JPH0286170U - - Google Patents
Info
- Publication number
- JPH0286170U JPH0286170U JP16607088U JP16607088U JPH0286170U JP H0286170 U JPH0286170 U JP H0286170U JP 16607088 U JP16607088 U JP 16607088U JP 16607088 U JP16607088 U JP 16607088U JP H0286170 U JPH0286170 U JP H0286170U
- Authority
- JP
- Japan
- Prior art keywords
- printed
- conductive path
- space
- parts
- intermittent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Coils Or Transformers For Communication (AREA)
- Telephone Set Structure (AREA)
Description
第１図は本考案の無線電話機のプリント基板の
平面図、第２図、第３図は本考案の無線電話機の
プリント基板の断面図である。
主な図番の説明、１…絶縁基板、２…パターン
コイル、３…間欠部、４…空間部、５…絶縁膜、
６…半田。
FIG. 1 is a plan view of the printed circuit board of the wireless telephone according to the present invention, and FIGS. 2 and 3 are cross-sectional views of the printed circuit board of the wireless telephone according to the present invention. Explanation of main drawing numbers, 1... Insulating substrate, 2... Pattern coil, 3... Intermittent part, 4... Space part, 5... Insulating film,
6...Solder.
Claims (1)
同一回路構成とし、印刷配線した無線電話機のプ
リント基板において、前記送受信回路で用いるコ
イルを該プリント基板上の導電膜にエツチングし
、間欠部を挾んで折曲形成した導電路と、該導電
路及び間欠部上の複数個所に形成する空間部を残
して、前記導電路を被覆した絶縁膜と、前記空間
部に選択的に充填される絶縁部材とで形成させ、
回路部品の半田付けの時、前記絶縁部材が充填さ
れた空間部以外の空間部を介して複数個所の導電
路と間欠部とを半田にて短絡させるようにしたこ
とを特徴とする無線電話機のプリント基板。 At least a part of the transmitting and receiving circuits of the base unit and slave unit have the same circuit configuration and are printed on a printed circuit board of a radio telephone, and the coil used in the transmitting and receiving circuit is etched into the conductive film on the printed circuit board to eliminate the intermittent parts. A conductive path formed by sandwiching and bending, an insulating film covering the conductive path leaving a plurality of spaces formed on the conductive path and the intermittent portion, and an insulation selectively filling the space. formed with parts,
When soldering circuit components, a plurality of conductive paths and intermittent parts are short-circuited with solder through a space other than the space filled with the insulating member. Printed board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16607088U JPH0517906Y2 (en) | 1988-12-22 | 1988-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16607088U JPH0517906Y2 (en) | 1988-12-22 | 1988-12-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0286170U true JPH0286170U (en) | 1990-07-09 |
| JPH0517906Y2 JPH0517906Y2 (en) | 1993-05-13 |
Family
ID=31453128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16607088U Expired - Lifetime JPH0517906Y2 (en) | 1988-12-22 | 1988-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0517906Y2 (en) |
-
1988
- 1988-12-22 JP JP16607088U patent/JPH0517906Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0517906Y2 (en) | 1993-05-13 |
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