JPH0488696A - Mounting device of surface mounted component - Google Patents

Mounting device of surface mounted component

Info

Publication number
JPH0488696A
JPH0488696A JP20364690A JP20364690A JPH0488696A JP H0488696 A JPH0488696 A JP H0488696A JP 20364690 A JP20364690 A JP 20364690A JP 20364690 A JP20364690 A JP 20364690A JP H0488696 A JPH0488696 A JP H0488696A
Authority
JP
Japan
Prior art keywords
component
surface mount
mounting device
mount component
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20364690A
Other languages
Japanese (ja)
Inventor
Nobuhisa Kono
河野　修久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP20364690A priority Critical patent/JPH0488696A/en
Publication of JPH0488696A publication Critical patent/JPH0488696A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To protect a component against positional deviation after mounting and to enable a mounting device to mount a surface mounted component independent of its shape by a method wherein an electrical joint between a positioned surface mounting component and a printed board is tentatively fixed by specific thermal medium. CONSTITUTION:Leads 2a, 4, and 5 of a surface mounting component 2 are positioned to electrodes pads 1a provided onto a printed board 1, the leads 4 and 5 located at the corners of the component 2 are heated and tentatively fixed with solder paste 3 by soldering guns 6 and 7 mounted on robots 8 and 9. By this setup, a component mounted on a board can be prevented from deviating in position due to oscillation or the like induced at transfer, whereby an adhesive agent applicator and an adhesive agent curing mechanism can be dispensed with, in result an equipment cost can be lessened. Moreover, an electrical joint is tentatively fixed, so that a surface mounting component can be mounted independent of its shape.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、表面実装部品の装着装置に関し、特に、表面
実装部品を位置決めした後、表面実装部品とプリント基
板の接合部を熱媒体を用いて仮固定する装置に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a mounting device for surface mount components, and in particular, after positioning the surface mount component, the joint between the surface mount component and the printed circuit board is bonded using a heat medium. This invention relates to a temporary fixing device.

〔従来の技術〕[Conventional technology]

従来、表面実装部品の装着装置には、（イ）仮固定を行
なわずに実装する方式、（ロ）プリント基板と表面実装
部品の接合部分以外の場所を、絶縁性の高い接着剤によ
って仮固定して実装する方式がある。Conventionally, mounting devices for surface mount components include (a) a method for mounting without temporary fixing, and (b) a method for temporarily fixing parts other than the bonding area between the printed circuit board and the surface mount component using a highly insulating adhesive. There is a method to implement it.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

前者の場合、位置決めしてから装着しなにも拘らず、部
品装着されたプリント基板の搬送時に発生する振動等に
より、装着後位置ずれが発生するという欠点がある。又
、後者の場合、■部品形状がチップ部品等に限定される
、■リペア時にプリント基板を損傷する可能性が高い、
■接着剤塗布機構及び接着剤キュア機構に投資が必要と
なる暮の欠点がある。In the former case, there is a drawback that even though the printed circuit board is mounted after positioning, the positional shift occurs due to vibrations generated during transportation of the printed circuit board on which the component is mounted. In addition, in the latter case, ■The shape of the part is limited to chip parts, ■There is a high possibility of damaging the printed circuit board during repair.
■There is a disadvantage that investment is required in the adhesive application mechanism and adhesive curing mechanism.

本発明の目的は装着後の位置ずれをなくし、かつ部品形
状に限定されない表面実装部品の装着装置を提供するこ
とにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a surface mount component mounting device that eliminates positional displacement after mounting and is not limited to the shape of the component.

〔課題を解決するための手段〕[Means to solve the problem]

前記目的を達成するため、本発明に係る表面実装部品の
装着装置においては、接着機構を有し、表面実装部品を
プリント基板に実装する表面実装部品の装着装置であっ
て、 接着機構は、位置決めされた表面実装部品とプリント基
板との電気的接合部を熱媒体を用いて仮固定するもので
ある。In order to achieve the above object, a surface mount component mounting device according to the present invention is a surface mount component mounting device that has an adhesive mechanism and mounts a surface mount component on a printed circuit board, wherein the adhesive mechanism is used for positioning. The electrical joint between the surface-mounted component and the printed circuit board is temporarily fixed using a heat medium.

また、前記熱媒体としてはんだペーストを用いたもので
あり、 また前記接着機構は、３次元空間を移動するロボットに
支持されたものである。Further, a solder paste is used as the heat medium, and the adhesive mechanism is supported by a robot that moves in a three-dimensional space.

〔作用〕[Effect]

プリント基板に表面実装部品を位置決めした後、プリン
ト基板と表面実装部品の接合部を熱媒体により仮固定す
る。After positioning the surface mount component on the printed circuit board, the joint portion between the printed circuit board and the surface mount component is temporarily fixed using a heat medium.

〔実施例〕 以下、本発明の一実施例を図により説明する。〔Example〕 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

第１図は本発明の一実施例を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of the present invention.

図において、接着機構としてのはんだコテ６゜７は３次
元空間を移動するロボット８，９に支持されている。本
実棒鋼では、表面実装部品２のリード２ａ、４．５とプ
リント基板１の″＠極バ・γド１ａとの電気的接合を仮
固定する熱媒体としてはんだペースト３を用いている。In the figure, a soldering iron 6.7 serving as a bonding mechanism is supported by robots 8 and 9 that move in a three-dimensional space. In this actual steel bar, solder paste 3 is used as a heat medium for temporarily fixing the electrical connection between the leads 2a, 4.5 of the surface mount component 2 and the "@pole board 1a" of the printed circuit board 1.

プリント基板１の電極バッドｌａに表面実装部品２のリ
ード２ａ４．５を位置決めし、表面実装部品２のコーナ
ー部に位置するリード４．５をはんだペースト３を用い
てはんだコテ６．７によって加熱し仮固定する。このは
んだコテは３次元ロボット８．９に組付けられており、
ロボット８，９を制御することにより任意の点への移動
が可能である。よって、任意の場所での複数ケ所の仮固
定が可能である。The leads 2a4.5 of the surface mount component 2 are positioned on the electrode pads la of the printed circuit board 1, and the leads 4.5 located at the corners of the surface mount component 2 are heated with the soldering iron 6.7 using the solder paste 3. Temporarily fix. This soldering iron is assembled into a three-dimensional robot 8.9.
By controlling the robots 8 and 9, movement to any point is possible. Therefore, temporary fixation at multiple locations is possible.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は位置決めされたプリント基
板と表面実装部品の電気的接合部を熱媒体にて仮固定す
るため、搬送時に発生する振動等による装着後位置ずれ
を防止できる。さらに、電気的接合部の箇所で仮固定を
行うなめ、従来のように高価な絶縁性接着剤を用いる必
要がなく、これに伴ない接着剤塗布機構及び接着剤キュ
ア機構が不要となり、設備費を低減することができる。As described above, the present invention temporarily fixes the electrical joint between the positioned printed circuit board and the surface mount component using a heat medium, so that displacement after mounting due to vibrations generated during transportation can be prevented. Furthermore, because temporary fixation is performed at electrical joints, there is no need to use expensive insulating adhesives as in the past, and the associated adhesive application and curing mechanisms are no longer required, resulting in equipment costs. can be reduced.

しかも、電気的接合部で仮固定するなめ、部品形状に制
限を受けることがなく、さらにはりベア時にプリント基
板を損傷することがない。Moreover, since the parts are temporarily fixed at the electrical joints, there are no restrictions on the shape of the parts, and furthermore, the printed circuit board is not damaged when it is removed.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例を示す斜視図である。 １・・・プリント基板　　　１ａ・・・電極バッド２・
・・表面実装部品　　　３・・・はんだペースト２ａ、
４．５・・・コーナ一部のリード６．７・・・はんだコ
テ ８．９・・・３次元ロボット 特許出願人　　　日本電気株式会社 代　　理　　人　　　　弁理士　菅　野　　　中第１図FIG. 1 is a perspective view showing an embodiment of the present invention. 1... Printed circuit board 1a... Electrode pad 2.
...Surface mount component 3...Solder paste 2a,
4.5... Part of corner lead 6.7... Soldering iron 8.9... Three-dimensional robot patent applicant NEC Corporation Representative Patent attorney Naka Kanno Figure 1

Claims (3)

【特許請求の範囲】[Claims] （１）接着機構を有し、表面実装部品をプリント基板に
実装する表面実装部品の装着装置であつて、接着機構は
、位置決めされた表面実装部品とプリント基板との電気
的接合部を熱媒体を用いて仮固定するものであることを
特徴とする表面実装部品の装着装置。(1) A surface mount component mounting device that has an adhesive mechanism and mounts a surface mount component on a printed circuit board, wherein the adhesive mechanism connects the electrical joint between the positioned surface mount component and the printed circuit board with a heat medium. 1. A mounting device for surface mount components, characterized in that the mounting device temporarily fixes the components using the following. （２）前記熱媒体としてはんだペーストを用いたことを
特徴とする請求項第（１）項に記載の表面実装部品の装
着装置。(2) The surface mount component mounting apparatus according to claim (1), wherein a solder paste is used as the heat medium. （３）前記接着機構は、３次元空間を移動するロボット
に支持されたものであることを特徴とする請求項第（１
）項に記載の表面実装部品の装着装置。(3) The adhesive mechanism is supported by a robot that moves in a three-dimensional space.
) A mounting device for surface mount components as described in item 2.
JP20364690A 1990-07-31 1990-07-31 Mounting device of surface mounted component Pending JPH0488696A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20364690A JPH0488696A (en) 1990-07-31 1990-07-31 Mounting device of surface mounted component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20364690A JPH0488696A (en) 1990-07-31 1990-07-31 Mounting device of surface mounted component

Publications (1)

Publication Number Publication Date
JPH0488696A true JPH0488696A (en) 1992-03-23

Family

ID=16477493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20364690A Pending JPH0488696A (en) 1990-07-31 1990-07-31 Mounting device of surface mounted component

Country Status (1)

Country Link
JP (1) JPH0488696A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6145191A (en) * 1993-04-13 2000-11-14 Micron Technology, Inc. Method for mounting and testing integrated circuits on printed circuit boards
JP2009259762A (en) * 2008-03-28 2009-11-05 Hitachi Ltd Power source having a plurality of relays

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6145191A (en) * 1993-04-13 2000-11-14 Micron Technology, Inc. Method for mounting and testing integrated circuits on printed circuit boards
US6401330B2 (en) 1993-04-13 2002-06-11 Micron Technology, Inc. Apparatus for mounting an integrated circuit onto a printed circuit board and then testing the integrated circuit
JP2009259762A (en) * 2008-03-28 2009-11-05 Hitachi Ltd Power source having a plurality of relays

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