JPS63195276U - - Google Patents

Info

Publication number
JPS63195276U
JPS63195276U JP8700687U JP8700687U JPS63195276U JP S63195276 U JPS63195276 U JP S63195276U JP 8700687 U JP8700687 U JP 8700687U JP 8700687 U JP8700687 U JP 8700687U JP S63195276 U JPS63195276 U JP S63195276U
Authority
JP
Japan
Prior art keywords
socket
contacts
lead
semiconductor device
shot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8700687U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8700687U priority Critical patent/JPS63195276U/ja
Publication of JPS63195276U publication Critical patent/JPS63195276U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例であり、aは斜視図
、bは同実施例の断面図である。第2図は従来の
半導体装置用ソケツトの図で、aは斜視図、bは
部分断面図である。 1……ソケツト本体、2……コンタクトピン、
3,9……接触子、4……Dip型IC、5……
リード、6……測定ピン、7……半田、8……プ
ロープ。
FIG. 1 shows an embodiment of the present invention, in which a is a perspective view and b is a sectional view of the same embodiment. FIG. 2 is a diagram of a conventional socket for a semiconductor device, in which a is a perspective view and b is a partial sectional view. 1...Socket body, 2...Contact pin,
3, 9... Contact, 4... Dip type IC, 5...
Lead, 6...Measuring pin, 7...Solder, 8...Probe.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ソケツト本体に設けられた接触子に半導体装置
のリードを前記接触子の溝に差し込んで、特性測
定するソケツトにおいて、第一、第二の接触子が
設けられ、前記第一、第二の接触子は電気的にシ
ヨートされていることを特徴とするICソケツト
In a socket whose characteristics are measured by inserting a lead of a semiconductor device into a groove of a contact provided in a socket body, first and second contacts are provided, and the first and second contacts are connected to each other. An IC socket characterized by being electrically shot.
JP8700687U 1987-06-03 1987-06-03 Pending JPS63195276U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8700687U JPS63195276U (en) 1987-06-03 1987-06-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8700687U JPS63195276U (en) 1987-06-03 1987-06-03

Publications (1)

Publication Number Publication Date
JPS63195276U true JPS63195276U (en) 1988-12-15

Family

ID=30943834

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8700687U Pending JPS63195276U (en) 1987-06-03 1987-06-03

Country Status (1)

Country Link
JP (1) JPS63195276U (en)

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