JPH028171U - - Google Patents

Info

Publication number
JPH028171U
JPH028171U JP8452688U JP8452688U JPH028171U JP H028171 U JPH028171 U JP H028171U JP 8452688 U JP8452688 U JP 8452688U JP 8452688 U JP8452688 U JP 8452688U JP H028171 U JPH028171 U JP H028171U
Authority
JP
Japan
Prior art keywords
solder mask
wiring board
printed wiring
heat reflective
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8452688U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8452688U priority Critical patent/JPH028171U/ja
Publication of JPH028171U publication Critical patent/JPH028171U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacture Of Switches (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図及び第2図は本考案の印刷配線板のソル
ダーマスク構造に係る一実施例を示すもので、第
1図は一部切欠き平面図、第2図は断面図、第3
図及び第4図は従来例を示すものであり、第3図
は一部切欠き平面図、第4図は断面図である。 1……印刷配線板、2……部品ホール、3……
接点部、4……ソルダーマスク、5……熱反射マ
スク。
1 and 2 show an embodiment of the solder mask structure of a printed wiring board according to the present invention, in which FIG. 1 is a partially cutaway plan view, FIG.
3 and 4 show a conventional example, with FIG. 3 being a partially cutaway plan view and FIG. 4 being a sectional view. 1...Printed wiring board, 2...Parts hole, 3...
Contact portion, 4...Solder mask, 5...Heat reflective mask.

Claims (1)

【実用新案登録請求の範囲】 部品取付け用の部品ホール及び部品との接点と
なる接点部を有する印刷配線板上に、上記部品ホ
ール及び上記接点部をマスクする剥離性のソルダ
ーマスクを一体に被着形成した印刷配線板のソル
ダーマスク構造において、 上記部品ホール及び上記接点部における上記ソ
ルダーマスク上に、熱反射性を有する熱反射マス
クを一体に被着形成したことを特徴とする印刷配
線板のソルダーマスク構造。
[Scope of Claim for Utility Model Registration] A printed wiring board having component holes for mounting components and contact portions that make contact with the components is integrally covered with a removable solder mask that masks the component holes and the contact portions. In the solder mask structure of the printed wiring board, a heat reflective mask having heat reflective properties is integrally formed on the solder mask in the component hole and the contact area. Solder mask structure.
JP8452688U 1988-06-28 1988-06-28 Pending JPH028171U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8452688U JPH028171U (en) 1988-06-28 1988-06-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8452688U JPH028171U (en) 1988-06-28 1988-06-28

Publications (1)

Publication Number Publication Date
JPH028171U true JPH028171U (en) 1990-01-19

Family

ID=31309210

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8452688U Pending JPH028171U (en) 1988-06-28 1988-06-28

Country Status (1)

Country Link
JP (1) JPH028171U (en)

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