JPH0287492A - Ic socket - Google Patents

Abstract

PURPOSE:To make it possible to carry out a highly reliable characteristic evaluation by extending a part of contact pins in the horizontal direction, and exposing the tips of the extension parts to the side surface of the socket main body. CONSTITUTION:The leads of a TAB package product are unified to contact pins 12 provided at a socket main body 11, and the TAB package product is loaded on the socket main body 11. In this case, the semiconductor parts are installed in through holes 11a and 14a. Then a lid body 14 installed to the socket main body 11 is closed, and said leads are pressed to contact to the contact pins 12 by the lid body 14, a power supply and signals are fed to the contact pins 12 adequately in such a condition, and the characteristic evaluation of the TAB package product is carried out by the inputs. On the other hand, when the output characteristic is required to evaluate separately by applying a bias to each contact pin 12, the contact is made to the responding contact pin separately, and the characteristic evaluation is carried out adequately.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a technique that is particularly effective when applied to a semiconductor device characteristic evaluation apparatus.
(Tape Automated Bonding)
The present invention relates to a technique that is effective for use in rC sockets used when evaluating the characteristics of fJ products.

[Prior Art] One type of surface-mounted semiconductor device is, for example, a so-called TAB package product in which a TAB is used in a general-purpose package. As is well known, this TAB package product has a semiconductor chip fixed to a lead supported on a polyimide film, and the semiconductor chip and its surrounding area are covered with a potting resin.

By the way, in the characteristic evaluation of such a TAB package product, the characteristic evaluation has conventionally been performed using an IC socket as shown in FIG.

In the figure, reference numeral 1 represents a socket body, and this socket body 1 is provided with a through hole 1a in its center. Further, a contact pin 2 as shown in FIG. 5 is embedded in the base frame portion 1b that partitions the through hole 1a. This contact pin 2 is shaped and sized so that when it is embedded in the socket body 1, its head protrudes from the top surface of the socket body 1, and its foot portion protrudes from the bottom surface of the socket body 1. (See Figure 5). Then, the head of the contact pin 2 is brought into contact with the lead of the TAB package product, and the - side contact pin 2 is brought into contact with the lead of the TAB package product.
The feet of the test board are designed to be inserted into the test board.

Further, a lid body 4 is attached to the socket body 1 via a hinge 3.
is attached so that it can be opened and closed freely. The structure of this lid body 4 is substantially the same as the structure of the socket body 1 described above, except that the contact pin 2 is not embedded therein. That is, the lid body 4 is constructed to have substantially the same shape as the socket body 1, and a through hole 4a is provided in the center of the lid body 4 in the same manner as in the socket body 1.

Conventionally, the characteristics of TAB package products have been evaluated using the above-mentioned IC socket as follows.

First, connect the leads of the TAB package product to the socket body 1.
TA so as to match the contact pin 2 provided in
Place the B package product on the socket body 1. At this time, the semiconductor chip portions are received in the through holes 1a and 4a.

Next, the lid 3 attached to the socket body 1 is closed, and the lead is brought into pressure contact with the contact pin 2 by the lid 3.

In this state, power and signals are appropriately supplied to the contact pin 2, and the characteristics of the TAB package product are evaluated from the output.

The temperature conditions of the TAB package product during characteristic evaluation are adjusted using the through holes 1a and 4a.

Further, after the characteristic evaluation, the TAB package product is taken out from the IC socket by following the above-mentioned procedure in reverse.

[Problems to be Solved by the Invention] However, the above-described conventional IC socket has the following disadvantages.

That is, in the conventional IC socket, the leads of the TAB package attached to the socket body 1 are completely covered by the lid 4 when the lid 3 is closed. On the other hand, the feet of the contact pins 2 are inserted into a test board and are not exposed to the outside during characteristic evaluation. therefore,
When using the above IC socket to evaluate the characteristics of TAB package products, it is necessary to
Direct attachment measurement (measurement by directly applying a bias to the contact pin 3 from the outside) is not possible as in the case of characteristic evaluation of a P-type semiconductor device).

That is, for example, it was not possible to apply a bias to each contact pin 3 and evaluate its output characteristics, making it impossible to evaluate the characteristics with high reliability.

The present invention has been made in view of this point, and an object of the present invention is to provide an IC socket for TAB products that allows highly reliable characteristic evaluation.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means for Solving the Problems] Representative inventions disclosed in this application will be summarized as follows.

That is, the IC socket of the present application includes a socket main body for placing a TAB product, and a socket that is embedded in the socket main body, the head part is in contact with the lead of the TAB product, and the foot part is not inserted into the test board. a contact pin configured such that a portion thereof is exposed from a side surface of the socket body;
The lid body is pivotally attached to the socket body and presses the leads of the 13 TABs to the contact pins.

[Operation] According to the above-described means, a part of the contact pin is exposed from the side surface of the socket body, so that when the lid is closed, the leads of the TAB product placed on the socket body are completely removed by the lid. Even if the foot of the contact pin is inserted into the test board,
By virtue of the fact that a portion of the contact pin exposed on the side surface of the socket body can be directly attached and used as an observation pin for measurement, the above-mentioned objective of performing highly reliable characteristic evaluation can be achieved.

[Example] Hereinafter, an example of an IC socket according to the present invention will be described in detail based on the drawings.

1 to 3 show an embodiment of an IC socket according to the present invention.

In these drawings, the reference numeral 11 represents a socket 1-body made of plastic, although not particularly limited thereto, and the socket body 11 is provided with a through hole 11a in its center. In addition, the base frame portion 1 that partitions the through hole 11a is
A contact pin 12 as shown in FIG. 3 is embedded in 1b.

When this contact pin 12 is embedded in the socket 1 - main body 11, its head protrudes from the upper surface of the socket main body 11, its foot protrudes from the lower surface of the socket main body 11, and further extends in the horizontal direction. The socket body 11 is formed into a shape and size such that the tips of the socket portions are exposed on two opposing sides of the socket body 11, for example, through press working.

Then.

The head of the contact pin 12 is brought into contact with the lead of the TAB package product, while the foot of the contact pin 12 is inserted into the test board, and the part of the contact pin 12 exposed on the side of the socket body 11 is directly attached. is now used for observation.

Further, a lid body 14 is attached to the socket body 11 via a hinge 13 so as to be openable and closable.

The structure of this lid body 14 is substantially the same as the structure of the socket body 11 described above, except that the contact pin 12 is not embedded therein. That is, the lid body 14 is configured to have substantially the same shape as the socket body 11, and a through hole 14a is provided in the center of the lid body 14 in the same manner as in the socket body 11.

Therefore, the characteristic evaluation of the TAB package product using the above-mentioned IC socket is carried out as follows.

First, connect the leads of the TAB package product to the socket body 1.
The TAB package product is placed on the socket body 11 so as to match the contact pins 12 provided in the socket body 11.

At this time, the semiconductor chip portions are received in the through holes 11a and 14a. Next, the lid 13 attached to the socket body 11 is closed, and the lead is brought into pressure contact with the contact pin 12 by the lid 13. In this state, power and signals are appropriately supplied to the contact pins 12, and the characteristics of the TAB package product are evaluated from the output. On the other hand, if it is desired to apply a bias to each contact pin 12 and evaluate its output characteristics individually, the corresponding contact pins are contacted individually and the characteristics are evaluated as appropriate. The temperature conditions of the TAB package product during characteristic evaluation are adjusted using the through holes 11a and 14a.

Further, the TAB package product after 5 characteristic evaluations is taken out from the IC socket by following the above procedure in reverse order.

According to the IC socket configured as described above, the following effects can be obtained.

That is, according to the IC socket 1, some of the contacts 1 to pins 12 are exposed from the side surface of the socket body 11, so that the leads of the T A B Hara Cage product that are attached to the socket body 11 are exposed to the lid body. 14 when the lid body 1 is closed.
4 and contact pin 1
Even if the leg of No. 2 is inserted into the test board, a part of the contact pin No. 12 exposed from the side of the socket main body 11 can be used as a regular observation pin of Oki No. 1 by directly attaching it. This effect makes it possible to perform highly reliable characteristic evaluation.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, according to the IC socket of the above embodiment, the contact pins 12 are drawn out to two opposing sides of the socket body 11 to facilitate handling.
The contact pins 12 may be pulled out from each of the four sides.

In the above embodiments, evaluation of characteristics of TAB package products has been explained as an example, but it goes without saying that the present invention can also be used for TAB products in which the semiconductor chip and its surrounding area are not covered with potting resin.

(Effects of the Invention) The effects obtained by typical inventions disclosed in this application are briefly described below.

That is, the IC socket of the present application includes a socket main body for placing a TAB package product, and a socket embedded in the socket main body, the head part is in contact with the lead of the TAB product, and the foot part is inserted into a test board. Now that we have a contact pin that is partially exposed from the side surface of the socket body and a lid that is pivotally attached to the socket body and presses the lead of the TAB product to the contact pin, we can place it on the socket body. Even if the leads of the TAB product to be installed are completely covered by the lid when the lid is closed, and the feet of the contact pins are inserted into the test board, the socket body If a part of the contact pin exposed from the side surface is directly attached, it can be used as an observation pin for measurement, thus making it possible to perform highly reliable characteristic evaluation.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an embodiment of an IC socket according to the present invention. Figure 2 is a plan view of the IC socket in Figure 1, and Figure 3 is a plan view of the IC socket in Figure 1.
FIG. 4 is a perspective view of a conventional IC socket, and FIG. 5 is a partial view showing how contact pins are buried in the IC socket of FIG. 4. 11...Socket body, 12...Contact pin, 14.Iris/lid body. Figure 1 Figure 3 Figure 4 Figure 2 Figure 5

Claims (1)

[Scope of Claims] 1. A socket body for mounting a TAB product, and a socket embedded in the socket body so that the head is in contact with the lead of the TAB product and the foot is inserted into the test board. In an IC socket comprising a contact pin and a lid body which is pivotally attached to the socket body and press-contacts the lead of the TAB product to the contact pin, a part of the contact pin is horizontally extended, and the extended portion is provided. An IC socket characterized in that a tip of the IC socket is exposed on a side surface of the socket body. 2. The IC socket according to claim 1, wherein a receiving portion for receiving a semiconductor chip portion of a TAB product is provided in the center of the socket body and the lid. 3. The IC socket according to claim 2, wherein the receiving portion is configured as a through hole.