JPH028037U - - Google Patents
Info
- Publication number
- JPH028037U JPH028037U JP8359788U JP8359788U JPH028037U JP H028037 U JPH028037 U JP H028037U JP 8359788 U JP8359788 U JP 8359788U JP 8359788 U JP8359788 U JP 8359788U JP H028037 U JPH028037 U JP H028037U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- needles
- probe card
- testing
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 4
- 239000000523 sample Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
Description
第１図はこの考案の実施例によるプローブカー
ドの測定針が半導体ウエハに接触する状況を示す
断面図であり、第２図は従来のプローブカードの
測定針が半導体ウエハに接触する状況を示す断面
図である。
１，１１……半導体ウエハ、２……金属パツド
、１２……センサ用金属パツド、Ａ，Ｂ，Ｘ，Ｙ
……センサ針、Ｃ……測定針。
FIG. 1 is a cross-sectional view showing a situation in which the measuring needle of a probe card according to an embodiment of this invention contacts a semiconductor wafer, and FIG. 2 is a cross-sectional view showing a situation in which a measuring needle of a conventional probe card contacts a semiconductor wafer. It is a diagram. 1, 11...Semiconductor wafer, 2...Metal pad, 12...Metal pad for sensor, A, B, X, Y
...Sensor needle, C...Measuring needle.
Claims (1)
触する複数の測定針を備え、これらの測定針を介
して前記半導体ウエハを試験するプローブカード
において、先端が前記測定針と同一高さにあり、
前記半導体ウエハに設けた１つのセンサ用金属パ
ツドにそれぞれが接触する一対のセンサ針を設け
たことを特徴とする半導体ウエハ試験用のプロー
ブカード。 A probe card comprising a plurality of measuring needles electrically contacting metal pads on the surface of a semiconductor wafer and testing the semiconductor wafer through these measuring needles, the tip of which is at the same height as the measuring needles,
A probe card for testing a semiconductor wafer, characterized in that a pair of sensor needles are provided, each of which contacts one metal pad for a sensor provided on the semiconductor wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8359788U JPH028037U (en) | 1988-06-24 | 1988-06-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8359788U JPH028037U (en) | 1988-06-24 | 1988-06-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028037U true JPH028037U (en) | 1990-01-18 |
Family
ID=31308310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8359788U Pending JPH028037U (en) | 1988-06-24 | 1988-06-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028037U (en) |
-
1988
- 1988-06-24 JP JP8359788U patent/JPH028037U/ja active Pending
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