JPH0284340U - - Google Patents
Info
- Publication number
- JPH0284340U JPH0284340U JP16474688U JP16474688U JPH0284340U JP H0284340 U JPH0284340 U JP H0284340U JP 16474688 U JP16474688 U JP 16474688U JP 16474688 U JP16474688 U JP 16474688U JP H0284340 U JPH0284340 U JP H0284340U
- Authority
- JP
- Japan
- Prior art keywords
- ground layer
- input
- pin
- ground
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims 1
- 230000002265 prevention Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は本考案の一実施例による半導体パツケ
ージを示す破断斜視図、第２図は本実施例による
ノイズ防止部材を示す破断斜視図、第３図は従来
の半導体パツケージを示す斜視図、第４図は課題
を説明する回路図である。
図において、１はパツケージ、２は入出力ピン
、１１はノイズ防止部材、１１―１は絶縁板、１
１―２ａ，１１―２ｂはアースパターン、１１―
３はスリツト、を示す。
1 is a cutaway perspective view showing a semiconductor package according to an embodiment of the present invention, FIG. 2 is a cutaway perspective view showing a noise prevention member according to the present embodiment, and FIG. 3 is a perspective view showing a conventional semiconductor package. Figure 4 is a circuit diagram explaining the problem. In the figure, 1 is a package, 2 is an input/output pin, 11 is a noise prevention member, 11-1 is an insulating plate, 1
1-2a, 11-2b are ground patterns, 11-
3 indicates a slit.
Claims (1)
させて一定ピツチで配列した隣接する各入出力ピ
ン２間に、絶縁体１１―１を介してアース層１１
―２を該入出力ピン２と平行に配して、該アース
層１１―２とアースピンを導通するように構成し
てなることを特徴とする半導体パツケージ。 A ground layer 11 is connected via an insulator 11-1 between adjacent input/output pins 2 that protrude from the package 1 in which a semiconductor chip is installed and are arranged at a constant pitch.
-2 is arranged parallel to the input/output pin 2, and the ground layer 11-2 is electrically connected to the ground pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16474688U JPH0284340U (en) | 1988-12-19 | 1988-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16474688U JPH0284340U (en) | 1988-12-19 | 1988-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0284340U true JPH0284340U (en) | 1990-06-29 |
Family
ID=31450612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16474688U Pending JPH0284340U (en) | 1988-12-19 | 1988-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0284340U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010153579A (en) * | 2008-12-25 | 2010-07-08 | Denso Corp | Lead frame |
-
1988
- 1988-12-19 JP JP16474688U patent/JPH0284340U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010153579A (en) * | 2008-12-25 | 2010-07-08 | Denso Corp | Lead frame |
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