KR200166710Y1 - Burn-in board of cob type semiconductor chip - Google Patents

Abstract

The present invention relates to a burn-in board having a reel type structure used in a product evaluation process of a COB-type semiconductor chip, wherein the burn-in board of the COB-type semiconductor chip has a length in the first direction. A main board formed relatively longer than the length in the second direction perpendicular to the second direction; The main board has a predetermined elasticity, and is wound in a reel shape by the elasticity, and includes a plurality of socket boards formed on the main board to mount a semiconductor chip. By such an apparatus, it is possible to carry out a burn-in process of a COB type semiconductor chip such as a smart card IC, and to accurately evaluate the product reliability of the COB type semiconductor chip.

Description

Burn-in board of COB type semiconductor chip

The present invention relates to a burn-in board of a COB type semiconductor chip, and more specifically, to a reel type used in a product evaluation process of a COB type semiconductor chip. Reel type burn-in board having a structure.

In the production of semiconductor devices, the burn-in process of semiconductor chips is generally carried out at the stage of product development completion evaluation or product shipment. In either case, the defective state of the semiconductor device is checked in advance. This is done to increase the reliability of the chip.

This burn-in process is performed in a wafer state or in a state where a semiconductor chip is completed, and in the case of a semiconductor chip, a package type semiconductor chip, which is usually finished up to molding, is mounted on a board in an unmolded state. It is divided into COB type semiconductor chip (hereinafter referred to as 'COB type').

However, although burn-in systems for packaged semiconductor devices have been established for a long time, including burn-in boards, systems for burn-in processes of COB type semiconductor chips such as smart card integrated circuits (ICs), etc. It is not built properly.

Therefore, the burn-in process for evaluating a COB type semiconductor chip product has not been sufficiently performed, resulting in a problem that the yield of the product cannot be accurately evaluated.

The present invention proposed to solve the above-mentioned problems, an object of the present invention is to provide a burn-in board of a COB type semiconductor chip having a reel type structure.

1 is a view showing a COB type semiconductor chip mounted on a burn-in board of a COB type semiconductor chip according to an embodiment of the present invention;

2 is a schematic view showing a front structure of a burn-in board of a COB type semiconductor chip according to an embodiment of the present invention;

3 is a schematic view showing a rear structure of a burn-in board of a COB type semiconductor chip according to an embodiment of the present invention;

4 is a view schematically showing the overall structure of a burn-in board of a COB type semiconductor chip according to an embodiment of the present invention.

* Explanation of symbols on the main parts of the drawing

10: main board 20: COB type semiconductor chip

30: socket board 40: through hole

50: wiring 60: cover

(Configuration)

According to a feature of the present invention for achieving the above object, the burn-in board of the COB-type semiconductor chip, the main board formed with a length of the first direction relatively longer than the length of the second direction perpendicular to itself ; The main board has a predetermined elasticity, and is wound in a reel shape by the elasticity, and includes a plurality of socket boards formed on the main board to mount a semiconductor chip.

In a preferred embodiment of this aspect, the plurality of socket boards include: a plurality of through holes formed on each socket board; Among the plurality of through holes, through holes to which the same voltage is applied include patterned wires to be electrically connected to each other.

In a preferred embodiment of this aspect, the burn-in board of the COB type semiconductor chip may include a cover formed on the main board so that the semiconductor chip mounted on the socket board during the burn-in process is removed from the socket board. Prevent deviations.

(Action)

By such a device, the burn-in process of a COB type semiconductor chip, such as a smart card IC, can be performed, and the product yield of a COB type semiconductor chip can be evaluated correctly.

(Example)

Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 1 to 4.

Referring to FIG. 3, a burn-in board of a COB type semiconductor chip according to a preferred embodiment of the present invention includes a main board having a length in a first direction relatively longer than a length in a second direction perpendicular to itself; The main board has a predetermined elasticity, and is wound in a reel shape by the elasticity, and includes a plurality of socket boards formed on the main board to mount a semiconductor chip. By such a device, it is possible to carry out a burn-in process of a COB type semiconductor chip such as a smart card IC and the like, and to accurately evaluate the product yield of the COB type semiconductor chip.

1 to 4, the same reference numerals are denoted with respect to the components that perform the same function among the components of the burn-in board of the COB type semiconductor chip according to the embodiment of the present invention.

1 schematically illustrates a state in which a COB type semiconductor chip is mounted on a burn-in board of a COB type semiconductor chip according to an embodiment of the present invention.

In Fig. 1, reference numeral 10 denotes a main board for burn-in of a COB type semiconductor chip formed of a material having a predetermined elasticity and wound to a reel by the elasticity, and reference numeral 20 denotes the burn-in process. It represents a COB type semiconductor chip mounted on the main board 10 to test the state of the product through.

2 and 3 show the structure of the front and rear of the burn-in board of the COB type semiconductor chip according to the present invention, respectively.

2 and 3, the burn-in board of the COB type semiconductor chip according to the present invention includes a main board 10 and a plurality of socket boards 30 formed on the main board 10. It has a configuration. At this time, the socket board 30 may be formed in a plurality of rows according to the width of the main board 10 is formed, in the present invention is shown in the drawing arranged in two rows.

In addition, a plurality of through holes 40 are formed on the socket board 30 so that the semiconductor chip 20 is mounted on the socket board 30 so as to be contacted. As shown, patterned wirings are formed such that through holes to which the same voltage is applied among the plurality of through holes 40 are electrically connected to each other.

In addition, the main board 10 is formed in a reel shape to have a predetermined elasticity as shown by reference numeral 10 in FIG. 4, and a socket board 30 is formed on the main board 10.

In addition, a cover 60 is formed on the socket board 30. When the COB type semiconductor chip 20 is mounted on the socket board 30 to perform a burn-in process, the socket board 30 is formed. ) To prevent the COB type semiconductor chip 20 from being separated.

By the burn-in board of the COB type semiconductor chip as described above, the burn-in process of the COB type semiconductor chip such as smart card IC can be performed, and the product yield of the COB type semiconductor chip can be accurately evaluated.

Claims (3)

In the burn-in board of the COB type semiconductor chip, A main board 10 having a length in a first direction relatively longer than a length in a second direction perpendicular to the second direction; The main board 10 has a predetermined elasticity, and is wound in a reel shape by this elasticity, Burn-in board of the COB type semiconductor chip, characterized in that it comprises a plurality of socket boards (30) formed on the main board (10) in the first direction to mount the semiconductor chip. The method of claim 1, The plurality of socket boards 30 includes a plurality of through holes 40 formed on each socket board 30; The through-hole of the plurality of through holes (40) to which the same voltage is applied includes a wiring (50) patterned to be electrically connected to each other. The method of claim 1, In the burn-in board of the COB type semiconductor chip, a cover 60 formed on the main board 10 is added to the semiconductor board mounted on the socket board 30 during the burn-in process so that the socket board ( 30. A burn-in board of a COB type semiconductor chip, characterized in that the separation is prevented from being separated.