JPH0289056A - 金属トナーの製造方法 - Google Patents

金属トナーの製造方法

Info

Publication number
JPH0289056A
JPH0289056A JP1045554A JP4555489A JPH0289056A JP H0289056 A JPH0289056 A JP H0289056A JP 1045554 A JP1045554 A JP 1045554A JP 4555489 A JP4555489 A JP 4555489A JP H0289056 A JPH0289056 A JP H0289056A
Authority
JP
Japan
Prior art keywords
metal
toner
powder
auxiliary
metal powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1045554A
Other languages
English (en)
Japanese (ja)
Inventor
Dietmar Dudek
デイートマル・ドウデク
Thomas Pfeifer
トーマス・プフアイフアー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JPH0289056A publication Critical patent/JPH0289056A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G9/00—Developers
    • G03G9/08—Developers with toner particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0525—Patterning by phototackifying or by photopatterning adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Powder Metallurgy (AREA)
  • Developing Agents For Electrophotography (AREA)
  • Conductive Materials (AREA)
  • Printing Methods (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP1045554A 1988-03-01 1989-02-28 金属トナーの製造方法 Pending JPH0289056A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3806515.0 1988-03-01
DE3806515A DE3806515C1 (enExample) 1988-03-01 1988-03-01

Publications (1)

Publication Number Publication Date
JPH0289056A true JPH0289056A (ja) 1990-03-29

Family

ID=6348504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1045554A Pending JPH0289056A (ja) 1988-03-01 1989-02-28 金属トナーの製造方法

Country Status (4)

Country Link
EP (1) EP0332880A3 (enExample)
JP (1) JPH0289056A (enExample)
KR (1) KR890015079A (enExample)
DE (1) DE3806515C1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4113483C2 (de) * 1990-05-12 1995-10-26 Du Pont Deutschland Verfahren zur Erzeugung feiner Leiterbahnen auf einem keramischen Träger
DE10255520B4 (de) * 2002-11-28 2007-12-27 Infineon Technologies Ag Verfahren zur elektrischen Kontaktierung mittels gefüllter Flüssigkeiten und elektronische Bauteile mit derartiger Kontaktierung
US20050227158A1 (en) * 2004-04-07 2005-10-13 Kabushiki Kaisha Toshiba Toner for producing wiring board and method of producing wiring board using thereof
ES2768251T3 (es) * 2008-05-09 2020-06-22 Stora Enso Oyj Un aparato, un método para establecer un patrón conductor en un sustrato aislante plano, el sustrato aislante plano y un conjunto de chips del mismo
US20100155128A1 (en) * 2008-12-22 2010-06-24 Tombs Thomas N Printed electronic circuit boards and other articles having patterned coonductive images

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62133002A (ja) * 1984-09-17 1987-06-16 イ−・アイ・デユポン・ド・ネモア−ス・アンド・コンパニ− 金属酸化物を被覆した厚膜導体組成物用の銅含有金属の粒子、その製造方法および厚膜導体組成物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1107743B (de) * 1959-09-10 1961-05-31 Siemens Elektrogeraete Gmbh Verfahren zur Herstellung von gedruckten Schaltungen nach dem Pulververfahren
DE2909958A1 (de) * 1979-03-14 1980-09-25 Licentia Gmbh Sinterwerkstoff
DE2920088C3 (de) * 1979-05-18 1982-02-04 Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt Verfahren zur Herstellung elektrischer Leiterplatten
CA1155967A (en) * 1981-02-24 1983-10-25 Carl M. Anderson Medium film deposition of electric circuits

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62133002A (ja) * 1984-09-17 1987-06-16 イ−・アイ・デユポン・ド・ネモア−ス・アンド・コンパニ− 金属酸化物を被覆した厚膜導体組成物用の銅含有金属の粒子、その製造方法および厚膜導体組成物

Also Published As

Publication number Publication date
EP0332880A3 (de) 1990-11-22
KR890015079A (ko) 1989-10-28
DE3806515C1 (enExample) 1989-07-20
EP0332880A2 (de) 1989-09-20

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