JPH0296731U - - Google Patents

Info

Publication number
JPH0296731U
JPH0296731U JP533589U JP533589U JPH0296731U JP H0296731 U JPH0296731 U JP H0296731U JP 533589 U JP533589 U JP 533589U JP 533589 U JP533589 U JP 533589U JP H0296731 U JPH0296731 U JP H0296731U
Authority
JP
Japan
Prior art keywords
jig
semiconductor device
heats
surrounds
holding means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP533589U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP533589U priority Critical patent/JPH0296731U/ja
Publication of JPH0296731U publication Critical patent/JPH0296731U/ja
Pending legal-status Critical Current

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Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案実施例による半田付け装置の構
成図、第２図は半導体装置の仮組立体の詳細構造
、並びに加熱動作の説明図である。図において、 １：架台、３：加圧ヘツド（保持手段）、４：
仕切カバー、５：不活性ガス導入管、６：高周波
加熱コイル、７：電源装置、８：半導体装置の仮
組立体、９：カーボン製治具。 FIG. 1 is a configuration diagram of a soldering apparatus according to an embodiment of the present invention, and FIG. 2 is an explanatory diagram of a detailed structure of a temporary assembly of a semiconductor device and a heating operation. In the figure, 1: pedestal, 3: pressure head (holding means), 4:
Partition cover, 5: Inert gas introduction pipe, 6: High frequency heating coil, 7: Power supply device, 8: Temporary assembly of semiconductor device, 9: Carbon jig.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上に半田を挟んで各種実装部品を搭載した
半導体装置の仮組立体を加熱してリフロー半田付
けする半導体装置の半田付け装置であつて、カー
ボン製の箱形治具内に組み込んだ前記半導体装置
の仮組立体を治具と一緒に上下より挟持する保持
手段と、該保持手段に装備した前記治具の周囲を
包囲する仕切カバーと、該仕切カバー内の空間に
向けて雰囲気ガスを導入する不活性ガス供給手段
と、前記治具を取り巻いて誘導加熱する高周波加
熱コイルとを具備してなることを特徴とする半導
体装置の半田付け装置。 A semiconductor device soldering device that heats and reflow solders a temporary assembly of a semiconductor device in which various mounting components are mounted on a board with solder interposed therebetween, and the semiconductor device is assembled in a box-shaped jig made of carbon. A holding means that holds the temporary assembly of the device together with a jig from above and below, a partition cover that surrounds the jig provided on the holding means, and an atmospheric gas introduced into the space inside the partition cover. 1. A soldering apparatus for semiconductor devices, comprising: an inert gas supply means for heating the jig; and a high-frequency heating coil that surrounds the jig and heats it by induction.
JP533589U 1989-01-20 1989-01-20 Pending JPH0296731U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP533589U JPH0296731U (en) 1989-01-20 1989-01-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP533589U JPH0296731U (en) 1989-01-20 1989-01-20

Publications (1)

Publication Number Publication Date
JPH0296731U true JPH0296731U (en) 1990-08-01

Family

ID=31208621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP533589U Pending JPH0296731U (en) 1989-01-20 1989-01-20

Country Status (1)

Country Link
JP (1) JPH0296731U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217480A (en) * 2001-01-17 2002-08-02 Matsushita Electric Ind Co Ltd Packaging method of semiconductor laser device
WO2007060936A1 (en) * 2005-11-22 2007-05-31 Kabushiki Kaisha Toyota Jidoshokki Soldering apparatus and soldering method
JP2009231379A (en) * 2008-03-19 2009-10-08 Toyota Industries Corp Soldering method
JP2012250287A (en) * 2012-07-09 2012-12-20 Neomax Material:Kk Induction heating object heating material for soldering on-board power module by induction heating

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217480A (en) * 2001-01-17 2002-08-02 Matsushita Electric Ind Co Ltd Packaging method of semiconductor laser device
WO2007060936A1 (en) * 2005-11-22 2007-05-31 Kabushiki Kaisha Toyota Jidoshokki Soldering apparatus and soldering method
JP2009231379A (en) * 2008-03-19 2009-10-08 Toyota Industries Corp Soldering method
JP2012250287A (en) * 2012-07-09 2012-12-20 Neomax Material:Kk Induction heating object heating material for soldering on-board power module by induction heating

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