JPH0310036A - 半導体機器用リード材 - Google Patents
半導体機器用リード材Info
- Publication number
- JPH0310036A JPH0310036A JP25070589A JP25070589A JPH0310036A JP H0310036 A JPH0310036 A JP H0310036A JP 25070589 A JP25070589 A JP 25070589A JP 25070589 A JP25070589 A JP 25070589A JP H0310036 A JPH0310036 A JP H0310036A
- Authority
- JP
- Japan
- Prior art keywords
- lead material
- alloy
- weight
- rolled
- copper alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25070589A JPH0310036A (ja) | 1989-09-28 | 1989-09-28 | 半導体機器用リード材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25070589A JPH0310036A (ja) | 1989-09-28 | 1989-09-28 | 半導体機器用リード材 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57006063A Division JPS6045698B2 (ja) | 1982-01-20 | 1982-01-20 | 半導体機器用リ−ド材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0310036A true JPH0310036A (ja) | 1991-01-17 |
| JPH0437151B2 JPH0437151B2 (enExample) | 1992-06-18 |
Family
ID=17211820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25070589A Granted JPH0310036A (ja) | 1989-09-28 | 1989-09-28 | 半導体機器用リード材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0310036A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5178493A (en) * | 1989-11-16 | 1993-01-12 | Societe Civile Des Brevets De Henri Vidal | Counterfort wall |
| US7413619B2 (en) | 2005-03-11 | 2008-08-19 | Mitsubishi Denki Kabushiki Kaisha | Copper alloy |
| JP2010242154A (ja) * | 2009-04-03 | 2010-10-28 | Mitsubishi Electric Corp | 銅合金及びその製造方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US307250A (en) * | 1884-10-28 | Safe-lock for toy banks | ||
| US2137282A (en) * | 1938-08-12 | 1938-11-22 | Mallory & Co Inc P R | Copper alloys |
| GB522482A (en) * | 1938-11-28 | 1940-06-19 | Mallory & Co Inc P R | Improvements in and relating to the production of copper base alloys |
| JPS572851A (en) * | 1980-06-06 | 1982-01-08 | Nippon Mining Co Ltd | Copper alloy for lead material of semiconductor device |
| JPS5895850A (ja) * | 1981-12-02 | 1983-06-07 | Kobe Steel Ltd | 集積回路のリ−ドフレ−ム用銅合金 |
-
1989
- 1989-09-28 JP JP25070589A patent/JPH0310036A/ja active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US307250A (en) * | 1884-10-28 | Safe-lock for toy banks | ||
| US2137282A (en) * | 1938-08-12 | 1938-11-22 | Mallory & Co Inc P R | Copper alloys |
| GB522482A (en) * | 1938-11-28 | 1940-06-19 | Mallory & Co Inc P R | Improvements in and relating to the production of copper base alloys |
| JPS572851A (en) * | 1980-06-06 | 1982-01-08 | Nippon Mining Co Ltd | Copper alloy for lead material of semiconductor device |
| JPS5895850A (ja) * | 1981-12-02 | 1983-06-07 | Kobe Steel Ltd | 集積回路のリ−ドフレ−ム用銅合金 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5178493A (en) * | 1989-11-16 | 1993-01-12 | Societe Civile Des Brevets De Henri Vidal | Counterfort wall |
| US7413619B2 (en) | 2005-03-11 | 2008-08-19 | Mitsubishi Denki Kabushiki Kaisha | Copper alloy |
| US7727345B2 (en) | 2005-03-11 | 2010-06-01 | Mitsubishi Denki Kabushiki Kaisha | Copper alloy and method of manufacturing the same |
| DE102006010760B4 (de) * | 2005-03-11 | 2014-03-27 | Mitsubishi Denki K.K. | Kupferlegierung und Verfahren zur Herstellung derselben |
| JP2010242154A (ja) * | 2009-04-03 | 2010-10-28 | Mitsubishi Electric Corp | 銅合金及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0437151B2 (enExample) | 1992-06-18 |
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