二の外部リードと、該第二の外
部リードと前記半導体チツプの前記支持板とは反
対側の主面とを電気的に接続する第二のリード細
線と、前記支持板、半導体チツプ、リード細線及
び外部リードの端部を封止する外囲体とを備えた
ことを特徴とする半導体装置。 a support plate; a semiconductor chip fixed to and electrically connected to the support plate; and an end formed separately from the support plate and connected to and electrically connected to the support plate. a first external lead having a section, a first thin lead wire electrically connecting the first external lead and the support plate, and a first lead wire that is formed separately from the support plate and directly connected to the support plate. a second external lead that is not connected; a second thin lead wire that electrically connects the second external lead to the main surface of the semiconductor chip on the side opposite to the support plate; the support plate; 1. A semiconductor device comprising: a thin lead wire and an envelope for sealing the ends of the external leads.
JP1988025991U 1988-03-01 1988-03-01 Expired - Lifetime JPH0528778Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988025991U JPH0528778Y2 (en) 1988-03-01 1988-03-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988025991U JPH0528778Y2 (en) 1988-03-01 1988-03-01

Publications (2)

Publication Number Publication Date
JPH01130554U true JPH01130554U (en) 1989-09-05
JPH0528778Y2 JPH0528778Y2 (en) 1993-07-23

Family

ID=31247208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988025991U Expired - Lifetime JPH0528778Y2 (en) 1988-03-01 1988-03-01

Country Status (1)

Country Link
JP (1) JPH0528778Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5756531U (en) * 1980-09-19 1982-04-02

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5756531U (en) * 1980-09-19 1982-04-02

Also Published As

Publication number Publication date
JPH0528778Y2 (en) 1993-07-23

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