JPH029530B2 - - Google Patents
Info
- Publication number
- JPH029530B2 JPH029530B2 JP22515984A JP22515984A JPH029530B2 JP H029530 B2 JPH029530 B2 JP H029530B2 JP 22515984 A JP22515984 A JP 22515984A JP 22515984 A JP22515984 A JP 22515984A JP H029530 B2 JPH029530 B2 JP H029530B2
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- silicon
- point metal
- high melting
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
- C23C26/02—Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22515984A JPS61103686A (ja) | 1984-10-26 | 1984-10-26 | 高融点金属材と珪素材の接合方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22515984A JPS61103686A (ja) | 1984-10-26 | 1984-10-26 | 高融点金属材と珪素材の接合方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61103686A JPS61103686A (ja) | 1986-05-22 |
JPH029530B2 true JPH029530B2 (enrdf_load_stackoverflow) | 1990-03-02 |
Family
ID=16824865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22515984A Granted JPS61103686A (ja) | 1984-10-26 | 1984-10-26 | 高融点金属材と珪素材の接合方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61103686A (enrdf_load_stackoverflow) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2588241B2 (ja) * | 1988-04-05 | 1997-03-05 | 株式会社東芝 | スパッタリングターゲット |
JP5766966B2 (ja) * | 2011-01-31 | 2015-08-19 | 新日鐵住金株式会社 | Na含有Moターゲット及びその製造方法 |
CN107497932A (zh) * | 2017-06-23 | 2017-12-22 | 成都飞机工业(集团)有限责任公司 | 一种可切削塑料拉型模及其制造方法 |
-
1984
- 1984-10-26 JP JP22515984A patent/JPS61103686A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61103686A (ja) | 1986-05-22 |
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