JPH0291355U - - Google Patents
Info
- Publication number
- JPH0291355U JPH0291355U JP1988170701U JP17070188U JPH0291355U JP H0291355 U JPH0291355 U JP H0291355U JP 1988170701 U JP1988170701 U JP 1988170701U JP 17070188 U JP17070188 U JP 17070188U JP H0291355 U JPH0291355 U JP H0291355U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- die pad
- lead frame
- pad part
- element chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
-
- H10W72/07353—
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- H10W72/334—
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- H10W72/931—
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- H10W90/736—
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988170701U JPH0291355U (enExample) | 1988-12-29 | 1988-12-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988170701U JPH0291355U (enExample) | 1988-12-29 | 1988-12-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0291355U true JPH0291355U (enExample) | 1990-07-19 |
Family
ID=31461875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988170701U Pending JPH0291355U (enExample) | 1988-12-29 | 1988-12-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0291355U (enExample) |
-
1988
- 1988-12-29 JP JP1988170701U patent/JPH0291355U/ja active Pending