JPH0296731U - - Google Patents
Info
- Publication number
- JPH0296731U JPH0296731U JP533589U JP533589U JPH0296731U JP H0296731 U JPH0296731 U JP H0296731U JP 533589 U JP533589 U JP 533589U JP 533589 U JP533589 U JP 533589U JP H0296731 U JPH0296731 U JP H0296731U
- Authority
- JP
- Japan
- Prior art keywords
- jig
- semiconductor device
- heats
- surrounds
- holding means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000005192 partition Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 239000011261 inert gas Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims 2
- 239000007789 gas Substances 0.000 claims 1
- 230000006698 induction Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP533589U JPH0296731U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-01-20 | 1989-01-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP533589U JPH0296731U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-01-20 | 1989-01-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0296731U true JPH0296731U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-08-01 |
Family
ID=31208621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP533589U Pending JPH0296731U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-01-20 | 1989-01-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0296731U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002217480A (ja) * | 2001-01-17 | 2002-08-02 | Matsushita Electric Ind Co Ltd | 半導体レーザ装置の実装方法 |
| WO2007060936A1 (ja) * | 2005-11-22 | 2007-05-31 | Kabushiki Kaisha Toyota Jidoshokki | 半田付け装置及び半田付け方法 |
| JP2009231379A (ja) * | 2008-03-19 | 2009-10-08 | Toyota Industries Corp | 半田付け方法 |
| JP2012250287A (ja) * | 2012-07-09 | 2012-12-20 | Neomax Material:Kk | 誘導加熱による車載パワーモジュールのはんだ付けのための被誘導加熱材 |
-
1989
- 1989-01-20 JP JP533589U patent/JPH0296731U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002217480A (ja) * | 2001-01-17 | 2002-08-02 | Matsushita Electric Ind Co Ltd | 半導体レーザ装置の実装方法 |
| WO2007060936A1 (ja) * | 2005-11-22 | 2007-05-31 | Kabushiki Kaisha Toyota Jidoshokki | 半田付け装置及び半田付け方法 |
| JP2009231379A (ja) * | 2008-03-19 | 2009-10-08 | Toyota Industries Corp | 半田付け方法 |
| JP2012250287A (ja) * | 2012-07-09 | 2012-12-20 | Neomax Material:Kk | 誘導加熱による車載パワーモジュールのはんだ付けのための被誘導加熱材 |