JPH0296731U - - Google Patents

Info

Publication number
JPH0296731U
JPH0296731U JP533589U JP533589U JPH0296731U JP H0296731 U JPH0296731 U JP H0296731U JP 533589 U JP533589 U JP 533589U JP 533589 U JP533589 U JP 533589U JP H0296731 U JPH0296731 U JP H0296731U
Authority
JP
Japan
Prior art keywords
jig
semiconductor device
heats
surrounds
holding means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP533589U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP533589U priority Critical patent/JPH0296731U/ja
Publication of JPH0296731U publication Critical patent/JPH0296731U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP533589U 1989-01-20 1989-01-20 Pending JPH0296731U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP533589U JPH0296731U (enrdf_load_stackoverflow) 1989-01-20 1989-01-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP533589U JPH0296731U (enrdf_load_stackoverflow) 1989-01-20 1989-01-20

Publications (1)

Publication Number Publication Date
JPH0296731U true JPH0296731U (enrdf_load_stackoverflow) 1990-08-01

Family

ID=31208621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP533589U Pending JPH0296731U (enrdf_load_stackoverflow) 1989-01-20 1989-01-20

Country Status (1)

Country Link
JP (1) JPH0296731U (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217480A (ja) * 2001-01-17 2002-08-02 Matsushita Electric Ind Co Ltd 半導体レーザ装置の実装方法
WO2007060936A1 (ja) * 2005-11-22 2007-05-31 Kabushiki Kaisha Toyota Jidoshokki 半田付け装置及び半田付け方法
JP2009231379A (ja) * 2008-03-19 2009-10-08 Toyota Industries Corp 半田付け方法
JP2012250287A (ja) * 2012-07-09 2012-12-20 Neomax Material:Kk 誘導加熱による車載パワーモジュールのはんだ付けのための被誘導加熱材

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217480A (ja) * 2001-01-17 2002-08-02 Matsushita Electric Ind Co Ltd 半導体レーザ装置の実装方法
WO2007060936A1 (ja) * 2005-11-22 2007-05-31 Kabushiki Kaisha Toyota Jidoshokki 半田付け装置及び半田付け方法
JP2009231379A (ja) * 2008-03-19 2009-10-08 Toyota Industries Corp 半田付け方法
JP2012250287A (ja) * 2012-07-09 2012-12-20 Neomax Material:Kk 誘導加熱による車載パワーモジュールのはんだ付けのための被誘導加熱材

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