JPH02122644A - Magazine - Google Patents
MagazineInfo
- Publication number
- JPH02122644A JPH02122644A JP63277841A JP27784188A JPH02122644A JP H02122644 A JPH02122644 A JP H02122644A JP 63277841 A JP63277841 A JP 63277841A JP 27784188 A JP27784188 A JP 27784188A JP H02122644 A JPH02122644 A JP H02122644A
- Authority
- JP
- Japan
- Prior art keywords
- magazine
- hole
- lead
- leads
- time
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- 238000007689 inspection Methods 0.000 abstract description 5
- 238000003780 insertion Methods 0.000 abstract description 2
- 230000037431 insertion Effects 0.000 abstract description 2
- 239000000523 sample Substances 0.000 abstract 2
- 238000005259 measurement Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 230000001934 delay Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はＩＣ製造工程に用いるＩＣ収納用のマガジンに
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a magazine for storing ICs used in an IC manufacturing process.
従来この種のマガジンは複数のＩＣを中に収め外へ飛び
出さないようストッパを施こして固定していた。そのた
め特性試験、製品、外観試験等の作業時は、そのストッ
パを外して、いちいちＩＣを外へ出さなければならなか
った。Conventionally, this type of magazine has contained a plurality of ICs and fixed them with a stopper to prevent them from flying out. Therefore, when performing characteristic tests, product and appearance tests, etc., the stopper had to be removed and the ICs had to be taken out each time.
上述した従来のマガジンは、ストッパをはずしＩＣを外
へ取り出さなければ検査等の作業ができず、その出し入
れの作業に相当の時間を要し、製造工程の長期化につな
がり、納期遅れの一つの原因となるという欠点がある。With the conventional magazine described above, inspection and other work cannot be performed unless the stopper is removed and the IC is taken out.It takes a considerable amount of time to put in and take out the IC, leading to a longer manufacturing process and one of the reasons for delivery delays. It has the disadvantage of being a cause.
また、ＩＣをマガジンから出し入れすると、人間の手に
触れやすくなり、ＩＣの外観不良を発生させるという欠
点もある。Another disadvantage is that when an IC is inserted or removed from a magazine, it is easily touched by human hands, resulting in poor appearance of the IC.
本発明の目的は、製造工程でＩＣをマガジンより取り出
すことなく検査等の作業を実施することができ、その結
果製造工程の短縮化を来し、かつ外観不良を発生させる
ことのないマガジンを提供することにある。An object of the present invention is to provide a magazine that allows inspection and other work to be performed during the manufacturing process without taking out the IC from the magazine, thereby shortening the manufacturing process and causing no appearance defects. It's about doing.
本発明のマガジンは、ＩＣをマガジンから出す必要がな
く、マガジンに入れたまま、検査等の作業が出来るよう
にＩＣリードに合わせた穴を有している。The magazine of the present invention has holes that match the IC leads so that it is not necessary to take the IC out of the magazine, and inspection and other work can be performed while the IC remains in the magazine.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例の外観図、第２図は第１図の
断面図である。FIG. 1 is an external view of an embodiment of the present invention, and FIG. 2 is a sectional view of FIG. 1.
第２図に示す様に、マガジン１内のＩＣ２のリード３部
に対する面、本実施例ではリードに側面より接するよう
にマガジンの側面に穴加工４を施す。As shown in FIG. 2, a hole 4 is formed in the side surface of the magazine so that the surface of the IC 2 in the magazine 1 is in contact with the lead 3 portion, in this embodiment, the lead is contacted from the side surface.
尚、穴４とリード３の位置は、ストッパ５の挿入の深さ
を変え調整する。The position of the hole 4 and the lead 3 is adjusted by changing the insertion depth of the stopper 5.
特性試験時には、穴４より接触子６を挿入し、ＩＣ２の
リード３に接続させ測定する。During a characteristic test, the contact 6 is inserted through the hole 4, connected to the lead 3 of the IC 2, and measured.
第３図は本発明の他の実施例の外観図、第４図、第５図
はその断面図である。FIG. 3 is an external view of another embodiment of the present invention, and FIGS. 4 and 5 are sectional views thereof.
第１の実施例と同様、マガジン１内のＩＣ２のリード３
部に対する面、本実施例ではリードの先端方向のマガジ
ンの面に穴４加工を施しておく。As in the first embodiment, lead 3 of IC2 in magazine 1
In this embodiment, a hole 4 is formed on the surface of the magazine in the direction of the tip of the lead.
通常の運搬時は第４図の様にＩＣ２のり−ド３を上方に
向けておくが、特性試験を行なう際には、第５図の様に
逆様にし、穴４より出たＩＣ２のり−ド３に接触子６を
接続させ測定する。この際必要に応じ穴７を穴４の対向
面に設けておき、ブツシャ８等を用い固定させることも
できる。During normal transportation, the IC2 glue board 3 should face upward as shown in Figure 4, but when performing a characteristic test, it should be turned upside down as shown in Figure 5, and the IC2 glue coming out of the hole 4 should be turned upside down as shown in Figure 5. The contactor 6 is connected to the cable 3 and measured. At this time, if necessary, a hole 7 may be provided on the surface opposite the hole 4, and a button 8 or the like may be used for fixation.
この実施例では、精度良く加工された穴４にＩＣ２のり
−ド３が固定されるため、ＩＣ２を固定する際の位置精
度が向上するという利点がある。In this embodiment, since the IC2 board 3 is fixed in the hole 4 machined with high accuracy, there is an advantage that the positional accuracy when fixing the IC2 is improved.
以上説明したように、本発明のマガジンはＩＣリードに
合せた穴を有しているので、ＩＣ製造工程においてマガ
ジンよりＩＣを出さずに検査等の作業ができ、作業時間
が短縮できる効果がある。As explained above, since the magazine of the present invention has holes that match the IC leads, inspection and other work can be done without taking the IC out of the magazine during the IC manufacturing process, which has the effect of shortening the work time. .
更に、製造工程内で人間の手がＩＣに触れることがなく
なり、人的なミスによるＩＣの外観不良等を防止できる
効果がある。Furthermore, human hands do not touch the IC during the manufacturing process, which has the effect of preventing defects in the appearance of the IC due to human error.
第１図は本発明の一実施例の斜視図、第２図は第１図の
断面図、第３図は本発明の他の実施例の斜視図、第４図
は第３図の断面図、第５図は第３図にブツシャを設けた
場合の断面図である。
１・・・マガジン、２・・・ＩＣｌ３・・・ＩＣリード
、４・・・穴、５・・・ストッパ、６・・・接触子、７
・・・ブツシャ用穴、８・・・ブツシャ。Fig. 1 is a perspective view of one embodiment of the present invention, Fig. 2 is a sectional view of Fig. 1, Fig. 3 is a perspective view of another embodiment of the invention, and Fig. 4 is a sectional view of Fig. 3. , FIG. 5 is a cross-sectional view of the case in which a bushing is provided in FIG. 3. 1... Magazine, 2... ICl3... IC lead, 4... Hole, 5... Stopper, 6... Contact, 7
... Hole for buttonhole, 8... buttonhole.
Claims (1)
に合わせた穴を有し、ＩＣの検査等を取り出すことなし
に実施することを可能にしたことを特徴とするマガジン
。A magazine used in an IC manufacturing process, characterized in that it has a hole that matches the IC lead, making it possible to inspect the IC without taking it out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63277841A JPH02122644A (en) | 1988-11-01 | 1988-11-01 | Magazine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63277841A JPH02122644A (en) | 1988-11-01 | 1988-11-01 | Magazine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02122644A true JPH02122644A (en) | 1990-05-10 |
Family
ID=17589011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63277841A Pending JPH02122644A (en) | 1988-11-01 | 1988-11-01 | Magazine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02122644A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007198755A (en) * | 2006-01-23 | 2007-08-09 | Fujitsu Ltd | Semiconductor device, tray for housing the same, and ic tester |
-
1988
- 1988-11-01 JP JP63277841A patent/JPH02122644A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007198755A (en) * | 2006-01-23 | 2007-08-09 | Fujitsu Ltd | Semiconductor device, tray for housing the same, and ic tester |
| JP4579164B2 (en) * | 2006-01-23 | 2010-11-10 | 富士通セミコンダクター株式会社 | Semiconductor device storage tray and IC tester |
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