JPH0297009U - - Google Patents

Info

Publication number
JPH0297009U
JPH0297009U JP482689U JP482689U JPH0297009U JP H0297009 U JPH0297009 U JP H0297009U JP 482689 U JP482689 U JP 482689U JP 482689 U JP482689 U JP 482689U JP H0297009 U JPH0297009 U JP H0297009U
Authority
JP
Japan
Prior art keywords
mold
station
resin
mold opening
resin tablet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP482689U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0546897Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989004826U priority Critical patent/JPH0546897Y2/ja
Publication of JPH0297009U publication Critical patent/JPH0297009U/ja
Application granted granted Critical
Publication of JPH0546897Y2 publication Critical patent/JPH0546897Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP1989004826U 1989-01-19 1989-01-19 Expired - Lifetime JPH0546897Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989004826U JPH0546897Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-01-19 1989-01-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989004826U JPH0546897Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-01-19 1989-01-19

Publications (2)

Publication Number Publication Date
JPH0297009U true JPH0297009U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-08-02
JPH0546897Y2 JPH0546897Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-12-09

Family

ID=31207681

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989004826U Expired - Lifetime JPH0546897Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-01-19 1989-01-19

Country Status (1)

Country Link
JP (1) JPH0546897Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5587517A (en) * 1978-12-27 1980-07-02 Hitachi Ltd Method and apparatus for cleaning resin-molding mold
JPS57105333A (en) * 1980-12-23 1982-06-30 Akashi Plast Kogyo Kk Automatic compression molding device for molding tehrmosetting resin
JPS649712A (en) * 1987-07-02 1989-01-13 Rohm Co Ltd Resin molding device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5587517A (en) * 1978-12-27 1980-07-02 Hitachi Ltd Method and apparatus for cleaning resin-molding mold
JPS57105333A (en) * 1980-12-23 1982-06-30 Akashi Plast Kogyo Kk Automatic compression molding device for molding tehrmosetting resin
JPS649712A (en) * 1987-07-02 1989-01-13 Rohm Co Ltd Resin molding device

Also Published As

Publication number Publication date
JPH0546897Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-12-09

Similar Documents

Publication Publication Date Title
CA2234879A1 (en) Ejection methods and linkage apparatus for stack molds
PH24553A (en) Apparatus for the manufacture of composite articles using rotating molds
EP0177199A3 (en) Moulding apparatus for simultaneously forming a cavity and encapsulating a frame in a foamed body
HUP9904146A2 (hu) Öntési eljárás és öntőberendezés
JPH01136710A (ja) 中空成形品用二次射出成形機
ES2019143A6 (es) Perfeccionamientos relativos a la fabricacion de pirulis.
EP0389622A4 (en) Toggle type mold clamping system for injection molding machines
JPS5926244U (ja) 半導体樹脂封入成形用の成形装置
JPH0297009U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH05185463A (ja) 射出成形機
JPH056094Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2003133348A (ja) 半導体封止方法および半導体封止装置
JPH01113217A (ja) 多重射出成形装置
US3920374A (en) Apparatus for stripping and unloading a molded part from a mold core
CN218732368U (zh) 一种注塑电池连接线限位固定装置
JP2527252B2 (ja) 中空成形金型
JPS6339528U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0428133B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0142343Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS635226Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2000271954A (ja) 回転式プラスチック成形機の金型保持機構
JPH0295810A (ja) 予熱樹脂タブレットの搬送供給装置
JPS641050Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS6153210B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS62154816U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term