JPH0289854U - - Google Patents

Info

Publication number
JPH0289854U
JPH0289854U JP1988170574U JP17057488U JPH0289854U JP H0289854 U JPH0289854 U JP H0289854U JP 1988170574 U JP1988170574 U JP 1988170574U JP 17057488 U JP17057488 U JP 17057488U JP H0289854 U JPH0289854 U JP H0289854U
Authority
JP
Japan
Prior art keywords
view
diode element
high frequency
diode
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988170574U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15907361&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH0289854(U) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed filed Critical
Priority to JP1988170574U priority Critical patent/JPH0289854U/ja
Priority to GB8929207A priority patent/GB2226700B/en
Priority to DE3943013A priority patent/DE3943013C2/en
Publication of JPH0289854U publication Critical patent/JPH0289854U/ja
Priority to SG594/93A priority patent/SG59493G/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/62—Protection against overvoltage, e.g. fuses, shunts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01055—Cesium [Cs]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12034—Varactor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａは本考案を実施した高周波用ダイオー
ド装置の模式的平面図、第１図ｂはその模式的断
面図、第２図は外観図、第３図は等価回路図、第
４図は要部の構造図である。第５図は本考案の他
の実施例の模式的平面図、第６図は更に他の実施
例の模式的平面図である。第７図はＶＨＦチユー
ナーの入力同調回路部分を示す回路図である。 ４′……抵抗体、１２……ダイオードチツプ、
１５……樹脂、２０……ダイオード素子。 Fig. 1a is a schematic plan view of a high frequency diode device embodying the present invention, Fig. 1b is a schematic sectional view thereof, Fig. 2 is an external view, Fig. 3 is an equivalent circuit diagram, and Fig. 4 is a schematic plan view of a high frequency diode device implementing the present invention. It is a structural diagram of the main part. FIG. 5 is a schematic plan view of another embodiment of the present invention, and FIG. 6 is a schematic plan view of still another embodiment. FIG. 7 is a circuit diagram showing the input tuning circuit portion of the VHF tuner. 4'...Resistor, 12...Diode chip,
15...Resin, 20...Diode element.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ダイオード素子と該ダイオード素子の保護用抵
抗とを樹脂で一体にモールドしたことを特徴とす
る高周波用ダイオード装置。 A high frequency diode device characterized in that a diode element and a protective resistor for the diode element are integrally molded with resin.
JP1988170574U 1988-12-27 1988-12-27 Pending JPH0289854U (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1988170574U JPH0289854U (en) 1988-12-27 1988-12-27
GB8929207A GB2226700B (en) 1988-12-27 1989-12-27 Encapsulated diode and protective resistance
DE3943013A DE3943013C2 (en) 1988-12-27 1989-12-27 TV tuner with an input stage that minimizes unwanted stray capacities
SG594/93A SG59493G (en) 1988-12-27 1993-05-05 Encapsulated diode and protective resistance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988170574U JPH0289854U (en) 1988-12-27 1988-12-27

Publications (1)

Publication Number Publication Date
JPH0289854U true JPH0289854U (en) 1990-07-17

Family

ID=15907361

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988170574U Pending JPH0289854U (en) 1988-12-27 1988-12-27

Country Status (4)

Country Link
JP (1) JPH0289854U (en)
DE (1) DE3943013C2 (en)
GB (1) GB2226700B (en)
SG (1) SG59493G (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10032389A1 (en) * 2000-07-06 2002-01-17 Philips Corp Intellectual Pty Radio or television signal receiver has high frequency circuit comprising discrete semiconductor device with planar varicap diode and integrated pre-resistor
NL2027146B1 (en) * 2020-12-17 2022-07-11 Ampleon Netherlands Bv A radiofrequency power package and device with improved ESD performance

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1047411A (en) *
JPS5393781A (en) * 1977-01-27 1978-08-17 Toshiba Corp Semiconductor device
JPS56122134A (en) * 1980-02-29 1981-09-25 Toshiba Corp Resin-sealed type semiconductor device
JPS6018145B2 (en) * 1980-09-22 1985-05-09 株式会社日立製作所 Resin-encapsulated semiconductor device
DE3522652A1 (en) * 1985-06-25 1987-01-08 Blaupunkt Werke Gmbh CIRCUIT ARRANGEMENT FOR TUNING RECEIVERS
US4847572A (en) * 1986-10-30 1989-07-11 Toko, Inc. Electronic tuning circuit for AM receiver

Also Published As

Publication number Publication date
SG59493G (en) 1993-07-09
GB2226700A (en) 1990-07-04
DE3943013A1 (en) 1990-06-28
GB2226700B (en) 1993-02-17
DE3943013C2 (en) 1994-12-22
GB8929207D0 (en) 1990-02-28

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