JPH0282035U - - Google Patents
Info
- Publication number
- JPH0282035U JPH0282035U JP1988161424U JP16142488U JPH0282035U JP H0282035 U JPH0282035 U JP H0282035U JP 1988161424 U JP1988161424 U JP 1988161424U JP 16142488 U JP16142488 U JP 16142488U JP H0282035 U JPH0282035 U JP H0282035U
- Authority
- JP
- Japan
- Prior art keywords
- conductor film
- thick
- semiconductor chip
- circuit board
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/734—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988161424U JPH0282035U (enExample) | 1988-12-13 | 1988-12-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988161424U JPH0282035U (enExample) | 1988-12-13 | 1988-12-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0282035U true JPH0282035U (enExample) | 1990-06-25 |
Family
ID=31444347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988161424U Pending JPH0282035U (enExample) | 1988-12-13 | 1988-12-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0282035U (enExample) |
-
1988
- 1988-12-13 JP JP1988161424U patent/JPH0282035U/ja active Pending