JPH02141678A - Ic socket - Google Patents

Abstract

PURPOSE:To observe inputs and outputs at places close to device pins and to make it possible to obtain highly reliable data by a constitution wherein a part of each contact pin is exposed on the side surface of the main body of an IC socket. CONSTITUTION:A device 5 is set on a main body 1a of an IC socket for evalua tion. An IC socket cap 4 is applied thereon. Under this state, a probe 6 of an oscilloscope is brought into contact with each contact pin 2 which is provided at the side surface of the main body 1a. Thus, the waveforms of the input and the output of the device pin can be observed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC socket that can be used to observe the waveform of a device under test or to measure leakage between bins of the socket itself.

[Prior Art] FIG. 10 is a perspective view of a conventional IC socket, and FIG. 11 is a sectional view of the IC socket shown in FIG. 1θ. In the figure, (
3) is a contact pin, (1) is a contact pin (3)
(4) is an IC socket lid provided at the end of the IC socket body (1) so as to be openable and closable.

Next, the operation will be explained.

Place the IC socket cover (4) attached to one end of the IC socket body (1) so that it can be opened and closed.
The IC socket cover (4) is placed over 1).
) is the closed form of

[Problems to be Solved by the Invention] Conventional evaluation IC sockets have been configured as described above, so when observing the device bin input/output with an oscilloscope probe, the IC socket may hit the lead bin through the window of the IC socket lid, or There were problems such as the need to turn the IC socket body upside down and hit it from the leg side of the lead bin.

This invention was made to solve the above-mentioned problems, and allows more accurate observation of device bin input/output at a location extremely close to the device bin, and also eliminates the need to turn the IC socket body upside down. The purpose is to obtain an IC socket for evaluation that can be used.

[Means for Solving the Problems] The evaluation IC socket according to the present invention is such that a part of the contact pin from the pin contact portion to the contact pin leg is exposed outside of the IC socket body.

[Function] A device is set in the evaluation IC socket body of the present invention, the IC socket lid is covered, and the oscilloscope probe is inserted into the oscilloscope probe using a part of the contact pin provided on the side surface of the evaluation IC socket body with the IC socket lid covered. Observe the waveforms of device pin inputs and outputs.

[Example] An embodiment of the present invention will be described below with reference to the drawings.

In Fig. 1 and Fig. 2, (la) is the IC socket body;
(2) is a contact pin that has a contact part on the outside of the IC socket body (la), and (4) is a contact pin that has a contact part on the outside of the IC socket body (la).
This is an IC socket lid attached to one end of a) so as to be openable and closable.

FIG. 3 is a perspective view showing a state in which the IC socket lid of the above embodiment is closed, and shows a state in which a measuring jig (6) as shown in the figure is brought into contact.

Next, the operation will be explained. IC socket body (la)
Set the device (5) on the IC socket cover (4).
to cover.

With the IC socket cover (4) covered, contact pins (2) protruding from the side of the IC socket body (1a) can be contacted using a measuring jig (6).

In addition, in the above embodiment, a case was shown in which the exposed contact pin (2) was provided in the shape shown in FIG. 3, but the contact pin (2) was provided in the shape shown in FIG. ,
A device having a shape as shown in FIG. 8 (2C) may also be attached, and the same effect as in the above embodiment can be obtained.

[Effects of the Invention] As described above, according to the present invention, since a part of the contact pin is exposed on the side surface of the IC socket body, device pin input/output can be easily observed when debugging a test program. At the same time, observations can be made closer to the device pins, which has the effect of providing highly reliable devices.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an evaluation IC socket according to an embodiment of the present invention, FIG. 2 is a cross-sectional side view of FIG. 1, and FIG.
Perspective view showing the IC socket lid in the closed state, No. 4
9 to 9 are views showing evaluation IC sockets showing other embodiments of the present invention, and FIGS. 4, 6, and 8 are perspective views, and FIGS. 5, 7, and Figure 9 is a cross-sectional side view of Figures 4, 6, and 8, respectively, and Figure 1O is a conventional evaluation I
A perspective view of the C socket, FIG. 11 shows a cross-sectional side view of FIG. 1O. In the figure, (la) is the IC socket body, (2), (
2a) to (2c) are contact bins, (4) is an IC socket lid, (5) is a device, and (6) is an oscilloscope probe. In addition, the same symbols in the figures indicate the same or equivalent parts. Figure 1 Figure 5

Claims (1)

[Claims] An IC socket for fixing a device, characterized in that a part of the contact pin is exposed outside the mold so that the contact pin can be contacted from above the IC socket while the IC socket is fixed.